An apparatus includes a conduit with two process fluid inlets at one end of the conduit, one process fluid outlet at an opposing end, a heat exchange medium inlet, and a heat exchange medium outlet. One of the fluid inlets includes a tube extending into the conduit and a perforated node at the end of the tube, and the other of the fluid inlets is arranged up stream of the perforated node. The apparatus further includes hollow tubes positioned longitudinally within the conduit between the two process fluid inlets, the process fluid outlet, the heat exchange medium inlet and the heat exchange medium outlet. In addition, the apparatus includes a collection vessel positioned proximate the fluid outlet and fibers extending through each of the hollow tubes, wherein one end of the fibers is secured to the perforated node and the other end of the fibers extends into the collection vessel.

Embodiments of the present disclosure generally relate to processes for forming epoxy resin compositions and processes for separating substrates from complex mixtures. In an embodiment, a process for making an epoxy resin composition is provided and includes: reacting a mixture comprising a substrate, an epihalohydrin, and a catalyst to form a first composition comprising a halohydrin reaction product; introducing an alkaline reagent with the first composition to form a second composition comprising an epoxy resin product; introducing a liquid epoxy resin with the second composition to form a resin mixture; and removing unreacted epihalohydrin from the resin mixture to form the epoxy resin composition. In another embodiment, a process for separating a substrate from a substrate source is provided and includes: introducing an epihalohydrin with the substrate source comprising the substrate, the substrate comprising at least one hydroxyl group, and separating the epihalohydrin and the substrate from the substrate source.

Embodiments of the present disclosure generally relate to processes for forming epoxy resin compositions and processes for separating substrates from complex mixtures. In an embodiment, a process for making an epoxy resin composition is provided and includes: reacting a mixture comprising a substrate, an epihalohydrin, and a catalyst to form a first composition comprising a halohydrin reaction product; introducing an alkaline reagent with the first composition to form a second composition comprising an epoxy resin product; introducing a liquid epoxy resin with the second composition to form a resin mixture; and removing unreacted epihalohydrin from the resin mixture to form the epoxy resin composition. In another embodiment, a process for separating a substrate from a substrate source is provided and includes: introducing an epihalohydrin with the substrate source comprising the substrate, the substrate comprising at least one hydroxyl group, and separating the epihalohydrin and the substrate from the substrate source.

Embodiments of the present disclosure generally relate to processes for forming bisphenols and epoxy resin compositions. In an embodiment, a process for making an epoxy resin composition is provided. The process includes reacting a mixture comprising a catalyst, a monophenol, and an aldehyde or ketone, the mixture comprising a stoichiometric excess of the aldehyde or ketone to the monophenol, and forming a reaction product with the reaction mixture, the reaction product comprising a bisphenol. The process further includes removing water and unreacted aldehyde or ketone from the reaction product, and converting the reaction product comprising the bisphenol to an epoxy resin composition, wherein, after reacting the mixture and before converting the reaction product, the process is free of washing, drying, solid-liquid separation, or combinations thereof.

Thermally reworkable epoxy resins prepared through a Diels-Alder reaction are described herein. A maleimide component is reacted with an electron donating component having a furan ring attached to an epoxy ether to produce the epoxy resins. The epoxy component generated by this method can be cured with different diamines lo form a robust network of epoxy material. The robust epoxy material is used as a reversible thermoset and as an adhesive. The robust epoxy network is heated at 90 C. temperature in a retro Diels-Alder fashion to produce colorless starting materials of the maleimide component and the furan component.

Coating compositions for coating fluid handling components, and related methods, may include in some aspects a coating composition having a trifunctional silane, a silanol, and a filler. The coating composition may be applied to a surface of a fluid handling component that is configured to be exposed to a fluid. The coating composition may be applied to at least partially cover or coat the surface. The coating composition may be configured to chemically bond with a cured primer composition that includes an epoxy.

A method for a synthesis of a polymer containing multiple epoxy groups includes steps of: under protection of nitrogen or argon, with a photosensitive free radical initiator under an ultraviolet light irradiation, initiating a mixture of a dithiol compound and alkynyl glycidyl ether or other alkynyl-containing compounds to proceed a thiol-yne polymerization, so as to obtain the polymer. The number of the epoxy groups is able to be adjusted through changing a type of a dithiol monomer, a mixing ratio of the dithiol monomer, and a mixing ratio between the alkynyl glycidyl ether and other alkynyl compounds. The present invention has advantages of: fast reaction, convenient process, easy post-processing, a large number of the epoxy groups, and adjustable and controllable content. The obtained polymer has a wide potential application in fields of coating, adhesive, ink, encapsulating material, resin for composite material, additive, high performance material, function material, and so on.

Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 m-100 m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

The present disclosure relates to materials for photoinitiated cationic ring-opening polymerization (ROP). The present disclosure also relates to uses of the materials, e.g., in 3D printing.

Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 m-100 m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.