Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.

Provided is an epoxy resin composition including the following component [A]: a tri- or more functional binaphthalene epoxy resin represented by the following general formula (A-1) and component [B]: an aromatic amine compound, in which the glass transition temperature of a cured product, which is obtained by curing the epoxy resin composition at 180 C. for 2 hours, after immersing in boiling water at 1 atm for 48 hours is 180 C. or more. An epoxy resin composition and a prepreg which can form a fiber-reinforced composite material excellent in heat resistance under high humidity are provided.

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Provided is an epoxy resin composition including the following component [A]: a tri- or more functional binaphthalene epoxy resin represented by the following general formula (A-1) and component [B]: an aromatic amine compound, in which the glass transition temperature of a cured product, which is obtained by curing the epoxy resin composition at 180 C. for 2 hours, after immersing in boiling water at 1 atm for 48 hours is 180 C. or more. An epoxy resin composition and a prepreg which can form a fiber-reinforced composite material excellent in heat resistance under high humidity are provided.

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An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.

Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.

An organosiloxane represented by the following general formula; a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) an adhesion promoter containing the organosiloxane; and (D) a catalyst for hydrosilylation reaction; and a semiconductor device in which a semiconductor element is encapsulated with a cured product of the composition. A novel organosiloxane, a curable silicone composition that contains the novel organosiloxane as an adhesion promoter and that forms a cured product having excellent adhesion to various base materials, and a semiconductor device that is formed by using the composition and that has excellent reliability are provided.

Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.

Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.

Provided are: an epoxy resin composition which enables the production of a carbon-fiber-reinforced composite material having excellent tensile strength and compressive strength and suitable as a material for structures; a prepreg; and a carbon-fiber-reinforced composite material. An epoxy resin composition characterized by comprising at least [A] an epoxy resin having a structure represented by formula (1), [B] an epoxy resin having at least one amine-type glycidyl group or at least one ether-type glycidyl group and having a liquid form at 40 C. and [C] a curing agent; and a prepreg and a carbon-fiber-reinforced composite material, each produced using the epoxy resin composition. ##STR00001##
(In the formula, R.sub.1 to R.sub.4 independently represent at least one atom or group selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 4 or less carbon atoms, and a halogen atom.)