The present invention refers to a composition, a low halogen and fast curing conductive adhesive and its preparation method. The composition includes the following raw materials measured by weight: epoxy resin 5-15 parts, curing agent 0.5-3 parts, acrylic acid component 5-12 parts, initiator 0.5-2 parts, flexibilizer 2-5 parts, wetting dispersant 0.1-1 parts, coupling agent 0.1-1 parts, antioxidant 0.1-1 parts, defoamer 0.1-1 parts and conductive silver filler 75-85 parts. The low halogen and fast curing conductive adhesive of the present invention has the advantages of fast curing (within 10 min), low halogen content, high bond strength, good moisture-heat aging resistance, good electric conductivity and thermal conductivity and so on, and has wide application prospects in the field of microelectronic packaging.

The present invention relates to a process for the manufacture of an epoxy-functional polyester. The process according to the invention comprises the steps of a) providing a polyester having functional groups selected from hydroxyl groups and carboxylic acid groups, or mixtures thereof, b) reacting the functional groups of the polyester with an epihaloalkane to obtain an epoxy-functional polyester dissolved in a liquid phase, c) optionally adding an organic solvent to the liquid phase obtained in step b); d) precipitating the epoxy-functional polyester from the liquid phase obtained in step b) or in step c); and e) isolating the precipitated epoxy-functional polyester from the liquid phase by a solid-liquid separation technique. The thus obtained resin is in particular useful for use in powder coatings. The invention further relates to a solid epoxy-functional polyester obtainable by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester.

The present invention relates to a process for the manufacture of an epoxy-functional polyester. The process according to the invention comprises the steps of a) providing a polyester having functional groups selected from hydroxyl groups and carboxylic acid groups, or mixtures thereof, b) reacting the functional groups of the polyester with an epihaloalkane to obtain an epoxy-functional polyester dissolved in a liquid phase, c) optionally adding an organic solvent to the liquid phase obtained in step b); d) precipitating the epoxy-functional polyester from the liquid phase obtained in step b) or in step c); and e) isolating the precipitated epoxy-functional polyester from the liquid phase by a solid-liquid separation technique. The thus obtained resin is in particular useful for use in powder coatings. The invention further relates to a solid epoxy-functional polyester obtainable by such process and to a coating composition, in particular a powder coating composition, comprising such solid epoxy-functional polyester.

An adhesive composition, including: a reaction product (A) among a bifunctional epoxy resin represented by the formula (2), a tri- or more functional epoxy resin represented by the formula (3), and a saturated acid anhydride represented by the following general formula (4); a UV-sensitive reaction initiator (B); and a dilution solvent (C), wherein the component (A) is a compound represented by the formula (1), a ratio of a total mole of epoxy groups in the multi-functional epoxy resin to a mole of the saturated acid anhydride is 1.30 to 3.00, and a mole of the bifunctional epoxy resin relative to a total mole of the multi-functional epoxy resin is 0.001 to 0.15. This provides a highly reliable epoxy-resin-based adhesive composition and film-shaped sealing material having a low viscosity, curability at low temperature, and high adhesiveness, and retaining power generation performance of a perovskite solar cell before and after sealing.

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A resin film with at least 50 wt % of at least one polymerisable vinyl ester prepolymer having at least two carbon-carbon unsaturated functional groups and a curing system, the prepolymer in a concentration of at least 10 wt %, based on the weight of the polymerisable resin, and has the structure R1.sub.n-R2-R1.sub.m, wherein R1 and R1 are the same or different, n and m are each at least one and may be the same or different, and each of R1 and R1 includes a carbon-carbon unsaturation at a free end thereof remote from R2, and includes a residue of an epoxy resin, and wherein R2 is a polyfunctional chain extending linker between R1 and R1, and is derived from a polyfunctional carboxylic acid having the structure R-Fn.sub.x, where Fn is a carboxylic acid functional group, x is at least 2, and R comprises an organic moiety having aliphatic, araliphatic, cycloaliphatic, heterocyclic and/or aromatic groups, containing any type and/or combination of saturated, unsaturated and/or aromatic carbon bonds, and wherein R may be unsubstituted or substituted by functional groups and/or heteroatoms.

A resin film with at least 50 wt % of at least one polymerisable vinyl ester prepolymer having at least two carbon-carbon unsaturated functional groups and a curing system, the prepolymer in a concentration of at least 10 wt %, based on the weight of the polymerisable resin, and has the structure R1.sub.n-R2-R1.sub.m, wherein R1 and R1 are the same or different, n and m are each at least one and may be the same or different, and each of R1 and R1 includes a carbon-carbon unsaturation at a free end thereof remote from R2, and includes a residue of an epoxy resin, and wherein R2 is a polyfunctional chain extending linker between R1 and R1, and is derived from a polyfunctional carboxylic acid having the structure R-Fn.sub.x, where Fn is a carboxylic acid functional group, x is at least 2, and R comprises an organic moiety having aliphatic, araliphatic, cycloaliphatic, heterocyclic and/or aromatic groups, containing any type and/or combination of saturated, unsaturated and/or aromatic carbon bonds, and wherein R may be unsubstituted or substituted by functional groups and/or heteroatoms.

The present invention provides a composition for forming a resist underlayer film with which a desired resist pattern can be formed, a method for manufacturing a resist pattern wherein said resist underlayer film-forming composition is used, and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition includes a polymer that supports an acid compound at a terminal end thereof, and a solvent. The acid compound may be ionically bonded to a base that is present at the terminal end of the polymer. Said terminal end may be represented by formula (1) (in the formula, A1 represents an acid compound, B represents a basic structure, and * represents a section of bonding with a polymer moiety).

The present invention provides a composition for forming a resist underlayer film with which a desired resist pattern can be formed, a method for manufacturing a resist pattern wherein said resist underlayer film-forming composition is used, and a method for manufacturing a semiconductor device. The resist underlayer film-forming composition includes a polymer that supports an acid compound at a terminal end thereof, and a solvent. The acid compound may be ionically bonded to a base that is present at the terminal end of the polymer. Said terminal end may be represented by formula (1) (in the formula, A1 represents an acid compound, B represents a basic structure, and * represents a section of bonding with a polymer moiety).

Embodiments of this invention are directed to bio-based epoxy compositions. and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives. or composites.

Embodiments of this invention are directed to bio-based epoxy compositions. and method of their preparation and use. Other embodiments are directed to cured bio-based epoxies, and manufactured articles having bio-based epoxy coatings, adhesives. or composites.