A novel method to prepare crosslinked thin films without the use of catalysts is disclosed. Propiolic acid is grafted to a glycidyl or epoxy group using a phosphonium catalyst under mild conditions to yield a propiolate ester. The propiolate ester is thermally crosslinkable (and the polymer film rendered insoluble) at temperatures as low as 120 C., and some embodiments may undergo photoinduced crosslinking upon exposure to DUV light. The resulting crosslinked films are equivalent or better in stability to acid-catalyzed epoxide crosslinked films and can be used for a multitude of different applications.

Disclosed are an organic dibasic acid modified epoxy acrylate prepolymer and a photo-thermal dual-curing conductive adhesive prepared from the modified epoxy acrylate prepolymer. The modified epoxy acrylate prepolymer is prepared in parts by mass from 45 to 72 parts of epoxy resin, 12 to 20 parts of 1,4-butanediol diglycidyl ether, 7 to 26 parts of organic dibasic acid, 5 to 15 parts of acrylic acid, and 0.26 to 0.45 parts of a polymerization inhibitor under the catalysis of 0.13 to 0.28 parts of a catalyst. A general structural formula of the organic dibasic acid is HOOCRCOOH. The prepared modified epoxy acrylate prepolymer has an epoxy group content of 3% to 9%, a hydroxyl content of 3% to 10% and a vinyl content of 2% to 8%.

There are provided a compound which, while being a curable resin, can easily exhibit easy dismantlability, repairability, and remoldability when being in the form of a cured product, a curable resin composition obtained using the same; and a cured product thereof. Specifically, there is used a glycidyl ether group-containing compound in which a structural unit A having one or more glycidyl ether groups and a structural unit B different from the structural unit A are linked in A-B-A, the structural unit A contains a maleimide structure and the structural unit B contains a furan structure, and the structural unit A and the structural unit B are bonded by a reversible bond formed by a Diels-Alder reaction.

There is provided a compound which, while being a curable resin, can easily exhibit repairability, easy disassembly, and remoldability when being in the form of a cured product, a curable resin composition obtained using the same; and a cured product thereof. Specifically, there is provided a phenolic hydroxyl group-containing compound in which a structural unit A having one or more phenolic hydroxyl groups and a structural unit B different from the A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond by a Diels-Alder reaction between a furan structure and a maleimide structure.

A plugging material is prepared from the following raw materials in terms of mass fractions, which include: 1 to 3.6 parts of PETA-modified bisphenol A epoxy resin, 1.5 to 2.4 parts of addition product of m-phenylenediamine and methacrylic acid, 0.12 to 0.17 parts of nanosilica dispersion liquid, with the remainder being water, such that the sum of the mass fractions of the aforementioned raw materials totals 100 parts. The preparation method includes: pouring a water phase mixture into a continuously stirred oil-phase mixture to form a gel-forming liquid through continued stirring; transferring the gel-forming liquid to be mixed with dibenzoyl peroxide, and stirring and reacting at a temperature of 50 C. to 120 C. to obtain the plugging material. The plugging material is resistant to high temperatures and high salinity, and exhibits strong plugging performance.