A thermally or photo curable adhesive composition containing a bisphenol F epoxy resin and a bisphenol A epoxy resin in a ratio between 2 and 10. The composition further contains at least one epoxy acrylate component and a rubber modified bisphenol. The adhesive composition is applicable by a melt or liquid coating technique and undergoes curing upon exposure to heat or radiation, showing improved viscoelastic properties and suitable to provide a cured product having superior durability.

An adhesive composition comprising an aromatic epoxy resin, an epoxy resin rubber adduct, an amine curing agent; and optionally one or more of an oil absorbent, a corrosion inhibitor and a urone accelerator, wherein the adhesive composition is curable at 150 C. in no more than 210 seconds.

The invention relates to an adhesive composition having an added component of rubber-epoxy such as XNBR-epoxy adducts. It was found that the new adhesive composition significantly reduces meander formation in the making of automotive parts.

A resist underlayer film-forming composition in which a coating film having high flattening properties is formed on a substrate. A resist underlayer film-forming composition including an epoxy adduct (C) obtained by reacting an epoxy group-containing compound (A) with an epoxy adduct-forming compound (B), wherein one or both of the epoxy group-containing compound (A) and the epoxy adduct-forming compound (B) contain an optionally branched alkyl group having a carbon atom number of three or more. The epoxy adduct-forming compound (B) is at least one compound selected from the group consisting of carboxylic acid (B1), carboxylic anhydride (B2), a phenol compound (B3), a hydroxyl group-containing compound (B4), a thiol compound (B5), an amino compound (B6), and an imide compound (B7). The optionally branched alkyl group having a carbon atom number of three or more is contained in the epoxy adduct-forming compound (B). The optionally branched alkyl group has a C.sub.3-19 alkyl group.

A material comprising an epoxy/elastomer adduct, a polymeric particle, from about 0.05 to about 20 weight percent of an epoxy/diacid adduct, and optionally, an amine reaction product.

The present disclosure relates to a curing agent component for a curable resin which includes a multifunctional polyamide obtained from the reaction of a polyamine and a polycarboxylic acid. The curing agent component may be used as part of a two component curable system for the curing of curable resins including epoxy resins.

The present invention relates to a catalyst composition for curing epoxy group containing compounds comprising a base and a quaternary ammonium salt, of Formula (I):

##STR00001##

with R.sup.1, R.sup.2, R.sub.3, R.sup.4, R.sup.5, Y, A and X being as defined herein. Also encompassed are adhesive compositions containing said catalyst composition and the use of the catalyst composition.

Curable compositions include a non-aromatic epoxy-functional epoxy resin adduct, a non-aromatic epoxy resin, and a non-aromatic anhydride-based curing agent. The epoxy resin adduct is the reaction product of a reaction mixture including a polyfunctional thiol and a poly functional epoxy resin. The cured composition has an Izod Impact Test (Notched Izod) test method (ASTM D256) value of at least 40 J/m and is color stable such that upon exposure to an acid bath in accordance with the Acid Bath Test Method, exhibits a E 94 color change of less than 1.

Coating compositions can be prepared from a polyether resin, wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin has a molecular weight greater than about 500, and wherein the smallest difunctional hydroxyl phenyl segment used to form the polyether resin does not comprise two or more non-impaired hydroxyl groups attached to two or more different five-membered or six-membered carbon atom rings in a segment having a molecular weight less than about 500. The polyether resin can be prepared by reacting a dihydroxyl compound and/or a diamine compound with a phenol stearic acid compound to produce a diphenol, and reacting the diphenol with a diglycidyl ether compound to form the polyether resin.

There is provided a compound which, while being a curable resin, can easily exhibit repairability and remoldability when being in the form of a cured product, a curable resin composition obtained using the same, and a cured product thereof. A glycidyl ether group-containing compound is used, in which a structural unit A having one or more glycidyl ether groups and a structural unit B different from the structural unit A are linked in A-B-A, and the structural unit A and the structural unit B are bonded by a reversible bond having a dissociation temperature of 120 C. or higher. This reversible bond is preferably an anthracene-type addition-type structure formed by a Diels-Alder reaction or a disulfide bond sandwiched between aromatic rings.