Particles of encapsulated first epoxy resin (microcapsules) comprise: a) a core of first epoxy resin, within b) a shell comprising an organic polymer, and c) a layer of oil-in-water Pickering emulsifier particles borne on an outer surface of the shell. These particles may be used in liquid adhesive compositions, solid adhesive compositions such as tapes, or in other applications. In various embodiments, the oil-in-water Pickering emulsifier particles comprise materials selected from the group consisting of silica, fumed silica, calcium carbonate, barium sulfate, clay, carbon black, iron oxide, carbon nanotubes, latex, block copolymer micelles, polystyrene, poly(methyl methacrylate), any of the preceding materials which additionally are surface-modified, and combinations thereof. Particles of encapsulated epoxy resin may have an average diameter of 0.1-1000 micrometers, or in some embodiments 30-300 micrometers. The oil-in-water Pickering emulsifier particles may have an average diameter of 5-1000 nanometers, 5-100 nanometers, or in some embodiments 5-50 nanometers.

Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.

Self-healing compositions, method of preparation and uses thereof are disclosed. In an example, a self-healing composition includes a first microcapsule and a second microcapsule. The first microcapsule includes a first polydimethylsiloxane resin, a first silicone fluid, a first functionalized alkoxysilane, and a catalyst capable of catalyzing hydrosilylation reactions, and the second microcapsule includes a second polydimethylsiloxane resin, a second silicone fluid, a second functionalized alkoxysilane, and a hydrogen-terminated dimethyl siloxane resin. In this way, the self-healing composition releases and mixes contents of the first microcapsule and the second microcapsule upon the rupture thereof, imparting a passively initiated repair process to the self-healing composition.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

Provided is a urea compound-containing epoxy resin curing agent particle that can impart excellent storage stability and heat stability to an epoxy resin composition including a urea compound as a curing agent, while maintaining the solubility of the urea compound during heating and the fluidity after dissolution of the urea compound. The surface of the urea compound-containing epoxy resin curing agent particle is coated with a Group 4 or Group 13 element-containing alkoxide compound, chelate compound, and/or acylate compound.

A thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

A method for preparing a latent hardener includes, in the order recited, introducing a hardener into a dry mixer that is a high-energy-type mixer; injecting carbon dioxide gas or an inert gas into the dry mixer; and mechanochemically deactivating only a surface of the hardener using the dry mixer. The hardener may be an amine-based adduct, an imidazole-based adduct, dicyandiamide, a dihydride-based compound, a dichlorophenyl dimethylurea compound and combinations thereof. The inert gas may be helium, nitrogen, argon, neon, krypton, and combinations thereof.

Provided are: a structure adhesive composition which exhibits favorable thread breakage and improves shower resistance, and prevents stringiness when stitch-coating is performed; a method for producing a vehicle structure using the same; and a vehicle structure. A structure adhesive composition exhibiting favorable thread breakage, the structure adhesive composition being a structure adhesive composition containing no liquid rubber component, the structure adhesive composition contains: (A) an epoxy resin in which rubber particles are dispersed as primary particles; and (B) an epoxy resin latent curing agent; a compounded proportion of the rubber particles in the structure adhesive composition is from 10 to 45 mass %; and a viscosity at 50° C. of the structure adhesive composition is from 190 to 380 (Pa.Math.s) when a shearing speed is 5 (sec.sup.−1) and is from 1 to 30 (Pa.Math.s) when the shearing speed is 200 (sec.sup.−1).

Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.