The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b). In the formula, R represents an s-valent straight-chain or branched saturated aliphatic hydrocarbon group or an s-valent group having two or more straight-chain or branched saturated aliphatic hydrocarbon groups bonded to each other through an ether bond, and s represents an integer of 2 or greater.

A polymer represented by the following general formula (I):

##STR00001##

wherein X.sup.1, X.sup.2, and X.sup.3 each represent a chalcogen atom, R.sup.1 and R.sup.2 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an aralkyl group, R.sup.3 and R.sup.4 each independently represent any one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.5 and R.sup.6 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.7 represents a hydrogen atom or a methyl group, R.sup.8 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, n is any integer, and none of R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are bonded to each other to form a ring structure.

A polymer represented by the following general formula (I):

##STR00001##

wherein X.sup.1, X.sup.2, and X.sup.3 each represent a chalcogen atom, R.sup.1 and R.sup.2 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 2 to 18 carbon atoms, and an aralkyl group, R.sup.3 and R.sup.4 each independently represent any one selected from the group consisting of an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.5 and R.sup.6 each independently represent any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, R.sup.7 represents a hydrogen atom or a methyl group, R.sup.8 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, an aryl group, and an aralkyl group, n is any integer, and none of R.sup.3, R.sup.4, R.sup.5, and R.sup.6 are bonded to each other to form a ring structure.

A polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product having high compatibility with an initiator and another resin is described. The polyorganosiloxane has a low viscosity, a high curing rate, and high adhesiveness and impact resistance. The polyorganosiloxane has an M unit (R.sup.1R.sup.2R.sup.3SiO.sub.1/2), a D unit (R.sup.4R.sup.5SiO.sub.2/2), and a Q unit (SiO.sub.4/2). A T unit (R.sup.6SiO.sub.3/2) content of the polyorganosiloxane is 80% or less by mole of total silicon. The epoxy group has a group of formula (2) and a group of formula (3). Here, R.sup.8 is an optionally substituted divalent organic group having 1 to 20 carbon atoms, g is 0 or 1, R.sup.9 is an optionally substituted divalent organic group having 1 to 20 carbon atoms, h is 0 or 1, 0≤i≤8, and 0≤j≤8.

##STR00001##

A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa.Math.s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa.Math.s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

A curable resin composition includes: a first epoxy resin having a polyoxyalkylene chain; a second epoxy resin different from the first epoxy resin; a thermoplastic resin having a weight average molecular weight of 300,000 or less, and having a reactive functional group; at least one selected from the group consisting of a curing agent and a curing accelerator; and an inorganic filler.

A polymerizable composition of the present invention includes a polymerization reactive compound (A), and an internal release agent (B) including a polyether-modified silicone compound (b1) represented by General Formula (1) and a polyether-modified silicone compound (b2) represented by General Formula (2), in which the polymerization reactive compound (A) is one or more compounds selected from a polyiso(thio) cyanate compound, a poly(thio) epoxy compound, a polyoxetanyl compound, a polythietanyl compound, an alkyne compound, a poly(thi)ol compound, a polyamine compound, an acid anhydride, or a polycarboxylic acid compound. ##STR00001##

A polymerizable composition of the present invention includes a polymerization reactive compound (A), and an internal release agent (B) including a polyether-modified silicone compound (b1) represented by General Formula (1) and a polyether-modified silicone compound (b2) represented by General Formula (2), in which the polymerization reactive compound (A) is one or more compounds selected from a polyiso(thio) cyanate compound, a poly(thio) epoxy compound, a polyoxetanyl compound, a polythietanyl compound, an alkyne compound, a poly(thi)ol compound, a polyamine compound, an acid anhydride, or a polycarboxylic acid compound. ##STR00001##

A thermally reworkable adhesive includes at least one di-epoxide, at least one diamine that is reactive with the at least one di-epoxide, at least one additive that is miscible, but not reactive, with the at least one di-epoxide and/or the at least one diamine. Reaction of the at least one di-epoxide and the at least one diamine forms a crosslinked polymer network and the at least one additive offsets the stoichiometry of the crosslinked polymer network by 5-50%. The offset crosslinked polymer network forms the thermally reworkable adhesive that once cured, at a temperature in the range of 20-200° C., can be de-bonded from a device to which it is attached at a temperature in the range of 50-200° C.