Patent classifications
C08G59/20
Additives for winterization of paraffin inhibitors
A winterized paraffin inhibitor, which is capable of being used for preventing the deposition of paraffins in hydrocarbon streams and capable of withstanding freezing or crystallization at freezing or sub-freezing temperatures, may be formed by adding an oxyalkylated branched aliphatic compound having 12 or more carbons to a high molecular weight aliphatic polymer paraffin inhibitor, the oxyalkylated branched aliphatic compound having 12 or more carbons being produced by the oxyalkylation of the branched aliphatic compound having 12 or more carbon atoms in which the branched aliphatic compound having 12 or more carbon atoms is grafted with a polyether via a ring-opening reaction, wherein the polyether is a polymer of ethylene oxide, propylene oxide, butylene oxide, and combinations thereof.
CURABLE COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE
The present invention provides a curable composition containing a urethane-modified epoxy resin (A) as an essential component of a main agent and an acid anhydride (B) as an essential component of a curing agent, the urethane-modified epoxy resin (A) being a reaction product obtained by using a polyisocyanate compound (a1), a polyether polyol (a2), and a hydroxy group-containing epoxy resin (a3) as essential reaction materials; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin molded article; and a method for producing a fiber-reinforced resin molded article. The curable composition can form a cured product having excellent fracture toughness and tensile strength in the cured product.
CURABLE COMPOSITION, CURED PRODUCT, FIBER-REINFORCED COMPOSITE MATERIAL, AND MOLDED ARTICLE
The present invention provides a curable composition containing a urethane-modified epoxy resin (A) as an essential component of a main agent and an acid anhydride (B) as an essential component of a curing agent, the urethane-modified epoxy resin (A) being a reaction product obtained by using a polyisocyanate compound (a1), a polyether polyol (a2), and a hydroxy group-containing epoxy resin (a3) as essential reaction materials; a cured product thereof; a fiber-reinforced composite material; a fiber-reinforced resin molded article; and a method for producing a fiber-reinforced resin molded article. The curable composition can form a cured product having excellent fracture toughness and tensile strength in the cured product.
Epoxy resin composition
Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.
Epoxy resin composition
Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.
KIT FOR SOLIDIFYING BREAST MILK AND PROCESS FOR OBTAINING SOLIDIFIED BREAST MILK
A kit for the solidification of breast milk and a breast milk solidification process using said kit are described, enabling the transformation of breast milk into a solid product through a chemical reaction, with the ratios of each qualitative element being properly controlled, and allowing lay users to obtain a molded solid product.
BORON NITRIDE POWDER AND RESIN COMPOSITION
One aspect of the present invention is a boron nitride powder composed of aggregates of primary particles of boron nitride, wherein the boron nitride powder has an average diameter of 40 μm or more and an average sphericity of less than 0.70.
BORON NITRIDE POWDER AND RESIN COMPOSITION
One aspect of the present invention is a boron nitride powder composed of aggregates of primary particles of boron nitride, wherein the boron nitride powder has an average diameter of 40 μm or more and an average sphericity of less than 0.70.
EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT, AND ADHESIVE
These vinyl-based polymerizable group-containing silane compounds may be used alone, or two or more thereof may be used in combination. The content of the vinyl-based polymerizable group-containing silane compound is 1% by mass or more and 10% by mass or less, and preferably 1% by mass or more and 5% by mass or less, in 100% by mass of the organosiloxane mixture. When the amount of the vinyl-based polymerizable group-containing silane compound is the lower limit value or more, the peeling force and impact resistance of the obtained cured product tend to be high. When the amount of the vinyl-based polymerizable group-containing silane compound is the upper limit value or less, the peeling force and impact resistance of the obtained cured product tend to be high.
Conductive resin composition and conductive structure using same
A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.