The present invention provides an epoxy resin material, a preparation method therefor and an application thereof. The present method for preparing an epoxy resin material comprises: heating a mixture of an epoxy resin main agent and a curing agent that are placed at room temperature to 40-85 C. for reaction and curing. The curing agent contains an adduct of an olefinic nitrile compound and an amine compound. The present method for preparing an epoxy resin material has the characteristics of low mixing viscosity, long operation time, and low amount of heat released during preparation.

Provided is an antistatic material that contains a mixture of first alkoxysilane that contains at least one alkoxy group and at least one polymerizable organic functional group, second alkoxysilane that contains at least one alkoxy group and does not contain a polymerizable organic functional group, a solvent, an acidic catalyst, and an ionic compound.

Provided is an antistatic material that contains a mixture of first alkoxysilane that contains at least one alkoxy group and at least one polymerizable organic functional group, second alkoxysilane that contains at least one alkoxy group and does not contain a polymerizable organic functional group, a solvent, an acidic catalyst, and an ionic compound.

A resin composition comprising a resin and an aggregated inorganic filler, wherein an increase in a weight of a cured product of the resin composition at 85 C. and 85% RH is 0.80% or less, and wherein a storage modulus of a cured product of the resin composition excluding the inorganic filler at 200 C. is 1.010.sup.7 Pa or more. The resin composition has a high strength and excellent moisture-absorption reflow resistance and reduces the risk of the interfacial detachment being caused by the heat expansion and contraction in the case where the resin composition or the resin cured product is combined with a metal sheet to form a multilayer body.

Provided are an epoxy resin composition, a prepreg, a resin sheet, and a carbon fiber-reinforced composite material, which have high heat resistance, a high elastic modulus, low water absorption, and excellent flame resistance. This epoxy resin is a para-cresol novolac epoxy resin represented by General formula (1), in which a content ratio of components represented by n=1 as measured by gel permeation chromatography is less than 10% by area, and a content ratio of components represented by n=2 as measured by gel permeation chromatography is at least 1% by area and less than 40% by area.

##STR00001##

(In the formula, plural R's each independently represent a C1-6 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

Provided are an epoxy resin composition, a prepreg, a resin sheet, and a carbon fiber-reinforced composite material, which have high heat resistance, a high elastic modulus, low water absorption, and excellent flame resistance. This epoxy resin is a para-cresol novolac epoxy resin represented by General formula (1), in which a content ratio of components represented by n=1 as measured by gel permeation chromatography is less than 10% by area, and a content ratio of components represented by n=2 as measured by gel permeation chromatography is at least 1% by area and less than 40% by area.

##STR00001##

(In the formula, plural R's each independently represent a C1-6 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

A resin composition having, in a cured state, a thermal conductivity of 5 W/(m.Math.K) or more and a storage elastic modulus of 8 GPa or less.

A conductive composition is provided and at least includes an acrylic resin and a conductive powder, wherein the acrylic resin at least contains a polymer unit (A) of a (meth)acrylate having an epoxy group and a polymer unit (B) of a (meth)acrylate having an isobornyl group, and an amount of the polymer unit (B) is 5.0 parts by mass or more and 50.0 parts by mass or less based on 100 parts by mass of the acrylic resin.

An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

An epoxy group-containing organopolysiloxane shows the following average composition formula (1) and has an epoxy equivalent of 500 g/mol or more. The epoxy group-containing organopolysiloxane has excellent ultraviolet curability even when the content of epoxy group is small (when the epoxy equivalent is large), an ultraviolet curable silicone composition uses the same, and a method forms a cured film. ##STR00001## In the formula, each R.sup.1 represents the same or different unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms (except for a group containing an epoxy group); R.sup.2 represents a group containing an epoxy group; R.sup.3 represents a hydrogen atom or a saturated monovalent hydrocarbon group having 1 to 4 carbon atoms; a, b, and c are positive numbers, d is 0 or a positive number, satisfying (a+b)/(c+d)=0.5 to 1.0.