The present teachings contemplate a method that includes a step of providing a first amount of esterified reaction product of an acid and an epoxy-based material. The esterified reaction product may be further reacted an epoxy resin to form a polymeric epoxy. The resulting material may have a generally linear backbone, foaming and curing capability and flame retardant properties.

A curing agent composition based on diaminomethylcyclohexane and 1,3-cyclohexanebis(methylamine) can be used in an epoxy resin composition for chemical fastening of structural elements. A corresponding epoxy resin composition and multi-component epoxy resin system can contain the curing agent composition. A method can be used for chemical fastening of structural elements in boreholes with the epoxy resin composition or the multi-component epoxy resin system.

An ionic aqueous epoxy curing agent, a preparation method therefor and the use thereof. The aqueous epoxy curing agent is prepared by reacting the following raw materials in parts by weight: a) 1 part of a polyepoxy compound, b) 1.3-6 parts of a multifunctional compound, c) 0.2 to 1.25 parts of a monoepoxy compound, and d) 0.01 to 0.23 parts of a sultone, wherein the multifunctional compound has four or more active hydrogens. The curing agent obtained has a good hydrophilic effect and very good thinning performance, the paint film prepared by mixing same with an epoxy dispersion has the following advantages: excellent salt spray resistance and water resistance, strong adhesion, high hardness, etc.; in addition, the preparation process of the curing agent is simple, the conditions are mild, and room temperature curing is carried out.

Provided is a resin composition having excellent dielectric characteristics, i.e., low dielectric characteristics, in the high-frequency region, and excellent dielectric characteristics, i.e., low dielectric characteristics, under high humidity, and having practical adhesion to metal and resin substrates. More specifically, provided is a resin composition comprising an acid-modified polyolefin, an epoxy resin, and an inorganic filler, wherein a cured product of the resin composition has a dielectric loss tangent of 0.003 or less at a frequency of 10 GHz at 25° C. after storage for 168 hours under conditions of 85° C. and 85% RH (relative humidity).

Two part curable compositions are provided which include a first part comprising a (meth)acrylate component and an amine and a second part comprising a fatty acid peroxide. Further disclosed are methods of preparing a two part adhesive composition using the two part curable compositions and methods of bonding surfaces using the two part curable compositions.

A silicone-free thermal interface for placement along a thermal dissipation pathway is provided for long-term durability. The thermal interface is formed from a multi-part composition and cured in place to obtain a conformable coating with low durometer hardness, which is maintained by a non-crosslinked diluent product formed from a reactive diluent system.

An improved approach toward the formation of an adhesive comprising a separated liquid component and solid component and application of the adhesive to a substrate immediately upon mixing the liquid and solid components.

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

A polyhydric phenol resin is provided. The polyhydric phenol resin comprises a polyhydric phenol resin component and a first component. When the polyhydric phenol resin is characterized in a high-performance liquid chromatography (HPLC), the first component is eluted at a retention time ranging from 27.1 minutes to 28.0 minutes, and based on the total area of the chromatographic peaks of the polyhydric phenol resin, the area percentage of the chromatographic peak of the first component at the corresponding retention time in the spectrum ranges from 1.0% to 20%.