The present application provides agents for producing an impact-modified epoxy adhesive encompassing at least two components A and B packaged separately from each other, wherein (a) component A contains at least one compound having two or more isocyanate groups together with one or more further additives, (b) component B contains at least one compound which has at least two reactive groups selected from hydroxyl groups, thiol groups, primary amino groups and secondary amino groups and is simultaneously free from epoxy groups, together with one or more further additives, (c) at least one of components A and/or B contains at least one epoxide prepolymer as an additive, (d) at least one of components A and/or B contains at least one latent hardener for epoxide prepolymers as an additive, and (e) components A and B contain no blowing agent that is capable of being heat activated.

A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.

A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

An object of the present invention is to find a cationic electrodeposition coating composition excellent in coating composition stability, finished appearance, and corrosion resistance, and to provide a coated article excellent in these coating film properties. The present invention provides a cationic electrodeposition coating composition containing a polyester resin (A), an amino group-containing epoxy resin (B), and a blocked polyisocyanate curing agent (C), the polyester resin (A) being present in an amount of 3 to 40 mass %, the amino group-containing epoxy resin (B) being present in an amount of 20 to 60 mass %, and the blocked polyisocyanate curing agent (C) being present in an amount of 10 to 40 mass %, based on the total mass of the components (A), (B), and (C) on a solids basis, wherein the solubility parameter δA of the component (A) and the solubility parameter δB of the component (B) satisfy the relationship |δA−δB|<1.0.

The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1):

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wherein n represents an integer of 1 or more; and an epoxy resin (B).

Provided herein are silicon-containing recyclable polyamino compounds; epoxy resin compositions containing these silicon-containing reworkable or recyclable polyamino compounds; and methods of their use.

A prepreg comprising the following constituent elements (A), (B), and (C), the constituent element (C) being present in a surface layer of the prepreg: Constituent element (A): a reinforcing fiber base material; Constituent element (B): an epoxy resin composition containing a curing agent, the epoxy resin composition being cured within the range of from 90° C. to 140° C. (inclusive); and Constituent element (C): particles of a thermoplastic resin having a melting point or a glass transition temperature within the range of from 90° C. to 140° C. (inclusive).

To provide an epoxy adhesive having a high glass transition temperature and low viscosity, and having excellent adhesive properties, as well as to provide an automotive member that uses this adhesive, and a manufacturing method thereof. One embodiment provides an epoxy adhesive containing (A) epoxy, (B) a core-shell toughening agent, and (C) a latent curing agent that does not include an aniline backbone, wherein the epoxy (A) includes at least 50 mass % of a trifunctional or higher liquid epoxy. Another embodiment provides an automotive member including a first adherend, a second adherend, and a cured epoxy adhesive provided between the first adherend and the second adherend and cured to bond the first adherend and the second adherend.

A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).

A composition formed of an epoxy resin incorporating a fire retardant.