The invention relates to a method for producing a cured composition which has at least one oxazolidinone ring and at least one isocyanurate ring and is cross-linked by the same, starting from a liquid reactive mixture which, based on the total weight thereof, contains at least one epoxy resin, at least one polyisocyanate, at least one polyol, and at least one catalyst composition. The invention further relates to the cured composition obtainable thereby.

Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ΔHSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.

An apparatus and methods for using coatings for metal applications are disclosed. According to one embodiment, an article comprises a cured polymeric film having a first reaction product of a cationic photoinitiator and a compound suitable for cationic polymerization. The article has a second reaction product of a free-radical photoinitiator and a compound suitable for free-radical polymerization; The article has a metal substrate, wherein the cured polymeric film coats the metal substrate.

A process is disclosed for the production of an epoxy resin. This process includes providing lignin, one or more acids and/or esters derived from epoxidized vegetable oil(s), optionally a solvent and optionally a catalyst, to form a reactive mixture. The reactive mixture is mixed and cured in the presence of a curing agent to form the epoxy resin.

A resin composition for a printed wiring board, including: a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F), wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.

Provided herein is a hardener composition comprising (a) a first adduct comprising a reaction product of a liquid epoxy resin and isophorone diamine; (b) a second adduct comprising a reaction product of a liquid epoxy resin and m-xylylenediamine; and (c) an accelerator component comprising methanesulfonic acid.

The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

Cationically curable compositions with latent reducing agents that demonstrate low cure temperature and improved work life are provided.

A curing composition for an epoxy resin compound useful for the chemical fastening of construction elements, an epoxy resin compound, and a multi-component epoxy resin system are provided. A method for the chemical fastening of construction elements in boreholes and a method of using a salt (S) as an accelerator in an epoxy resin compound for chemical fastening, the epoxy resin compound including a Mannich base and an amine which is reactive to epoxy groups.