One aspect of the present disclosure can include an intrafascicular neural electrode. The intrafascicular neural electrode can include a microwire body having a proximal end, a distal anchoring end, and a middle portion extending between the proximal end and the distal anchoring end. The distal anchoring end can substantially match the mechanical and biological properties of the target nerve. The microwire body can have a middle anchoring portion extending between the proximal end and the distal end, wherein at least a portion of the distal end and/or the middle anchoring portion substantially match(es) the mechanical and biological properties of the target nerve. The electrode can be made of graphene. The microwire body, except for the distal anchoring end, can be coated with an insulation material, preferably with a biocompatible agent adsorbed onto the insulation material.

A cure-on-demand adhesive kit capable of self-sustaining frontal polymerization after a heat or actinic radiation trigger for bonding two substrates is provided. The kit includes a first monomer/oligomer component and a UV or thermal cure catalyst component. In practical application, the first monomer/oligomer component and the UV or thermal cure catalyst component are mixed together to form a ready-to-use prepolymer mixture. The prepolymer mixture is applied onto the surface of a first substrate, and the first substrate is contacted with a second substrate by the mixture applied side. After giving a heat or actinic radiation trigger, a self-sustaining frontal polymerization of the mixture will be started for curing the mixture between two substrates as an adhesive to adhere the two substrates.

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Provided is a resin composition, which is fast curable at low temperature, has high adhesive strength (especially, high peel strength) after curing, and can suppress a decrease in adhesive strength (especially, in peel strength) after a moisture resistance test of the resin composition after curing, and further has excellent pot life. Provided is the resin composition including: (A) an epoxy resin; (B) a thiol compound represented by C(CH.sub.2OR.sup.1)(CH.sub.2OR.sup.2)(CH.sub.2OR.sup.3)(CH.sub.2OR.sup.4) (wherein R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are each independently hydrogen or C.sub.nH.sub.2nSH (wherein n is 2 to 6), at least one of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is C.sub.nH.sub.2nSH (wherein n is 2 to 6)); (b) a polyfunctional thiol compound other than the (B); and (C) a latent curing accelerator.

Proposed is an epoxy flux film that is to be positioned between a semiconductor substrate and a device and is heated and pressed without addition of an additional flux. Thus, device-substrate soldering and sealing are simultaneously performed, and interference of light reflected from the solder can be reduced.

A method for producing a coating layer with scratch resistance and flex resistance, a laminated structure, and a coating composition are provided. The method includes coating the coating composition on a plastic substrate and performing a curing operation on the coating composition to form a cured coating layer. The coating composition includes a polyhedral oligomeric silsesquioxane, a multifunctional epoxy resin, a cationic light initiator, and an organic solvent, and the polyhedral oligomeric silsesquioxane has a cage-like structure. The curing operation has a baking temperature that is within a range from 75° C. to 200° C., a baking time that is within a range from 30 s to 120 s, and an UV curing energy that is within a range from 250 mJ/cm.sup.2 to 1,250 mJ/cm.sup.2.

An aspect of the present invention provides a semi-cured product composite containing: a porous body; and a semi-cured product of a thermally curable composition impregnated in the porous body, wherein the thermally curable composition contains an epoxy compound and a cyanate compound, and an equivalent ratio of an epoxy group of the epoxy compound to a cyanate group of the cyanate compound in the thermally curable composition is 1.0 or more.

A curable composition comprising (A) an epoxy resin containing on average more than one epoxy group per molecule; (B) a compound of formula A[—X—CO—CH.sub.2—CN].sub.n(1), wherein A is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, or A is a bivalent aliphatic, cycloaliphatic, aromatic, araliphatic or heterocyclic organic radical, X denotes —O—or —NR.sub.1—, wherein R.sub.1 is hydrogen or C.sub.1-C.sub.12 alkyl which is unsubstituted or substituted by one or more C.sub.1-C.sub.12 alkoxy groups, C.sub.1-C.sub.12 alkylcarbonyl groups, C.sub.7-C.sub.25 arylcarbonyl groups, hydroxyl groups, amino groups, C.sub.1-C.sub.12 alkylamino groups, C.sub.1-C.sub.12 dialkylamino groups, cyano groups or halogen atoms, n is 1 or 2; and (C) a protected base in the form of an adduct or salt which is able to release a basic compound upon heating to a temperature greater than 70° C., is storage-stable, allows processing over a longer period of time (pot-life) and produces cured products having outstanding mechanical and thermal properties.

A method for producing a coated substrate includes applying a photocurable silicon-containing coating film-forming composition to an uneven substrate; and exposing the photocurable silicon-containing coating film-forming composition to light, wherein the photocurable silicon-containing coating film-forming composition comprises a hydrolyzable silane, a hydrolysate thereof, or a hydrolytic condensate thereof, wherein the hydrolyzable silane is a hydrolyzable silane of the following Formula (1):

R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)  Formula (1)

wherein R.sup.1 is a functional group relating to photocrosslinking; R.sup.2 is an alkyl group and is bonded to a silicon atom via an Si—C bond; R.sup.3 is an alkoxy group, an acyloxy group, or a halogen group; a is an integer of 1; b is an integer of 0 to 2; and a+b is an integer of 1 to 3.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.