An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

A method for producing jewelry from human milk and an epoxy resin involving mixing human milk with a transparent epoxy resin, placing it in the mold and allowing it to harden, in which an epoxy resin and an amine hardener are used, wherein a quantity of cysteine and/or serine equal to at least 0.1 percent by weight of the milk is first added to human milk and the resulting mixture is introduced into the mixture of an epoxy resin with an amine hardener in an amount between 0.1 percent and 40 percent by volume of the mixture of an epoxy resin and a hardener.

A photocurable liquid silicone composition, that has low viscosity that facilitates injection into a small gap, cures quickly by irradiating with a high energy beam such as ultraviolet light or the like, has a refractive index after curing that is high not only in a visible region but also in an infrared region, in which composition design is possible to provide an arbitrarily low dielectric constant, and is particularly useful as a material for a device using an infrared LED light source, is provided. The composition comprises: (A) one or more type of an organosilane or organopolysiloxane having on average one or more photoreactive functional groups and two or more monovalent functional groups selected from aromatic groups with 6 to 12 carbon atoms and aralkyl groups with 7 to 12 carbon atoms in a molecule and having 1 to 5 silicon atoms, and optionally further comprising (C) a curing catalyst.

Provided is a curable resin composition exhibiting reduced or controlled shrinkage on curing. The composition includes (A) an epoxy resin, (B) a latent curing agent, and (C) a compound represented by formula (1):

##STR00001##

wherein X is an oxygen atom or a sulfur atom; R.sup.1 and R.sup.2 each independently represent a hydrogen atom, an alkyl group, or an aryl group; and R.sup.3 and R.sup.4 each independently represent a hydrogen atom, an alkyl group, or an aryl group, or R.sup.3 and R.sup.4 are connected to each other to represent a divalent group to form a ring.

Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C. and equal to or lower than 25° C.

Disclosed herein is an aqueous coating composition containing an aqueous epoxy resin dispersion, an aqueous amine-functional resin dispersion and an aromatic carboxylic acid. The aqueous dispersion contains at least one specific di- and/or polyfunctional monomeric amine and at least one resin component including at least one specific polyfunctional organic amine. Further disclosed herein is a kit-of-parts including a base varnish containing the aqueous epoxy resin dispersion and a curing component containing the aqueous amine-functional resin dispersion as well as the aromatic carboxylic acid. Additionally disclosed herein is a process for producing a coating on the substrate as well as coated substrates resulting from said process. Cured coating layers formed from said compositions exhibit a good adhesion to the substrate as well as a high intercoat adhesion and blistering stability under humidity conditions without negatively influencing the excellent sandability and the good stone chipping properties.

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

An epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the epoxy resin composition, the epoxy resin composition including an epoxy resin; a curing agent; an inorganic filler; and a curing catalyst, the epoxy resin including an epoxy resin represented by Formula 1: ##STR00001##

An epoxy resin, which is obtained by reacting at least a compound having one or more epoxy groups and a compound having a functional group that reacts with the epoxy groups, satisfies conditions (I) and/or (II): (I) the compound having a functional group that reacts with the epoxy groups includes a trihydric or higher phenol compound and/or a compound including a trifunctional or higher polyisocyanate; (II) the epoxy resin has an average degree of polyfunctionalization (X1) per molecule, as expressed by Formula (1), of 0.30 or more:

Average degree of polyfunctionalization (X1)=number of ends per molecule of epoxy resin−2.  Formula (1):