A polysulfide coating composition includes an aliphatic, aromatic or cycloaliphatic material with at least 2 thiol groups; an aliphatic, aromatic or cycloaliphatic, acryl, polyester or polysiloxane-based material with at least two epoxy groups; and a catalyst. The coating provides a durable cavitation- and erosion-resistant coating for the rudders of ships, and is also suitable for sound-damping applications.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

Provided are an adhesive composition for a polarizing plate, a polarizing plate, and an optical display device, the adhesive composition comprising an epoxy-based compound, a (meth)acrylate-based compound, a photo-acid generator, and an optical radical initiator, the (meth)acrylate-based compound comprising a mixture of a bifunctional (meth)acrylate-based compound and a monofunctional (meth)acrylate-based compound having a hydrophobic functional group, wherein the adhesive strength measured after the adhesive composition for a polarizing plate is separately applied to a PET film, a TAC film, and a COP film, to which a polarizer is then bound, followed by photo-curing, is about 200 gf/inch or more.

The present invention provides an epoxy resin-based curable composition which may be used as a structural adhesive for an automobile. Particularly, the present invention provides an epoxy resin-based curable composition having excellent low-temperature curability, while maintaining good storage stability and good adhesion. The present invention relates to a curable composition comprising an epoxy resin, a urea-based curing accelerator (A) and an amine-based curing agent (B) having a pyrazine ring.

The present invention relates to a phosphonium-based compound represented by chemical formula 1, an epoxy resin composition containing the same, and a semiconductor device manufactured by using the same.

A dual cure, all epoxy adhesive that is both photochemically and thermally curable is disclosed. The adhesive may comprise at least about 93% by weight of one or more polymerizable epoxides, a catalytic amount of a photo-acid generator (PAG) configured to induce acid-catalyzed polymerization of the polymerizable epoxide when exposed to UV or visible light, about 0.01% to about 1% by weight of a redox agent, and a catalytic amount of a thermal acid generator (TAG) configured to induce acid-catalyzed polymerization of the polymerizable epoxide in the presence of the redox agent when exposed to a temperature at or above about 70° C.

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.

A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.