C08G65/38

COMPOSITION FOR FORMING CONDUCTIVE PATTERN AND RESIN STRUCTURE HAVING CONDUCTIVE PATTERN

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein the composition makes it possible to form a fine conductive pattern on various polymer resin products or resin layers through a simple process, and can more effectively meet needs of the art, such as displaying various colors. The composition for forming a conductive pattern, comprises: a polymer resin; and a non-conductive metal compound having a predetermined chemical structure, and may be a composition for forming a conductive pattern through electromagnetic irradiation, by which a metal nucleus is formed from the non-conductive metal compound.

HIGHLY HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM

Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass % and a proportion of the polyamide resin (B) is 10 to 50 mass % relative to a total amount of 100 mass % of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1), and a molded article manufactured therefrom is also provided.

HIGHLY HEAT-RESISTANT THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED THEREFROM

Provided is a thermoplastic resin composition which has excellent heat resistance, mechanical characteristics, and adhesion properties with respect to a reinforcing fiber base material, which is a different kind of material, and from which a molded article particularly having excellent rigidity at a high temperature is obtained. A thermoplastic resin composition is provided, which includes: a phenoxy resin (A) having a hydroxy group and/or an epoxy group at a polymer chain terminal; and a polyamide resin (B), wherein a proportion of the phenoxy resin (A) is 50 to 90 mass % and a proportion of the polyamide resin (B) is 10 to 50 mass % relative to a total amount of 100 mass % of the phenoxy resin (A) and the polyamide resin (B), and a tensile modulus retention rate [Equation (i) below] of a dumbbell test piece (JIS K 7139, Type A1), and a molded article manufactured therefrom is also provided.

Laser Platable Thermoplastic Compositions
20220227930 · 2022-07-21 ·

A laser platable thermoplastic composition includes from about 38 wt % to about 90 wt % of a thermoplastic polymer, from about 0.01 wt % to about 15 wt % of a laser activatable metal compound, and from about 0.01 wt % to about 60 wt % of a magnetic filler. The magnetic filler includes a magnetic alloy. Methods for making laser platable thermoplastic compositions and articles formed therefrom—such as an induction heater for a domestic or commercial appliance—are also described.

Laser Platable Thermoplastic Compositions
20220227930 · 2022-07-21 ·

A laser platable thermoplastic composition includes from about 38 wt % to about 90 wt % of a thermoplastic polymer, from about 0.01 wt % to about 15 wt % of a laser activatable metal compound, and from about 0.01 wt % to about 60 wt % of a magnetic filler. The magnetic filler includes a magnetic alloy. Methods for making laser platable thermoplastic compositions and articles formed therefrom—such as an induction heater for a domestic or commercial appliance—are also described.

Polymer electrolyte membrane, membrane electrode assembly, and solid polymer electrolyte fuel cell

A polymer electrolyte membrane of the present disclosure comprises a perfluorosulfonic acid resin (A), wherein the polymer electrolyte membrane has a phase-separation structure having a phase where fluorine atoms are detected in majority and a phase where carbon atoms are detected in majority, in an image of a membrane surface observed under an SEM-EDX, and the polymer electrolyte membrane has a phase having an average aspect ratio of 1.5 or more and 10 or less in an image of a membrane cross-section observed under an SEM.

Random Copolymer Compound, Terminal-Modified Polymer Compound, and Resin Composition Including Said Compounds
20210395464 · 2021-12-23 ·

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.

Random Copolymer Compound, Terminal-Modified Polymer Compound, and Resin Composition Including Said Compounds
20210395464 · 2021-12-23 ·

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.

Bisphenol hypersorbents for enhanced detection of, or protection from, hazardous chemicals

The invention relates to strong hydrogen-bond acidic sorbents. The sorbents may be provided in a form that limits or eliminates intramolecular bonding of the hydrogen-bond acidic site between neighboring sorbent molecules, for example, by providing steric groups adjacent to the hydrogen-bond acidic site. The hydrogen bond site may be a phenolic structure based on a bisphenol architecture. The sorbents of the invention may be used in methods for trapping or detecting hazardous chemicals or explosives.

Surface modified abrasive particles, abrasive articles and methods of forming thereof

A surface modified abrasive particle may include a core abrasive particle and a coating functionally connected to a surface of the core abrasive particle. The core abrasive particle may have a median particle size of at least about 0.06 microns. The coating may include a compound selected from the group consisting of dopamine, tyrosine, dihydroxyphenylalanine, norepinephrine, epinephrine, normetanephrine, 3,4-dihydroxyphenylacetic acid, tannic acid, pyrogallic acid or combinations thereof.