Free-standing non-fouling polymers and polymeric compositions, monomers and macromonomers for making the polymers and polymeric compositions, objects made from the polymers and polymeric compositions, and methods for making and using the polymers and polymeric compositions.

Free-standing non-fouling polymers and polymeric compositions, monomers and macromonomers for making the polymers and polymeric compositions, objects made from the polymers and polymeric compositions, and methods for making and using the polymers and polymeric compositions.

Provided are a hydrophilic polyamide and polyimide retaining characteristics particular to polyamides and polyimides, such as heat resistance. A polymeric compound is provided having a repeating unit represented by the following formula (1): ##STR00001##
wherein M.sup.1 and M.sup.2 each independently represent any one selected from the group consisting of a hydrogen atom, a monovalent metal atom, an alkaline earth metal atom and an ammonium ion, provided that M.sup.1 and M.sup.2 are not a hydrogen atom at the same time; X.sup.1 and X.sup.2 represent an organic group; m and n each independently represent the number of substituents; Z.sup.1 represents a hydrogen atom or an optionally substituted carbonyl group; Z.sup.2 represents an optionally substituted hydrocarbon group; Z.sup.3 represents a hydrogen atom or an optionally substituted carbonyl group; and when Z.sup.1 or Z.sup.3 is an optionally substituted carbonyl group, they optionally form a ring structure together with Z.sup.2, each independently.

The present invention relates to a process comprising the step of melt-mixing a semi-aromatic polyamide (A) having a melting point on second heating of 295° C. or less comprising terephthalamide repeat units and a polyamide oligomer (B) comprising terephthalamide repeat units and having an amine end group concentration of less than 2000 me q/Kg and an inherent viscosity of at least 0.10, at a temperature which is greater than the melting point on first heating of both semi-aromatic polyamide (A) and polyamide oligomer (B) for a time period sufficient to produce semi-aromatic polyamide (C) having a melting point on second heating which is greater than or equal to 300° C.

The field of molded articles and fiber-reinforced thermoplastic compositions for obtaining them. The use of the reinforced thermoplastic composition for obtaining a thin molded article with reduced warpage. The composition may include: from 30 to 70% by weight of an amorphous polyamide matrix by total weight of the composition; from 30 to 70% by weight of glass fibers with a circular cross-section by total weight of the composition; and optionally additives.

A moulding composition contains polyetheramide (PEA) based on a subunit 1, made of at least one linear aliphatic diamine having 15 C atoms and at least one linear aliphatic or aromatic dicarboxylic acid having 6 to 14 C atoms. Furthermore, the PEA also contains a subunit 2, made of at least one polyether diamine having at least 2.3 C-5 atoms per ether oxygen and NH.sub.2 groups at the chain ends. The moulding composition contains a maximum of 2.5% by weight of a rubber containing functional groups. The number of C atoms of at least one component of subunit 1 selected from diamine and dicarboxylic acid is at least 13, and the average molar mass number of subunit 2 is between 200 to 900 g/mol. A moulded object can be created from the moulding compound. The object can be a moulded part, a film, a bristle, a fiber, or a foam.

A nonlimiting example method of forming highly spherical carbon nanomaterial-graft-polyamide (CNM-g-polyamide) polymer particles may comprising: mixing a mixture comprising: (a) carbon nanomaterial-graft-polyamide (CNM-g-polyamide), wherein the CNM-g-polyamide particles comprises: a polyamide grafted to a carbon nanomaterial, (b) a carrier fluid that is immiscible with the polyamide of the CNM-g-polyamide, optionally (c) a thermoplastic polymer not grafted to a CNM, and optionally (d) an emulsion stabilizer at a temperature greater than a melting point or softening temperature of the polyamide of the CNM-g-polyamide and the thermoplastic polymer, when included, and at a shear rate sufficiently high to disperse the CNM-g-polyamide in the carrier fluid; cooling the mixture to below the melting point or softening temperature to form CNM-g-polyamide particles; and separating the CNM-g-polyamide particles from the carrier fluid.

To provide a novel material that maintains suppleness which is the advantage of a material using fibers and has a low thermal shrinkage ratio, and a method for producing the material, a partially welded material using the material, a composite material, and a method for producing a molded product. A material including: a first region, a fiber region, and a second region continuously in a thickness direction; the first region and the second region being each independently a resin layer including from 20 to 100 mass % of a thermoplastic resin component and from 80 to 0 mass % of reinforcing fibers; the fiber region including from 20 to 100 mass % of thermoplastic resin fibers and from 80 to 0 mass % of reinforcing fibers; the thermoplastic resin component included in the first region and the thermoplastic resin component included in the second region each independently having a crystallization energy during temperature increase of 2 J/g or greater, measured by differential scanning calorimetry; and the thermoplastic resin fibers included in the fiber region having a crystallization energy during temperature increase of less than 1 J/g, measured by differential scanning calorimetry; wherein the crystallization energy during temperature increase is a value measured by using a differential scanning calorimeter (DSC) in a nitrogen stream while heating is performed from 25° C. to a temperature that is 20° C. higher than a melting point of the thermoplastic resin component or the thermoplastic resin fibers at a temperature increase rate of 10° C./min.

Disclosed herein is a polyamide composition, and an article which is obtained or obtainable from the composition. The article may include a connector socket for Double Data Rate 5 RAM. The polyamide composition disclosed herein shows desirable tensile strength for the article at a thickness of 0.4 mm, good flowability, and high HDT. The composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.

To provide a resin composition capable of effectively suppressing the mechanical strength from degrading even if kept under high temperatures and high humidity, and of suppressing color transfer, as well as a molded article with use of the resin composition, and a method for producing the resin composition. The resin composition contains a polyamide resin and cerium oxide, with a lanthanum content in the resin composition of more than 0 ppm by mass and 40 ppm by mass or less.