Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

A process for a continuous condensation reaction with feedstocks derived from bio-renewable resources, e.g., pine chemical derived feedstock, is disclosed. The process employs at least a multi-stage mixing reactor, selected from any of a multi-stage continuous stirred tank reactor (CSTR), a multi-stage horizontal continuous stirred tank reactor (HCSTR), or a continuous oscillating baffle reactor (COBR). The multi-stage mixing reactors are provided with a plurality of baffles for creating a mixing in a number of stages or cells created by the baffles, allowing the condensation reaction to proceed at a production rate at least twice that of a batch process with reactors of equivalent volume. The feedstocks derived from bio-renewable resources is selected from gum rosin, wood rosin, tall oil rosin and mixtures thereof; and polymeric fatty acids derived from bio-renewable resources such as tall oil.

The present invention relates to a process comprising the step of melt-mixing a semi-aromatic polyamide (A) having a melting point on second heating of 295° C. or less comprising terephthalamide repeat units and a polyamide oligomer (B) comprising terephthalamide repeat units and having an amine end group concentration of less than 2000 me q/Kg and an inherent viscosity of at least 0.10, at a temperature which is greater than the melting point on first heating of both semi-aromatic polyamide (A) and polyamide oligomer (B) for a time period sufficient to produce semi-aromatic polyamide (C) having a melting point on second heating which is greater than or equal to 300° C.

Described herein is a melt flowable polyamide composition for shaped articles, which may include thin wall connectors such as electrical connectors.

Described herein is a melt flowable polyamide composition for shaped articles, which may include thin wall connectors such as electrical connectors.

Described herein is a thermoplastic molding composition, including 30 to 99.8 wt % of at least one thermoplastic polyamide as component A; 0.001 to 5 wt % of at least one polyethylenimine homo-or copolymer as component B; 0.1 to 2.0 wt % of at least one condensation product of secondary aryl amines and aliphatic aldehydes, aliphatic ketones, or mixtures thereof, or a combination of at least one secondary aryl amine and the at least one condensation product as component C; 0 to 3 wt % of at least one lubricant as component D; 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and 0 to 25 wt % of further additives as component F, where a total of wt % of components A to F is 100 wt %, which is free from copper.

Described herein is a thermoplastic molding composition, including 30 to 99.8 wt % of at least one thermoplastic polyamide as component A; 0.001 to 5 wt % of at least one polyethylenimine homo-or copolymer as component B; 0.1 to 2.0 wt % of at least one condensation product of secondary aryl amines and aliphatic aldehydes, aliphatic ketones, or mixtures thereof, or a combination of at least one secondary aryl amine and the at least one condensation product as component C; 0 to 3 wt % of at least one lubricant as component D; 0 to 50 wt % of at least one fibrous and/or particulate filler as component E; and 0 to 25 wt % of further additives as component F, where a total of wt % of components A to F is 100 wt %, which is free from copper.

The present invention relates to a polyamide powder having a high glass transition temperature and to the corresponding preparation method. The invention also relates to the articles made therefrom and to a method for the production thereof.

Disclosed herein are compounds in the form of polymers, oligomers and defined molecules having repeating units that all incorporate repeating units formed from an imidazolium group and a biodegradable chain connected to an adjacent repeating unit. The compounds disclosed herein may have antimicrobial activity and so may be used to treat microbial infection and/or to treat surfaces to prevent microbial infections. Also disclosed herein are methods of forming the compounds.

This invention relates to a high molecular weight nylon powder composition for 3D printing, its preparation method and use. The composition comprises: 100 parts by weight of high-viscosity nylon powder, 1-5 parts by weight of a flow agent, and 0.1-1 parts by weight of an antioxidant; the high-viscosity nylon powder is one or more selected from nylon 6, nylon 66, nylon 11, nylon 12, nylon 612 and nylon 610; or the powder composition is obtained via polymerization reaction of the raw materials comprising the following components, based on the weight parts of lactam monomers or amide monomers: 100 parts by weight of lactam monomers or amide monomers, 0.005-1 parts by weight of a catalyst, and 0.1-1 parts by weight of an antioxidant. The high molecular weight nylon powder composition prepared in the present invention has a particle diameter in the range of 20-100 micrometers, good powder spreading performance, and is suitable for the 3D printing process, and the product of the high molecular weight nylon powder composition has good mechanical properties, good dimensional stability and low manufacturing cost.