C08G69/36

METHOD AND COMPOSITION FOR IMPROVED AGGLOMERATION RESISTANCE OF POLYAMIDE POLYMERS
20230116645 · 2023-04-13 ·

The present disclosure provides a leaching process and resulting composition which prevents or substantially reduces agglomeration of polyamide 6/66 copolymers. The leaching process includes applying hot water in the presence of an agglomeration inhibitor to the polyamide 6/66 copolymers in order to separate unreacted caprolactam and small molecular weight oligomers from the copolymers while preventing or substantially reducing agglomeration of the copolymers.

IMPROVED THERMOPLASTIC CONDENSATE POLYMERS AND METHOD TO FORM THEM
20230073319 · 2023-03-09 ·

Copolymers of condensation polymers are formed by a method of cleaving and reacting with a chain extender to form an end capped cleaved condensation polymer that is further reacted with a second compound that may be comprised of a further chain extender and condensation polymer that react with a reactive group still remaining in the chain extender capping the cleaved condensation polymer. The method allows the formation of block copolymers, branched copolymers and star polymers of differing condensation polymers bonded through the residue of a chain extender.

NOVEL POLYAMIDE

The present invention relates to a novel polyamide polymer, to a process for its manufacture and to the use thereof for the manufacture of thermoplastic composites, and articles manufactured via injection molding, extrusion and through additive manufacturing technologies.

DRUG DELIVERY SYSTEM FOR DELIVERY OF ACID SENSITIVITY DRUGS

The present invention relates to a drug delivery system comprising a core and a shell in which the core comprises a hydrolytically degradable polymer X which polymer backbone comprises pendant ester and acid functionalities and in which the shell comprises a hydrolytic degradable polymer Y. The hydrolytic degradable polymers X and Y are different polymers. Polymer X further comprises amino-acids in the polymer backbone and degrades via zero order degradation kinetics for a period of at least 3 months. Polymer Y degrades via auto-acceleration degradation kinetics.

PLASTICIZED POLYAMIDE MOLDING COMPOSITIONS
20230203304 · 2023-06-29 ·

Disclosed herein is a thermoplastic molding composition, including a) 39.9 to 99.9 wt % of at least one thermoplastic polyamide as component A, b) 0.1 to 10 wt % of at least one plasticizer of the general formula (1)


R.sub.1—O—(CH.sub.2CH.sub.2—O—).sub.nR.sub.2  (1) with n=1 to 10 R.sub.1, R.sub.2 independently H, C.sub.1-12-alkyl, phenyl or tolyl, having a boiling point of more than 250° C., as component B, c) 0 to 45 wt % of at least one elastomeric polymer as component C, d) 0 to 60 wt % of at least one fibrous and/or particulate filler as component D, and e) 0 to 25 wt % of further additives as component E,
where the total of wt % of components A to E is 100 wt %.

POWDER COMPOSITIONS FOR LASER SINTERING
20170369650 · 2017-12-28 ·

Powder compositions for laser sintering. Nylon copolymer compositions are described which provide enhanced performance in processing and finished products when used in 3D laser sintering processes.

POWDER COMPOSITIONS FOR LASER SINTERING
20170369650 · 2017-12-28 ·

Powder compositions for laser sintering. Nylon copolymer compositions are described which provide enhanced performance in processing and finished products when used in 3D laser sintering processes.

Polyamide molding material, the use thereof, and molded parts produced therefrom
09845389 · 2017-12-19 · ·

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

Polyamide molding material, the use thereof, and molded parts produced therefrom
09845389 · 2017-12-19 · ·

A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C., and a dynamic pressure of 100 bar and a holding pressure of 400 bar, at the flow path end of a mold arm having a vent gap dimension of 30 μm, burrs having a length G of at most 30 μm result. Such a polyamide molding material results in molded parts having good surface quality and low warpage when injection molded and is suitable for the production of housings or housing parts of electrical and electronic devices.

Oxygen-absorbing resin composition, and multilayer body, container, injection-molded body, and medical container using same

Provided are a novel oxygen-absorbing resin composition not responsive to a metal detector, producing no odor after absorption of oxygen and having excellent oxygen-absorbing performance, and a multilayer body, container, injection-molded article and medical container using these. Further provided are an oxygen-absorbing resin composition etc. having excellent oxygen-absorbing performance in a wide range of humidity conditions from low humidity to high humidity. The oxygen-absorbing resin composition of the present invention is an oxygen-absorbing resin composition containing a polyamide compound and a transition metal catalyst, wherein the polyamide compound has at least one constituent unit having a tetralin ring. Moreover, the multilayer body, container, injection-molded article, medical container, etc. of the present invention are obtained by using the oxygen-absorbing resin composition of the present invention.