A thermoset material obtained from a curing by heat treatment of a resin that can be obtained by polycondensation, in basic medium, of at least one phthalonitrile compound bearing on its benzene ring at least one hydroxyl group.

A crosslinker composition is prepared from a reaction mixture including: (a) a prepolymer including a reaction product of a prepolymer mixture including: (i) a polyfunctional isocyanate; and (ii) a first compound comprising two or more active hydrogen groups, where the polyfunctional isocyanate and/or the first compound comprising two or more active hydrogen groups includes a greater than two functional isocyanate and/or active hydrogen groups, respectively; and (b) a polyfunctional hydrazide. The crosslinker composition is not self-crosslinkable. The crosslinker composition has an acid value of at least 15 based on total resin solids of the crosslinker composition.

The present invention relates to a charge transporting semi-conducting material. The charge transporting semi-conducting material may include optionally at least one electrical dopant, and a branched or cross-linked charge transporting polymer that includes 1,2,3-triazole cross-linking units of at least one of the general formulae Ia and/or Ib herein. The charge transporting polymer can include ethylene building units substituted with at least one pending side group including a conjugated system of delocalized electrons. Also provided herein are processes for obtaining the charge transporting semi-conducting material.

The present invention relates to a cross-linkable composition comprising: i) a fluorinated ,-bis(propargyl) oligomer of formula (I): in which m is 1 to 100, e.g. 1 to 93, n is 2 to 150, e.g. 1 to 128, p is 0 to 2, preferably 0 or 1.75, and n, m and p are selected such that the fluorinated ,-bis(propargyl) oligomer of formula (I) has a number average molar mass Mn of 400 to 25000; ii) a cross-linking agent comprising at least three azide-N.sub.3 groups; and iii) optionally, a fluorinated oligomer comprising two terminal azide-N3 or fluorinated ,-bis(azide) oligomer groups. The invention also relates to a material comprising the click chemistry reaction product of the cross-linkable composition of the invention, to a method for preparing said material and to the uses thereof.

The present invention relates to a cross-linkable composition comprising: i) a fluorinated ,-bis(propargyl) oligomer of formula (I): in which m is 1 to 100, e.g. 1 to 93, n is 2 to 150, e.g. 1 to 128, p is 0 to 2, preferably 0 or 1.75, and n, m and p are selected such that the fluorinated ,-bis(propargyl) oligomer of formula (I) has a number average molar mass Mn of 400 to 25000; ii) a cross-linking agent comprising at least three azide-N.sub.3 groups; and iii) optionally, a fluorinated oligomer comprising two terminal azide-N3 or fluorinated ,-bis(azide) oligomer groups. The invention also relates to a material comprising the click chemistry reaction product of the cross-linkable composition of the invention, to a method for preparing said material and to the uses thereof.

The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200 C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.

##STR00001##

(In the general formula (1), R.sup.1 and R.sup.2 each are a divalent aliphatic group, R.sup.3 and R.sup.4 each are a divalent aliphatic group, aliphatic ring group, aromatic group,
a divalent organic group bonded to an aromatic group by O, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine),
a divalent organic group in which two or more aromatic groups are bonded by a single bond,
or a divalent organic group in which two or more aromatic groups are bonded by O, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine), R.sup.5 and R.sup.6 each are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond,
or a divalent organic group in which two or more aromatic groups are bonded by O, S, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine),
p and q each are an integer number in the range of 0 to 3),

The present invention relates to a novel di-amine compound, a heat-resistant resin using the di-amine compound, and a resin composition using the heat-resistant resin, and a cured film excellent in chemical resistance and film properties even by a thermal treatment at a low temperature of 200 C. or less can be obtained. The novel di-amine compound is represented by the general formula (1). The heat-resistant resin composition of the present invention or the resin composition can be suitably used in a surface protective film and an interlayer dielectric film of a semiconductor device, a dielectric layer or a planarizing layer of an organic electroluminescent element (organic EL), or the like.

##STR00001##

(In the general formula (1), R.sup.1 and R.sup.2 each are a divalent aliphatic group, R.sup.3 and R.sup.4 each are a divalent aliphatic group, aliphatic ring group, aromatic group,
a divalent organic group bonded to an aromatic group by O, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine),
a divalent organic group in which two or more aromatic groups are bonded by a single bond,
or a divalent organic group in which two or more aromatic groups are bonded by O, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine), R.sup.5 and R.sup.6 each are an organic group having any of a hydrogen atom, a halogen atom, a hydroxyl group, a nitro group, a cyano group, an aliphatic group, an aromatic group, an acetyl group, a carboxyl group, an ester group, an amide group, an imide group, and a urea group, A is a divalent aliphatic group, aliphatic ring group, aromatic group, a divalent organic group in which two or more aromatic groups are bonded by a single bond,
or a divalent organic group in which two or more aromatic groups are bonded by O, S, CO, SO.sub.2, CH.sub.2, C(CH.sub.3).sub.2 or C(CF.sub.3).sub.2 (wherein F is fluorine),
p and q each are an integer number in the range of 0 to 3),

Provided are a bimolecular block polymer and an electrolyte and an electrical double layer capacitor containing the same. The bimolecular block polymer is suitable for an electrolyte of a capacitor, and is formed by polymerizing a first compound and a second compound. The first compound is represented by one of formula (A-1) to formula (A-4). The second compound is represented by one of formula (B-1) to formula (B-5). A molar ratio of the first compound to the second compound is between 5:1 and 1:5.

Provided are a bimolecular block polymer and an electrolyte and an electrical double layer capacitor containing the same. The bimolecular block polymer is suitable for an electrolyte of a capacitor, and is formed by polymerizing a first compound and a second compound. The first compound is represented by one of formula (A-1) to formula (A-4). The second compound is represented by one of formula (B-1) to formula (B-5). A molar ratio of the first compound to the second compound is between 5:1 and 1:5.

Provided herein are compositions, CO.sub.2-permeable/selective membranes and related methods of making and using the membranes. Ionically cross-linked poly(ether)-based membranes were prepared for applications relating to CO.sub.2. These films were studied for their thermal curing behavior using DSC. The resulting free-standing membranes have T.sub.gs near 64 C., T.sub.dS up to 230 C., and Young's modulus up to 4.2 MPa. These membranes showed CO.sub.2 permeabilities of 84-110 Barrer and CO.sub.2/N.sub.2 selectivity of 20-40.