A manufacturing method for a cured substance includes a film forming step of applying a specific photosensitive resin composition onto a base material to form a film, an exposure step of selectively exposing the film, a development step of developing the exposed film with a developer to form a pattern, a treatment step of bringing a treatment liquid into contact with the pattern, and a heating step of heating the pattern after the treatment step, in which at least one of the developer or the treatment liquid contains at least one compound selected from the group consisting of a base and a base generator.

A manufacturing method for a cured substance includes a film forming step of applying a specific photosensitive resin composition onto a base material to form a film, an exposure step of selectively exposing the film, a development step of developing the exposed film with a developer to form a pattern, a treatment step of bringing a treatment liquid into contact with the pattern, and a heating step of heating the pattern after the treatment step, in which at least one of the developer or the treatment liquid contains at least one compound selected from the group consisting of a base and a base generator.

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. (A) Silicone-modified polyimide resin represented by formula (1)
Ee-Ff-Gg  (1)
E is represented by formula (2), F is represented by formula (3), G is a divalent group derived from diamine, f+e+g=100 mol %, the molar ratio f/(e+g) is 0.9-1.1, and e is 1-90 when the sum of e and g is 100. ##STR00001##
R.sup.A is a divalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.
-Im-X-Im-  (3)
Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like. (Bc) Heat-decomposable radical initiator (C) Solvent (D) Antioxidant (E) Fumed silica.

According to the present invention, a power module that has a base to which a power semiconductor device is bonded and a sealing body for sealing said base and in which the base and the sealing body are bonded with a primer layer interposed therebetween, said primer layer being formed of a cured product of a silicone-modified polyimide resin composition containing, for example, components (A) to (E) below, has high reliability because delamination of an epoxy sealing resin under high temperature conditions is suppressed. (A) Silicone-modified polyimide resin represented by formula (1)
Ee-Ff-Gg  (1)
E is represented by formula (2), F is represented by formula (3), G is a divalent group derived from diamine, f+e+g=100 mol %, the molar ratio f/(e+g) is 0.9-1.1, and e is 1-90 when the sum of e and g is 100. ##STR00001##
R.sup.A is a divalent hydrocarbon group, R.sup.1 and R.sup.2 are alkyl groups, R.sup.3 and R.sup.4 are monovalent aliphatic hydrocarbon groups, R.sup.5 and R.sup.6 are aryl groups or the like, m is an integer of 0-20, n is an integer of 1-20, o is an integer of 0-20, and m+n+o is an integer of 1-30.
-Im-X-Im-  (3)
Im is a cyclic group including a cyclic imide structure, and X is a single bond or the like. (Bc) Heat-decomposable radical initiator (C) Solvent (D) Antioxidant (E) Fumed silica.

A polyimide luminescent material, a preparation method, and a used thereof are disclosed; the polyimide luminescent material includes a polyimide resin and a rare earth complex distributed in the polyimide resin, wherein the polyimide resin is a condensation polymer of an aromatic diamine containing a bidentate chelate ligand and an aromatic dianhydride, and the rare earth complex and the bidentate chelate ligand are connected by a chemical bond. The luminescent material has enhanced fluorescence intensity, thermal stability, and mechanical properties. The preparation method is simple and easy, and is suitable for industrial production.

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

A method of making polyetherimide comprising reacting a first diamine having four bonds between the amine groups, a second diamine having greater than or equal to five bonds between the amine groups, 4-halophthalic anhydride and 3-halophthalic in the presence of a solvent and a polymer additive to produce a mixture comprising 3,3′-bis(halophthalimide)s, 3,4′-bis(halophthalimide)s, 4,4′-bis(halophthalimide)s, solvent and the polymer additive wherein the molar ratio of 3-halophthalic anhydride to 4-halophthalic anhydride is 98:02 to 50:50 and the molar ratio of the first diamine to the second diamine is 98:02 to 02:98; and reacting the mixture with an alkali metal salt of a dihydroxy aromatic compound to produce a polyetherimide having a cyclics content less than or equal to 5 weight percent, based on the total weight of the polyetherimide, wherein the polymer additive dissolves in the solvent at the imidization reaction temperature and pressure.

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent, ##STR00001##
noting that in the general formula (1A), when W.sub.1 represents any of ##STR00002##
R.sub.1 does not represent any of ##STR00003##

An embodiment relates to a polyimide based film for a cover window that may satisfy required performance of an advanced cover window, and a use thereof, and the polyimide based film for a cover window according to the embodiment has excellent visibility without optical stains without deterioration in colorless and transparent optical physical properties, and excellent heat resistance and mechanical physical properties, and thus, may be usefully used for optical applications or the purpose of replacing existing tempered glass. In addition, the polyimide based film for a cover window according to an embodiment may be usefully used in a multilayer structure and a display device.