Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.

A method for producing films, fibers, and moldings of a polybenzazole polymer (P) by reacting at temperatures of 0 to 120 C. a mixture including (a) aromatic dicarboxylic compound(s) (I):

##STR00001##

wherein Ar.sup.1 is optionally substituted phenylene, naphthalenediyl, anthracenediyl, biphenyldiyl, diphenylmethanediyl, diphenyl ether diyl, diphenyl thio ether diyl, diphenyl sulfone diyl, benzophenonediyl, pyridinediyl, pyrimidinediyl, furandiyl, or thiophenediyl, substituents being F, Cl, Br, OR.sup.1, and C.sub.1-C.sub.10-alkyl, R.sup.1 being H or C.sub.1-C.sub.10-alkyl; X.sup.1 and X.sup.2 are independently-OR.sup.2, F, Cl, or Br, R.sup.2 being H, C.sub.1-C.sub.10-alkyl, C.sub.1-C.sub.10-alkenyl or a repeating unit (a):

##STR00002##

wherein m is a natural number from 1 to 50, and R.sup.3 is H, C.sub.1-C.sub.10-alkyl, or C.sub.1-C.sub.10-alkenyl; (b) aromatic diamino compound(s) of formula (IIa), (IIb), (IIc) and/or (IId); (c) at least one ionic liquid (IL), to obtain a product, processing the product at temperatures 0 to 100 C. and heating of the articles obtained at temperatures of 250 to 500 C.

A method for producing films, fibers, and moldings of a polybenzazole polymer (P) by reacting at temperatures of 0 to 120 C. a mixture including (a) aromatic dicarboxylic compound(s) (I):

##STR00001##

wherein Ar.sup.1 is optionally substituted phenylene, naphthalenediyl, anthracenediyl, biphenyldiyl, diphenylmethanediyl, diphenyl ether diyl, diphenyl thio ether diyl, diphenyl sulfone diyl, benzophenonediyl, pyridinediyl, pyrimidinediyl, furandiyl, or thiophenediyl, substituents being F, Cl, Br, OR.sup.1, and C.sub.1-C.sub.10-alkyl, R.sup.1 being H or C.sub.1-C.sub.10-alkyl; X.sup.1 and X.sup.2 are independently-OR.sup.2, F, Cl, or Br, R.sup.2 being H, C.sub.1-C.sub.10-alkyl, C.sub.1-C.sub.10-alkenyl or a repeating unit (a):

##STR00002##

wherein m is a natural number from 1 to 50, and R.sup.3 is H, C.sub.1-C.sub.10-alkyl, or C.sub.1-C.sub.10-alkenyl; (b) aromatic diamino compound(s) of formula (IIa), (IIb), (IIc) and/or (IId); (c) at least one ionic liquid (IL), to obtain a product, processing the product at temperatures 0 to 100 C. and heating of the articles obtained at temperatures of 250 to 500 C.

Embodiments in accordance with the present invention encompass photosensitive compositions containing a base soluble polymer, a latent base catalyst, a photoactive compound and an epoxy crosslinking agent. The compositions are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. More specifically, the compositions exhibit increased photo speed, higher elongation to break, higher tensile strength and higher glass transitions temperatures than the conventional compositions, among other enhanced properties. Accordingly, the positive images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.

Disclosed herein are hybrid membranes comprising: a microporous polymer, the microporous polymer comprising a continuous polymer phase permeated by a continuous pore phase; and an atomic scale inorganic material dispersed throughout the microporous polymer within the continuous pore phase. Methods of making and use of the hybrid membranes are also disclosed.

Disclosed herein are hybrid membranes comprising: a microporous polymer, the microporous polymer comprising a continuous polymer phase permeated by a continuous pore phase; and an atomic scale inorganic material dispersed throughout the microporous polymer within the continuous pore phase. Methods of making and use of the hybrid membranes are also disclosed.