The present invention provides a process of using an alloy nanoparticle catalyst to catalyze one pot chemical reactions for synthesizing functional polymers with controlled polymerization and properties. In particular, the present invention provides a process of using an AuPd NP catalyst to catalyze one pot chemical reactions for synthesizing polybenzoxazole with controlled polymerization and improved chemical stability.

The present invention provides a process of using an alloy nanoparticle catalyst to catalyze one pot chemical reactions for synthesizing functional polymers with controlled polymerization and properties. In particular, the present invention provides a process of using an AuPd NP catalyst to catalyze one pot chemical reactions for synthesizing polybenzoxazole with controlled polymerization and improved chemical stability.

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): ##STR00001##
wherein T.sub.1 and T.sub.2 may be the same as, or different from, each other and represent any of —CO— and —SO.sub.2—; X.sub.1 is a tetravalent organic group; and l is 0 or 1; and X.sub.2 is a divalent organic group.

Provided is a polymer that can be used as a base resin for a positive photosensitive resin composition and a negative photosensitive resin composition, wherein the positive photosensitive resin composition and the negative photosensitive resin composition are soluble in an aqueous alkaline solution, can form a fine pattern, can achieve high resolution, and have good mechanical properties even when they are cured at low temperature. Also provided are a positive photosensitive resin composition and a negative photosensitive resin composition using the polymer. The polymer is represented by general formulas (1) and/or (2): ##STR00001##
wherein T.sub.1 and T.sub.2 may be the same as, or different from, each other and represent any of —CO— and —SO.sub.2—; X.sub.1 is a tetravalent organic group; and l is 0 or 1; and X.sub.2 is a divalent organic group.

An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1):

##STR00001## wherein A.sub.1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3):

##STR00002## wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; and Z represents a monovalent substituent; or a divalent linking group other than this; at least one of a plurality of A.sub.1s is formula (1-1), (1-2), or (1-3); A.sub.2 represents a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, a divalent linking group that is a residue of an aromatic dicarboxylic acid compound, or a divalent linking group other than this; and when A.sub.2 is present singly, A.sub.2 is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, and when a plurality of A.sub.2s is present, at least one of A.sub.2s is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound.

An object is to provide a novel bismaleimide compound. The solution is a bismaleimide compound represented by formula (1):

##STR00001## wherein A.sub.1 represents a direct bond, a divalent linking group represented by formula (1-1), (1-2), or (1-3):

##STR00002## wherein ring a represents a benzene ring or a cyclohexane ring; X represents a direct bond or a divalent linking group; and Z represents a monovalent substituent; or a divalent linking group other than this; at least one of a plurality of A.sub.1s is formula (1-1), (1-2), or (1-3); A.sub.2 represents a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, a divalent linking group that is a residue of an aromatic dicarboxylic acid compound, or a divalent linking group other than this; and when A.sub.2 is present singly, A.sub.2 is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound, and when a plurality of A.sub.2s is present, at least one of A.sub.2s is a divalent linking group that is a residue of a saturated aliphatic dicarboxylic acid compound.

Provided is a polybenzoxazole having a structural unit represented by General Formula [1]. In General Formula [1], R.sup.1 is a tetravalent organic group represented by General Formula [2], and R.sup.2 is a divalent organic group. In General Formula [2], two n’s are each independently an integer of 0 to 3, in a case where a plurality of R.sup.3′s are present, the plurality of R.sup.3′s each independently represent a monovalent substituent, and *1, *2, *3, and *4 each independently represent a bonding site, in which one of *1 and *2 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1], and one of *3 and *4 is bonded to an oxygen atom in General Formula [1] and the other is bonded to a nitrogen atom in General Formula [1].

##STR00001##

##STR00002##