Patent classifications
C08G73/22
RESIN COMPOSITION, RESIN SHEET, CURED FILM, ORGANIC EL DISPLAY DEVICE, SEMICONDUCTOR ELECTRONIC COMPONENT, SEMICONDUCTOR EQUIPMENT, AND METHOD FOR PRODUCING ORGANIC EL DISPLAY DEVICE
The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%.
##STR00001##
(In general formula (1), O represents an oxygen atom. R.sup.1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R.sup.2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3. Provided that (s+t)≥1. d represents an integer from 0 to 2. u represents an integer from 1 to 2, and * represents a chemical bond.)
POLYIMIDE-POLYBENZOXAZOLE PRECURSOR SOLUTION, POLYIMIDE-POLYBENZOXAZOLE FILM, AND PREPARATION METHOD THEREFOR
A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
POLYIMIDE-POLYBENZOXAZOLE PRECURSOR SOLUTION, POLYIMIDE-POLYBENZOXAZOLE FILM, AND PREPARATION METHOD THEREFOR
A polyimide-polybenzoxazole precursor solution, a polyimide-polybenzoxazole film, and a method of manufacturing the film are disclosed. A polyimide-polybenzoxazole film manufactured using the polyimide-polybenzoxazole precursor solution is formed by copolymerizing a unit structure of diamine and dianhydride and a unit structure of diaminophenol and dicarbonyl chloride in an organic solvent. The film is colorless and transparent, like conventional polyimide films, and can exhibit improved heat resistance and low birefringence.
Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component
A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component
A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND ORGANIC EL DISPLAY AND MANUFACTURING METHOD THEREFOR
An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure.
Semiconductor devices and methods of forming the same
A semiconductor device includes a dielectric layer and a conductive structure in the dielectric layer. The dielectric layer includes a dielectric material and a compound represented by Chemical Formula 1. In Chemical Formula 1, R is the same as defined in the specification. ##STR00001##
METHOD FOR DIRECTLY CREATING A FILM OF 2D POLYMERS FROM MONOMER SOLUTIONS
Two-dimensional (2D) polymers and methods for their formation are described herein. To create oriented 2D polymer films, monomers are combined with processing additives within a solvent, creating a solution that can be cast and dried to remove the solvent and form a solid film. The methods can enable transformation of the monomers into oriented films. Film quality can be controlled via multiple processing parameters, including monomer and additive concentrations, shear and elongational flow rates during casting, evaporation rates, and post-process rinsing, buffering, stretching, and thermal treatments. By combining stiff carbon-containing cyclic polymer nodal units with more compliant linear polymer bridge units in an ordered, 2D repeating molecular structure it is possible to tailor the mechanical properties of 2D polymers and their assemblies to provide high stiffness, strength, and toughness. The 2D polymer can also be combined with other 2D materials, linear polymers, or reinforcing materials to create 2D polymer composites.
METHOD FOR DIRECTLY CREATING A FILM OF 2D POLYMERS FROM MONOMER SOLUTIONS
Two-dimensional (2D) polymers and methods for their formation are described herein. To create oriented 2D polymer films, monomers are combined with processing additives within a solvent, creating a solution that can be cast and dried to remove the solvent and form a solid film. The methods can enable transformation of the monomers into oriented films. Film quality can be controlled via multiple processing parameters, including monomer and additive concentrations, shear and elongational flow rates during casting, evaporation rates, and post-process rinsing, buffering, stretching, and thermal treatments. By combining stiff carbon-containing cyclic polymer nodal units with more compliant linear polymer bridge units in an ordered, 2D repeating molecular structure it is possible to tailor the mechanical properties of 2D polymers and their assemblies to provide high stiffness, strength, and toughness. The 2D polymer can also be combined with other 2D materials, linear polymers, or reinforcing materials to create 2D polymer composites.
Organic and metallic aerogels, composition for the organic and metallic aerogels, and method for manufacturing the organic and metallic aerogels
A nanoporous aerogel comprising an acid-catalyzed, oxidatively aromatized PBO polymer. The nanoporous aerogel includes a benzoxazine moiety containing polybenzoxazine polymer with up-to six sites of cross-linking per unit is the product of the high yield, room temperature, and acid catalyzed synthesis method, as provided for herein. A method of producing the aerogel is providing that results in robust monoliths, oxidative aromatization, and conversion to nanoporous carbons for the provided aerogels. The PBO polymer may be co-generated as an interpenetrating network with a metal oxide network, wherein the PBO network serves as both a reactive template and as a sacrificial scaffold in the synthesis of the pure, nanoporous, monolithic metal aerogels, in an energy efficient method. ##STR00001##