A material for three-dimensional printing including at least one of a functionalized silicone polymer, a functionalized silica particle, or a combination thereof; wherein the functionalized silicone polymer is functionalized with a member of the group consisting of a carboxylic acid, an amine, and combinations thereof; and wherein the functionalized silica particle is functionalized with a member of the group consisting of a carboxylic acid, an amine, and combinations thereof. A process for preparing the three-dimensional printing material. A process for three-dimensional printing use of the material.

A thermally conductive resin composition capable of maintaining high thermal conductivity and a thermally conductive sheet using the same, a thermally conductive resin composition contains an addition reaction type silicone resin, a thermally conductive filler, an alkoxysilane compound, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to an alkoxysilane compound, and contains 55 to 85% by volume of the thermally conductive filler. A thermally conductive resin composition contains an addition reaction type silicone resin, an alkoxysilane compound, a thermally conductive filler, and a carbodiimide compound in which a subcomponent is in an inactive state with respect to the alkoxysilane compound, and exhibits thermal conductivity of 5 W/m*K or more after curing.

An adhesive matrix and adhesive formulation are described. The adhesive matrix is comprised of a hydrophilic domain and a hydrophobic domain, and a therapeutically active agent contained in the matrix in a supersaturated, stable, condition. The hydrophilic domain and the hydrophobic domain are co-soluble in a solvent system, to provide a homogeneous blend in which the active agent is solubilized. The proportion of the hydrophilic domain and hydrophobic domain is selected to optimize, or maximize, solubility of active agent in the matrix.

The present teachings generally provide curable polysiloxane compositions including a base resin including a surface active polymer. Articles of manufacture including the curable polysiloxane compositions and slippery coatings and materials also are provided. The compositions may be used to provide slippery, lubricious, or repellent materials and coatings and may provide anti-fouling function. The compositions can provide anti-fouling or foul-release function on open surfaces, internal surfaces, membranes; to provide pinning free or low contact angle hysteresis surfaces; to provide homogeneous interface to suppress nucleation; to provide a barrier layer such as anti-corrosion; to provide anti-stain, anti-smudge, anti-fingerprint, anti-soil function.

The present invention is related to a curable composition for dental impression comprising: a curable base composition and a surfactant system comprising a first surfactant, which is at least one compound having the formula (I) and a second surfactant, which works synergistically with the second surfactant so as to permit the composition to surprisingly have a lower contact angle; these results are reached with relatively low concentrations of biodegradable surfactants.

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An extrudable ceramic precursor mixture and method of use includes: an inorganic ceramic-forming component, a first siloxane prepolymer, a second siloxane prepolymer with a different composition than the first siloxane prepolymer, a catalyst adapted to catalyze polymerization of the first siloxane prepolymer with the second siloxane prepolymer into a siloxane-based polymer, and a thermally curable siloxane-based cross-linking agent adapted to crosslink the siloxane-based polymer. Comprised is a polydimethylsiloxane having a vinyl functional group and a polydimethylsiloxane having a silicon hydride functional group.

A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; (ii) a cyclic siloxane; and (iii) (iii) at least one of (A)(iii) (a) a branched organopolysiloxane having a particular formula or (A)(iii)(b) a terminating agent; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.

An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.