Patent classifications
C08G77/14
ELECTRICAL STEEL SHEET WITH INSULATING COATING
Disclosed is an electrical steel sheet with an insulating coating formed by applying a surface-treatment agent to at least one surface of the electrical steel sheet and drying the surface-treatment agent, wherein the surface-treatment agent contains: certain trialkoxysilane and/or dialkoxysilane (A); a silane coupling agent (B) that does not contain a polymerizable unsaturated group in its structure; plate-like silica (C); a polymerizable unsaturated-group-containing compound (D); and water, within a range satisfying the following conditions (1) to (3): (1) a mass ratio (A/B) of (A) to (B) is from 0.05 to 1.00; (2) a content of (C) is 2 mass % to 30 mass % with respect to a total mass of (A) to (D) in the surface-treatment agent; and (3) a content of (D) is 2 mass % to 18 mass % with respect to the total mass of (A) to (D) in the surface-treatment agent.
EPOXY-MODIFIED SILICONE FINE PARTICLE, A METHOD FOR PREPARING THE SAME, A THERMOSETTING RESIN COMPOSITION COMPRISING THE FINE PARTICLES AND AN ENCAPSULATING MATERIAL
One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin while having softness derived from silicone rubber and have excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing the same. The other purpose is to provide a thermosetting resin composition and an encapsulating material, each comprising the fine particles. The present invention provides an epoxy-modified silicone fine particle composed of (A) a spherical silicone rubber fine particle coated with (B) polyorganosilsesquioxane, wherein the spherical silicone rubber fine particle (A) has an average particle diameter of 0.1 to 100 μm and the polyorganosilsesquioxane (B) has an epoxy group-containing organic group.
PROCESS FOR PRODUCING HIGH-PURITY HYDROSILYLATION PRODUCTS
The present invention relates to a process for producing high-purity hydrosilylation products, and also to the products that may be produced by this process and to the use thereof as surfactants.
Optical laminate and image display device including the same
An optical laminate includes two substrates each of which has a tensile modulus in a range from 2,000 MPa to 7,500 MPa, and an adhesive layer interposed between the substrates. A storage modulus at 25° C. of the adhesive layer is 100 kPa or less, and a storage modulus at −20° C. of the adhesive layer is equal to or less than three times the storage modulus at 25° C. of the adhesive layer. The optical laminate and an image display device including the optical laminate may have an improved flexible property at various temperature ranges and may be capable of minimizing cracks when being bent.
Optical laminate and image display device including the same
An optical laminate includes two substrates each of which has a tensile modulus in a range from 2,000 MPa to 7,500 MPa, and an adhesive layer interposed between the substrates. A storage modulus at 25° C. of the adhesive layer is 100 kPa or less, and a storage modulus at −20° C. of the adhesive layer is equal to or less than three times the storage modulus at 25° C. of the adhesive layer. The optical laminate and an image display device including the optical laminate may have an improved flexible property at various temperature ranges and may be capable of minimizing cracks when being bent.
Thermosetting silicone resin composition and die attach material for optical semiconductor device
A thermosetting silicone resin composition contains the following components (A-1) to (D): (A-1) an alkenyl group-containing linear organopolysiloxane; (A-2) a branched organopolysiloxane shown by (R.sup.1.sub.3SiO.sub.1/2).sub.a(R.sup.2.sub.3SiO.sub.1/2).sub.b(SiO.sub.4/2).sub.c (1); (B-1) a branched organohydrogenpolysiloxane shown by (HR.sup.2.sub.2SiO.sub.1/2).sub.d(R.sup.2.sub.3SiO.sub.1/2).sub.e(SiO.sub.4/2).sub.f (2); (B-2) a linear organohydrogenpolysiloxane shown by (R.sup.2.sub.3SiO.sub.1/2).sub.2(HR.sup.2SiO.sub.2/2).sub.x(R.sup.2.sub.2SiO.sub.2/2).sub.y (3); (C) an adhesion aid which is an epoxy group-containing branched organopolysiloxane; and (D) a catalyst containing a combination of a zero-valent platinum complex with a divalent platinum complex and/or a tetravalent platinum complex. This provides a thermosetting silicone resin composition which causes little contamination at a gold pad portion and has excellent adhesiveness to a silver lead frame.
METHOD OF PRODUCING COATED ELECTRICAL STRIP AND COATED ELECTRICAL STRIP
A method of producing a coated electrical strip includes hydrolyzing a surface of a rolled aluminum-alloyed electrical strip. A pretreatment layer containing an organosilicon compound is applied over the surface of the rolled aluminum-alloyed electrical strip. Subsequently, the rolled aluminum-alloyed electrical strip coated with the pretreatment layer is coated with a baking varnish layer.
CURABLE POLYORGANOSILOXANE COMPOSITION AND ELECTRONIC COMPONENT
A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.
Radiation sensitive composition
A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b) Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d) Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.
Radiation sensitive composition
A radiation sensitive composition including a siloxane polymer exhibiting phenoplast crosslinking reactivity as a base resin, which is excellent in resolution and can be used as a radiation sensitive composition capable of allowing a pattern having a desired-shape to be formed with sufficient precision. A radiation sensitive composition including as a silane, a hydrolyzable silane, a hydrolysis product thereof, or a hydrolysis-condensation product thereof; and a photoacid generator, in which the hydrolyzable silane includes hydrolyzable silanes of Formula (1)
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4-(a+b) Formula (1)
wherein R.sup.1 is an organic group of Formula (1-2) ##STR00001##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.3 is a hydrolyzable group; and Formula (2)
R.sup.7.sub.cR.sup.8.sub.dSi(R.sup.9).sub.4-(c+d) Formula (2)
wherein R.sup.7 is an organic group of Formula (2-1) ##STR00002##
and is bonded to a silicon atom through a Si—C bond or a Si—O bond, and R.sup.9 is a hydrolyzable group.