Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.

Curable organopolysiloxane compositions and their cured products with superior properties are described as well as their uses as materials for optical devices, such as LEDs.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

A room-temperature-curable organopolysiloxane composition; a structure obtained from the composition; and a method for assessing the cured state of the composition are provided. The room-temperature-curable organopolysiloxane composition, which changes in color with the progress of curing from the uncured state, comprises the following ingredients: (A) 100 parts by mass of one or more organopolysiloxanes represented by formula (1)
HO(SiR.sub.2O).sub.nH  (1)
and/or formula (2) ##STR00001##
(with variables as defined herein); (B) 0.1-50 parts by mass of an organosilicon compound having at least three silicon-atom-bonded hydrolyzable groups in the molecule, which is not any of ingredients (A), (C), and (D), and/or a product of the partial hydrolytic condensation of the organosilicon compound; (C) 0.01-20 parts by mass of a curing catalyst; (D) 0.1-10 parts by mass of a silane coupling agent; and (E) 0.01-10 parts by mass of a pH indicator.

Provided is an antistatic polyimide-based film. More particularly, as an antistatic polyimide-based film for a window cover for protecting a surface of a display device, a window cover film having a protective film formed on the polyimide-based film provides an improvement to a problem of not being used as a film for a display window cover because a portion of the protective film remains on a base layer or a hard coating layer without being peeled off due to static electricity in the protective film or the base layer, or a hard coating layer, or the hard coating layer is peeled off with some or all of the protective film when the protective film is peeled off.

An epoxy-functionalized polyorganosiloxane toughener providing toughening properties for thermosetting resins is described. The epoxy-functionalized polyorganosiloxane toughener is an epoxy-functionalized siloxane polyether with a siloxane backbone, at least one epoxy-containing alkyl chain, and at least one alkoxyl polyether chain, each said at least one epoxy-containing alkyl chain and at least one alkoxyl polyether chain grafted to the siloxane backbone. Also disclosed is a thermosetting resin-based composition comprising the epoxy-functionalized polyorganosiloxane toughener of claim 1 and at least one of an epoxy resin, a hardener, and an accelerator.

An example of an array includes a support, a cross-linked epoxy polyhedral oligomeric silsesquioxane (POSS) resin film on a surface of the support, and a patterned hydrophobic polymer layer on the cross-linked epoxy POSS resin film. The patterned hydrophobic polymer layer defines exposed discrete areas of the cross-linked epoxy POSS resin film, and a polymer coating is attached to the exposed discrete areas. Another example of an array includes a support, a modified epoxy POSS resin film on a surface of the support, and a patterned hydrophobic polymer layer on the modified epoxy POSS resin film. The modified epoxy POSS resin film includes a polymer growth initiation site, and the patterned hydrophobic polymer layer defines exposed discrete areas of the modified epoxy POSS resin film. A polymer brush is attached to the polymer growth initiation site in the exposed discrete areas.

A method for producing a carbinol-modified organosiloxane, which comprises steps (A) to (C), is an efficient production method whereby it becomes possible to reduce the production of a by-product of the reaction for the production of a terminal-carbinol-modified organosiloxane. (A) a step of supplying the following components (a) to (c) to a tubular reactor continuously: (a) an organohydrogensiloxane represented by formula (I) ##STR00001## (wherein R.sup.1's independently represent a monovalent hydrocarbon group having 1 to 20 carbon atoms; and m represents an integer of 0 to 500); (b) a compound represented by formula (II):
R.sup.2—Z—OH (wherein R.sup.2 represents a vinyl group or an allyl group; and Z represents a bivalent hydrocarbon group); and (c) a platinum catalyst in an amount of 0.005 ppm by mass or more and less than 1.0 ppm by mass in terms of metal platinum content relative to the total amount of the components (a) to (c); (B) a step of subjecting the components (a) to (c) to a hydrosilylation reaction while allowing these components to pass through the tubular reactor; and (C) a step of removing a reaction product.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.

[Object] To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and in environmental durability; and further to provide a pattern-formation method employing the composition. [Means] The present invention provides a negative type photosensitive composition comprising: (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent.