Patent classifications
C08G77/14
Method for producing organopolysiloxane cured product, organopolysiloxane cured product, layered product, and optical part
Provided is a cured product using a composition that is capable of quick curing at low temperatures while having sufficient pot life at room temperature, a method of producing the same, a laminate, and an optical device. A method of producing an organopolysiloxane cured product is provided. The method includes: (i) performing, without irradiating with high-energy radiation, a hydrosilylation reaction upon a composition containing a first hydrosilylation reaction catalyst that exhibits activity in the composition and a second hydrosilylation reaction catalyst that does not exhibit activity when not irradiated with high-energy radiation, but exhibits activity in the composition when irradiated with high-energy radiation, to obtain a thickened material that is fluid at room temperature or a thermoplastic material that is non-fluid at room temperature but exhibits fluidity at 100° C.; and (ii) irradiating the thickened material or thermoplastic material obtained in step (i) with high-energy radiation to obtain a cured product.
Method for producing organopolysiloxane cured product, organopolysiloxane cured product, layered product, and optical part
Provided is a cured product using a composition that is capable of quick curing at low temperatures while having sufficient pot life at room temperature, a method of producing the same, a laminate, and an optical device. A method of producing an organopolysiloxane cured product is provided. The method includes: (i) performing, without irradiating with high-energy radiation, a hydrosilylation reaction upon a composition containing a first hydrosilylation reaction catalyst that exhibits activity in the composition and a second hydrosilylation reaction catalyst that does not exhibit activity when not irradiated with high-energy radiation, but exhibits activity in the composition when irradiated with high-energy radiation, to obtain a thickened material that is fluid at room temperature or a thermoplastic material that is non-fluid at room temperature but exhibits fluidity at 100° C.; and (ii) irradiating the thickened material or thermoplastic material obtained in step (i) with high-energy radiation to obtain a cured product.
HYDROPHOBIC COATING COMPOSITIONS
A coating composition is provided herein, wherein the coating composition includes an organic binder and a polyorganosiloxane, optionally with a hardener. There is also provided a process for making the same coating composition.
Silicone (meth)acrylates, process for their preparation and their use in curable compositions
A process can be used for preparing silicone (meth)acrylates, according to which at least one acetoxysilicone is reacted with at least one hydroxyfunctional (meth)acrylic acid ester. The corresponding silicone (meth)acrylates are useful, and can be used in curable compositions.
Process for producing polyoxyalkylene polysiloxane block polymers
SiOC-linked, linear polydimethylsiloxane-polyoxyalkylene block copolymers of formula (I) C—B-(AB).sub.a—C1 are produced by reaction of end-equilibrated α,ω-diacetoxypolydimethylsiloxanes with a mixture including at least one polyether polyol, preferably a polyether diol, and at least one polyether monool or at least one monohydric alcohol.
Method for manufacturing semiconductor device
Provided is a method for manufacturing a semiconductor device suitable for achieving low wiring resistance between semiconductor elements that is bonded via an adhesive layer and multi-layered. The method according to the present invention is as follows. First, a wafer laminate (W) is prepared, the wafer laminate (W) including a wafer (10) having a circuit forming surface (10a), a wafer (20) having a main surface (20a) and a back surface (20b), and an adhesive layer (30) containing an SiOC-based polymer. Then, a hole (H) is formed in the wafer laminate (W) by etching the wafer laminate (W) from the wafer (20) side via a mask pattern masking a portion of the main surface (20a) side of the wafer (20), the hole (H) extending through the wafer (20) and the adhesive layer (30) and reaching a wiring pattern (12b) in the wafer (10). Then, an insulating film (41) is formed on an inner surface of the hole (H). Then, the insulating film (41) on a bottom surface of the hole (H) is removed. Then, the wafer laminate (W) is subjected to a cleaning treatment (an oxygen plasma treatment and/or an Ar sputtering treatment). Then, a conductive portion is formed in the hole (H).
Macromolecular networks and process for making same
The present invention relates to processes for making macromolecular networks, macromolecular networks made by such processes, and methods of using such macromolecular networks to make materials such as ceramics. The macromolecular network's formation rate is controlled by using two species of reactants each of which comprised one functionality. This results in decreased macromolecular network processing costs and superior products.
RESIN COMPOSITION FOR GOLF BALL COVER
The present disclosure provides a resin composition for a golf ball cover. The resin composition includes a thermoplastic polyurethane resin including 55 to 70 parts by weight of a polyol, 30 to 40 parts by weight of an isocyanate, and 0.2 to 0.4 parts by weight of a polysiloxane. The polysiloxane includes at least one hydroxyl group or a carboxyl group in the terminal alkyl group. The polyol and the isocyanate constitute a silicone-free thermoplastic polyurethane resin, and the polysiloxane and the isocyanate constitute a thermoplastic polyurethane resin that includes silicone in the main chain, thereby improving the scuff resistance and slip property required for a golf ball cover.
METHOD FOR MANUFACTURING ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, ROOM-TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, AND ARTICLE
Through the present invention, by undergoing a step in which a straight-chain diorganopolysiloxane having silanol groups at both terminal ends of the molecular chain thereof, a hydrolyzable silane and/or a partial hydrolysis condensate thereof having a hydrolyzable group capable of detaching a lactic acid ester, and an amino-group-containing hydrolyzable organosilane and/or a partial hydrolysis condensate thereof are pre-mixed/reacted in advance and silanol groups at both terminal ends of the molecular chain of a main agent (base polymer) are blocked by specific hydrolyzable silyl groups, it is possible to manufacture a lactic-acid-ester-type room-temperature-curable organopolysiloxane composition excellent in all characteristics including curability, adhesive properties, workability, and the like that were not attainable by the conventional lactic-acid-ester-type room-temperature curable (RTV) silicone rubber composition.
SEALANT COMPOSITION
A one-part low modulus room temperature vulcamsable (RTV) silicone composition comprising a titanate and/or zirconate catalyst which cures to a low modulus silicone elastomer which has a good adhesion profile and may be used as a non-staining (clean) sealant having high movement capability which compositions contains an aminosilane adhesion promoter having two hydroxyl or hydrolysable groups per molecule in an amount of 0.1-3.75% by weight of the composition.