Patent classifications
C08G77/20
EXTRUDABLE CERAMIC PRECURSOR MIXTURES AND METHODS OF USE
An extrudable ceramic precursor mixture and method of use includes: an inorganic ceramic-forming component, a first siloxane prepolymer, a second siloxane prepolymer with a different composition than the first siloxane prepolymer, a catalyst adapted to catalyze polymerization of the first siloxane prepolymer with the second siloxane prepolymer into a siloxane-based polymer, and a thermally curable siloxane-based cross-linking agent adapted to crosslink the siloxane-based polymer. Comprised is a polydimethylsiloxane having a vinyl functional group and a polydimethylsiloxane having a silicon hydride functional group.
COMPOSITION FOR PREPARING A RELEASE COATING
A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; (ii) a cyclic siloxane; and (iii) (iii) at least one of (A)(iii) (a) a branched organopolysiloxane having a particular formula or (A)(iii)(b) a terminating agent; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.
COMPOSITION FOR PREPARING A RELEASE COATING
A composition for forming a release coating is disclosed. The composition comprises (A) an organopolysiloxane comprising the reaction product of: (i) a silicone resin having a particular formula; (ii) a cyclic siloxane; and (iii) (iii) at least one of (A)(iii) (a) a branched organopolysiloxane having a particular formula or (A)(iii)(b) a terminating agent; in the presence of a polymerization catalyst. The composition further comprises (B) an organopolysiloxane including an average of at least two silicon-bonded ethylenically unsaturated groups per molecule.
THERMALLY CONDUCTIVE ADDITION CURING SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME
This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.
THERMALLY CONDUCTIVE ADDITION CURING SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME
This thermally conductive addition curing silicone composition contains: a heated mixture of an organopolysiloxane having at least two alkenyl groups bonded to silicon atoms in one molecule, an organohydrogen polysiloxane having at least three hydrogen atoms bonded to silicon atoms in one molecule, and aluminum oxide particles having an Na.sup.+ ion level of 50 ppm or less when an aluminum oxide powder is heat extracted by pure water for 24 hours at 60° C. and the resultant water layer is measured by ion chromatography, the aluminum oxide particles having been surface-treated by the organohydrogen polysiloxane; an organohydrogen polysiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule; and a platinum group metal catalyst. Said composition can be applied to the inside of a module including electrical/electronic components and a circuit board on which these compounded are mounted, and can exhibit exceptional post-curing stress relaxation properties and thermal conductivity.
HEAT CONDUCTIVE SHEET AND METHOD FOR PRODUCING SAME
An object is to provide a heat conductive sheet having good handleability when mounting between the heating element and the heat dissipator, and softness that enables the distortion of the heating element, the heat dissipator, and the like to be suppressed in use. The heat conductive sheet contains: a matrix comprising a cured product of organopolysiloxane; and heat conductive fillers comprising anisotropic fillers with their major axes oriented in the thickness direction, and has a load property P represented b formula (1) below of 0.1 to 0.7: Load property P=(F.sub.30−F.sub.20)/F.sub.10 (1) wherein F.sub.10 is a load of the heat conductive sheet at 10% compression, F.sub.20 is a load of the heat conductive sheet at 20% compression, and F.sub.30 is a load of the heat conductive sheet at 30% compression.
ADHESIVE COMPOSITION, LAMINATE AND METHOD FOR PRODUCING SAME, METHOD FOR PEELING LAMINATE, AND METHOD FOR PROCESSING SEMICONDUCTOR-FORMING SUBSTRATE
The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa.Math.S) or higher.
SILICONE FORMULATION WITH HIGH TEMPERATURE STABILITY AND CLARITY
The present disclosure is directed to a radiation curable composition comprising a (meth)acrylate functionalized polysiloxane polymer. In some embodiments the composition further comprises one or more of a crosslinker, fumed silica, a functionalized silsesquioxane, and/or an acrylate monomer. The composition can be used as a component of an adhesive, sealant or coating. In some embodiments the composition can be used as a curable resin for additive manufacturing. The compositions are low viscosity liquids at room temperature and resist compression set.
(Meth)acrylic-modified siloxane compound
The present, invention aims to provide an additive which has a reactive group with good active energy ray curability. When incorporated in a paint, the additive does not bleed over time and imparts an excellent leveling property and a defoaming property to the paint. There is provided a (meth)acrylic-modified siloxane compound of formula (a1) which has, as a branch and, optionally, at one or both of the terminals, of a linear polysiloxane backbone, a specific number of moieties having a (meth)acryloyl group at a terminal and a (poly)oxyalkylene structure of the formula —(C.sub.aH.sub.2aO).sub.b—. Also provided is an additive for paints, comprising said (meth)acrylic-modified siloxane compound.
(Meth)acrylic-modified siloxane compound
The present, invention aims to provide an additive which has a reactive group with good active energy ray curability. When incorporated in a paint, the additive does not bleed over time and imparts an excellent leveling property and a defoaming property to the paint. There is provided a (meth)acrylic-modified siloxane compound of formula (a1) which has, as a branch and, optionally, at one or both of the terminals, of a linear polysiloxane backbone, a specific number of moieties having a (meth)acryloyl group at a terminal and a (poly)oxyalkylene structure of the formula —(C.sub.aH.sub.2aO).sub.b—. Also provided is an additive for paints, comprising said (meth)acrylic-modified siloxane compound.