The disclosure relates to sidechain functionalized organosiloxane compounds comprising polyalkyleneoxide (POA) and/or polyalkyleneoxide coupled zwitterionic moieties with various other modular side chains including reactive and or non-reactive groups. The present disclosure further also pertains to ice-phobic polymer formulations capable of curing on a substrate to form a surface that is ice-phobic, resistant to ice formation, and/or resistant to ice adhesion. The disclosed ice-phobic polymer formulations comprise one or more disclosed sidechain functionalized organosiloxane compound, one or more binder resin, and/or one or more lubricating liquid. The present disclosure further relates to articles comprising the disclosed ice-phobic polymer compositions, thereby providing articles having ice-phobic properties. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A one-component curable organopolysiloxane composition that has excellent storage stability, favorable curability and adhesion at relatively low temperatures, and an appropriate pot life is provided. In particular, the composition has excellent curability even at temperatures of 80° C. or lower and excellent adhesion to resins such as polyester, polyphenylene sulfide, and the like. Furthermore, the composition can be cured in a short period of time by increasing the temperature to a high temperature when rapid curing is required. The composition comprises: (A) an organopolysiloxane having at least two alkenyl groups in each molecule thereof; (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; (C) a photo-active hydrosilylation reaction catalyst; (D) a condensation reaction catalyst; (E) a curing inhibitor; and (F) an adhesion imparting agent having at least one terminal trialkoxysilyl group.

The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.

The invention relates to a method of additive manufacturing an object using a 3D printing apparatus, in which at least one layer or part of at least one layer is formed by an addition-crosslinking electro-conductive silicone composition comprising : (A) at least one organopolysiloxane compound A comprising, per molecule at least two C.sub.2- C.sub.6 alkenyl radicals bonded to silicon atoms, (B) at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom, (C) at least one catalyst C comprising at least one metal from the platinum group or the compound thereof, (D) at least one reinforcing silica filler D, (E) at least one thixotropic agent which is selected from compounds having epoxy group, (poly)ether group, and/or (poly)ester group, organopolysiloxane having an aryl group and mixtures thereof; (F) at least one electro-conductive filler F, which is selected from nickel coated carbon, preferably graphite, graphene or mixtures thereof; (G) optionally at least one crosslinking inhibitor G.

A laminate body including a base material and a flat silicone sealing layer adhered thereto, generally without any voids, is provided. Also provided is a curable hot melt silicone composition layer with a particular curable hot melt silicone composition, providing a laminate body that does not readily cause stress on a substrate after the curable hot melt silicone composition is cured. A laminate body comprises a base material, and a curable hot melt silicone composition layer in contact with the base material. The curable hot melt silicone composition includes an organopolysiloxane resin containing siloxane units selected from a group containing T units or Q units making up at least 20 mol % or more of all siloxane units. The curable hot melt silicone composition generally has a melt viscosity as measured using a flow tester at a pressure of 2.5 MPa and at 100° C. of 5,000 Pa.Math.s or less.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

Provided is a hydrosilylation reactive composition that has a sufficient pot life at room temperature, that can be cured at low temperature by exposure to high energy radiation, and that produces a stable semi-cured product during the curing process, and to provide a semi-cured product and a cured product obtained using this hydrosilylation reactive composition. The composition comprises: (A) a compound containing at least one aliphatically unsaturated monovalent hydrocarbon group in the molecule; (B) a compound containing at least two hydrogen atoms bonded to silicon atoms in the molecule; (C) a first hydrosilylation catalyst exhibiting activity in the composition without exposure to high energy radiation; and (D) a second hydrosilylation catalyst not exhibiting activity unless exposed to high energy radiation, and exhibiting activity in the composition by exposure to high energy radiation.

A siloxane polymer comprising polysiloxane, silphenylene, isocyanuric acid, and polyether skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the siloxane polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency and light resistance.

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).

Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm.sup.2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m.Math.° C.) per 100 total parts by mass of components (A) and (B).