An autohesive polymer material that includes: at least one polymer having at least two terminal silyl groups of the Formula (1) given by:
Si(R.sup.1).sub.a(R.sup.2).sub.b  (1).
Each of the radicals R.sup.1 comprises an alkyl, alkenyl or aryl group or a hydrogen atom. Each of the radicals R.sup.2 comprises a group that can be eliminated with water, b is 1, 2 or 3, and a is 3−b. The polymer material further includes at least one condensation catalyst. Further, the polymer material is chemically precrosslinked and further crosslinkable with moisture. In addition, the polymer material is configured for use as a layer body that can be applied to a substrate. The polymer material of this kind can also be used for producing permanent bonds.

An autohesive polymer material that includes: at least one polymer having at least two terminal silyl groups of the Formula (1) given by:
Si(R.sup.1).sub.a(R.sup.2).sub.b  (1).
Each of the radicals R.sup.1 comprises an alkyl, alkenyl or aryl group or a hydrogen atom. Each of the radicals R.sup.2 comprises a group that can be eliminated with water, b is 1, 2 or 3, and a is 3−b. The polymer material further includes at least one condensation catalyst. Further, the polymer material is chemically precrosslinked and further crosslinkable with moisture. In addition, the polymer material is configured for use as a layer body that can be applied to a substrate. The polymer material of this kind can also be used for producing permanent bonds.

A laminate body is provided, in which two or more organopolysiloxane cured films are obtained by curing curable organopolysiloxane compositions having different compositions because, e.g., the functions required for a dielectric layer and electrode layer are different. In general, problems such as peeling and defects due to insufficient adhesive strength and trackability do not easily occur at an interface between the cured films forming the laminate body. Applications and methods are also provided. The laminate body comprises a structure with two or more laminated organopolysiloxane cured films with different compositions. At least a portion of functional groups involved in the curing reaction are the same. The laminated cured films have structures chemically bonded at an interface thereof. Typically, the compositions both contain a hydrosilylation reactive group, and a SiH/Vi ratio in the compositions differ, with the laminated cured films having structures chemically bonded by hydrosilylation reactions at an interface thereof.

A laminate body is provided, in which two or more organopolysiloxane cured films are obtained by curing curable organopolysiloxane compositions having different compositions because, e.g., the functions required for a dielectric layer and electrode layer are different. In general, problems such as peeling and defects due to insufficient adhesive strength and trackability do not easily occur at an interface between the cured films forming the laminate body. Applications and methods are also provided. The laminate body comprises a structure with two or more laminated organopolysiloxane cured films with different compositions. At least a portion of functional groups involved in the curing reaction are the same. The laminated cured films have structures chemically bonded at an interface thereof. Typically, the compositions both contain a hydrosilylation reactive group, and a SiH/Vi ratio in the compositions differ, with the laminated cured films having structures chemically bonded by hydrosilylation reactions at an interface thereof.

The present invention is a composition for forming a silicon-containing resist underlayer film, containing one or both of a hydrolysis product and a hydrolysis condensate of one or more silicon compounds (A-1) shown by the following general formula (1). This provides: a composition for forming a silicon-containing resist underlayer film with which it is possible to form a resist underlayer film having favorable adhesiveness to resist patterns regardless of whether in negative development or positive development, and also having favorable adhesiveness to finer patterns as in EUV photo-exposure; a patterning process; and a silicon compound.

##STR00001##

A film-forming composition is suitable as a resist underlayer film-forming composition capable of forming an Si-containing resist underlayer film that exhibits favorable adhesion to an EUV resist and favorable etching processability because of high rate of etching with fluorine. A film-forming composition, for example, including a polymer of Formula (E1) and a solvent.

##STR00001##

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

A curable organopolysiloxane composition is provided which forms a pressure sensitive adhesive (PSA) layer having a low storage elastic modulus (G′), excellent curability, and sufficient adhesion, along with applications thereof. A PSA layer-forming organopolysiloxane composition comprises: (A) a chain organopolysiloxane having alkenyl groups; (B) an organopolysiloxane resin wherein the weight average molecular weight (Mw) thereof is less than 4500 and the sum of the content of hydroxyl groups, etc. is 9 mole % or less; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst; and optionally, (A′) a chain organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule. The mass ratio of the organopolysiloxane resin (B) to the chain organopolysiloxane (A) is within a specific range and the shear storage elastic modulus G′ at −20° C. of a PSA layer obtained by curing the composition is within a range of 0.01 to 1.0 MPa.

A moisture-curing, condensation-crosslinking silicone composition that can be used as elastic adhesives and sealants. The silicone composition shows homogeneous depth curing, such that it cures through even under movement without forming cracks. The silicone composition contains at least one polyorganosiloxane having Si(OR.sup.3).sub.3 end groups, at least one condensation catalyst and at least one crosslinker having hydrolyzable radicals, characterized in that the polymer end groups Si(OR.sup.3) have a reaction rate in the crosslinking reaction that is at least equal to and preferably higher than the hydrolyzable radicals of the at least one crosslinker.

A moisture-curing, condensation-crosslinking silicone composition that can be used as elastic adhesives and sealants. The silicone composition shows homogeneous depth curing, such that it cures through even under movement without forming cracks. The silicone composition contains at least one polyorganosiloxane having Si(OR.sup.3).sub.3 end groups, at least one condensation catalyst and at least one crosslinker having hydrolyzable radicals, characterized in that the polymer end groups Si(OR.sup.3) have a reaction rate in the crosslinking reaction that is at least equal to and preferably higher than the hydrolyzable radicals of the at least one crosslinker.