Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can shrink micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.

The invention relates to a crosslinkable composition X, comprising: at least one organopolysiloxane compound A comprising, per molecule, at least two C2-C6 alkenyl radicals bonded to silicon atoms; at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom; at least one catalyst C which is a complex corresponding to the following formula: [Fe(L1)2] in which: the symbol Fe represents iron at degree of oxidation II; the symbols L1, which may be identical or different, represent a ligand which is a -dicarbonylato anion or the enolate anion of a -dicarbonylated compound; optionally at least one adhesion promoter D; and optionally at least one charge E. The invention also relates to the use of the previously described catalyst C as silicone composition crosslinking catalyst, to a silicone composition crosslinking method, wherein it comprises heating the composition X to a temperature of between 70 and 200 C., and to the resulting crosslinked silicone material Y.

The invention relates to a crosslinkable composition X, comprising: at least one organopolysiloxane compound A comprising, per molecule, at least two C2-C6 alkenyl radicals bonded to silicon atoms; at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom; at least one catalyst C which is a complex corresponding to the following formula: [Fe(L1)2] in which: the symbol Fe represents iron at degree of oxidation II; the symbols L1, which may be identical or different, represent a ligand which is a -dicarbonylato anion or the enolate anion of a -dicarbonylated compound; optionally at least one adhesion promoter D; and optionally at least one charge E. The invention also relates to the use of the previously described catalyst C as silicone composition crosslinking catalyst, to a silicone composition crosslinking method, wherein it comprises heating the composition X to a temperature of between 70 and 200 C., and to the resulting crosslinked silicone material Y.

A dihaloorganosilane is represented by the formula (I): Each X independently represents Cl, Br, or I. Each Ar.sup.1 independently represents a phenylene group optionally substituted by 1 to 4 alkyl groups selected from methyl or ethyl. Each R.sup.1 independently represents an alkylene group having from 2 to 18 carbon atoms. Each R.sup.2 independently represents methyl or ethyl. Each R.sup.3 independently represents an alkylene group having from 1 to 18 carbon atoms. Each R.sup.4 independently represents an alkylene group having from 2 to 18 carbon atoms, and n is an integer in a range of 0 to 5, inclusive. Ionic organosilanes preparable from the dihaloorganosilanes are represented by the formula (II): Membrane compositions and membranes containing the ionic organosilanes are also disclosed. ##STR00001##

Processing methods are described for improving the physical properties of elastomeric materials including elastomeric tubing. The methods include heating tubing in a post-cured step for a specified time and at a specified temperature. The methods also include irradiating the tubing with a desired dose of radiation. Embodiments can include treatment of silicon-based elastomers and/or non-silicon-based elastomers. The improved elastomers can be utilized in pumps.

Processing methods are described for improving the physical properties of elastomeric materials including elastomeric tubing. The methods include heating tubing in a post-cured step for a specified time and at a specified temperature. The methods also include irradiating the tubing with a desired dose of radiation. Embodiments can include treatment of silicon-based elastomers and/or non-silicon-based elastomers. The improved elastomers can be utilized in pumps.

Impure gaseous hydrogen chloride from organochlorosilane hydrolysis is freed of impurities by first scrubbing with an organochlorosilane, which may be the same or different from the organochlorosilane(s) hydrolyzed, and then further scrubbing with chloromethane. The purified gaseous hydrogen chloride is preferably used in chlorosilane synthesis.

The invention relates to a crosslinkable composition X, comprising: at least one organopolysiloxane compound A comprising, per molecule, at least two C2-C6 alkenyl radicals bonded to silicon atoms; at least one organohydrogenopolysiloxane compound B comprising, per molecule, at least two hydrogen atoms bonded to an identical or different silicon atom; at least one catalyst C which is a complex corresponding to the following formula: [Co(L1)2] in which: the symbol Co represents cobalt at degree of oxidation II; the symbols L1, which may be identical or different, represent a ligand which is a -dicarbonylato anion or the enolate anion of a -dicarbonylated compound; optionally at least one adhesion promoter D; and optionally at least one charge E. The invention also relates to the use of the previously described catalyst C as silicone composition crosslinking catalyst, to a silicone composition crosslinking method, characterized in that it consists in heating the composition X to a temperature of between 70 and 200 C., and to the resulting crosslinked silicone material Y.

Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can shrink micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.

Described herein is a highly effective route towards the controlled and isotropic reduction in size-scale, of complex 3D structures using silicone network polymer chemistry. In particular, a class of silicone structures were developed that once patterned and cured can shrink micron scale additive manufactured and lithographically patterned structures by as much as 1 order of magnitude while preserving the dimensions and integrity of these parts. This class of silicone materials is compatible with existing additive manufacture and soft lithographic fabrication processes and will allow access to a hitherto unobtainable dimensionality of fabrication.