A cross-linked composition is disclosed. In various embodiments, the cross-linked composition comprises the reaction product of: a first siloxane having at least one pendant polycyclic anhydride group; a second siloxane having at least one pendant polycyclic anhydride group; and a polyol having at least two hydroxyl groups reactive with the pendant polycyclic anhydride groups of the first and second siloxanes. A personal care composition is also provided. The personal care composition comprises a cross-linked composition having at least two carboxyl groups. In various embodiments, the cross-linked composition is as described above. The personal care composition further comprises a least one cosmetic component; optionally in a cosmetically acceptable medium. Methods of forming the cross-linked composition and the personal care composition are also disclosed. A polycyclic anhydride composition and polyorganosiloxane composition are also disclosed.

The present invention relates to gels and processes for making ceramic nanostructures, ceramic nanostructures made by such processes, and methods of using such ceramic nanostructures. Such process is templated via block copolymer self-assembly but does not require any post processing thermal and/or solvent annealing steps. As a result, such process is significantly more efficient and scalable than other processes that are templated via block copolymer self-assembly and yields a ceramic having a pore structure/shape that provides the ceramic with a higher ductility than traditional ceramics.

The present invention relates to gels and processes for making ceramic nanostructures, ceramic nanostructures made by such processes, and methods of using such ceramic nanostructures. Such process is templated via block copolymer self-assembly but does not require any post processing thermal and/or solvent annealing steps. As a result, such process is significantly more efficient and scalable than other processes that are templated via block copolymer self-assembly and yields a ceramic having a pore structure/shape that provides the ceramic with a higher ductility than traditional ceramics.

To provide a mixed composition which is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) and furthermore which is excellent in storage stability and is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) even if stored for a long period of time and then formed into a film. To further provide a film obtained by curing the mixed composition, and glass having the film. A mixed composition of a compound (A1) represented by formula (a1), an organosilicon compound (B) represented by formula (b1), and a solvent (E), wherein the solvent (E) comprises a compound (E1) satisfying a Hansen solubility parameter of 18 (J/cm.sup.3).sup.1/2 or more and 23.5 (J/cm.sup.3).sup.1/2 or less and a hydrogen bonding term (δH) of the Hansen solubility parameter, of 5.5 (J/cm.sup.3).sup.1/2 or more.

To provide a mixed composition which is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) and furthermore which is excellent in storage stability and is capable of forming a film excellent in liquid-repellent property (water-repellent property in particular) even if stored for a long period of time and then formed into a film. To further provide a film obtained by curing the mixed composition, and glass having the film. A mixed composition of a compound (A1) represented by formula (a1), an organosilicon compound (B) represented by formula (b1), and a solvent (E), wherein the solvent (E) comprises a compound (E1) satisfying a Hansen solubility parameter of 18 (J/cm.sup.3).sup.1/2 or more and 23.5 (J/cm.sup.3).sup.1/2 or less and a hydrogen bonding term (δH) of the Hansen solubility parameter, of 5.5 (J/cm.sup.3).sup.1/2 or more.

A composition comprising: (a) a component comprising units of Ar.sup.1SiO.sub.3/2, wherein Ar.sup.1 is C.sub.6-C.sub.20 aryl and units of PhCH.sub.3SiO.sub.2/2, and having M.sub.w from 20,000 to 90,000; and (b) an elastomeric component comprising: (i) a straight-chain organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (ii) a branched-chain organopolysiloxane having formula: (RSiO.sub.3/2)a(R.sub.2SiO.sub.2/2)b(R.sub.3SiO.sub.1/2)c(SiO.sub.4/2)d(XO.sub.1/2)e where each R is the same or different C.sub.1-C.sub.20 hydrocarbyl group, 0.1 to 40 mole % of all R's are alkenyl, more than 10 mole % of all R's are C.sub.6-C.sub.20 aryl, X is a hydrogen atom or alkyl, a is 0.45 to 0.95, b is 0 to 0.25, c is 0.05 to 0.5, d is 0 to 0.1, e is 0 to 0.1, c/a is 0.1 to 0.5; (iii) an organopolysiloxane having at least two silicon-bonded hydrogen atoms; and (iv) a hydrosilylation catalyst.

A composition comprising: (a) a component comprising units of Ar.sup.1SiO.sub.3/2, wherein Ar.sup.1 is C.sub.6-C.sub.20 aryl and units of PhCH.sub.3SiO.sub.2/2, and having M.sub.w from 20,000 to 90,000; and (b) an elastomeric component comprising: (i) a straight-chain organopolysiloxane having at least two silicon-bonded alkenyl groups and at least one silicon-bonded aryl group; (ii) a branched-chain organopolysiloxane having formula: (RSiO.sub.3/2)a(R.sub.2SiO.sub.2/2)b(R.sub.3SiO.sub.1/2)c(SiO.sub.4/2)d(XO.sub.1/2)e where each R is the same or different C.sub.1-C.sub.20 hydrocarbyl group, 0.1 to 40 mole % of all R's are alkenyl, more than 10 mole % of all R's are C.sub.6-C.sub.20 aryl, X is a hydrogen atom or alkyl, a is 0.45 to 0.95, b is 0 to 0.25, c is 0.05 to 0.5, d is 0 to 0.1, e is 0 to 0.1, c/a is 0.1 to 0.5; (iii) an organopolysiloxane having at least two silicon-bonded hydrogen atoms; and (iv) a hydrosilylation catalyst.

A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R.sup.1SiO.sub.3/2, 10 to 70 mol % of (R.sup.1).sub.2SiO.sub.2/2 and 0 to 30 mol % of (R.sup.1).sub.3SiO.sub.1/2 units, having Mw of 5,000-100,000, and containing at least a part of the (R.sup.1).sub.2SiO.sub.2/2 unit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

A curable organosilicon resin composition is provided comprising (A) an organopolysiloxane of block polymer structure consisting of 30 to 80 mol % of R.sup.1SiO.sub.3/2, 10 to 70 mol % of (R.sup.1).sub.2SiO.sub.2/2 and 0 to 30 mol % of (R.sup.1).sub.3SiO.sub.1/2 units, having Mw of 5,000-100,000, and containing at least a part of the (R.sup.1).sub.2SiO.sub.2/2 unit having an average number of 3 to 80 repetitions, at least two silicon-bonded alkenyl groups per molecule, 0.001 to 1.0 mol/100 g of silicon-bonded hydroxyl groups, and up to 1.0 mol/100 g of silicon-bonded alkoxy groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups and at least one silicon-bonded aryl group per molecule, and (C) a hydrosilylation catalyst.

A composition for planarizing a semiconductor device surface includes a catalyst, at least one solvent, and at least one polysiloxane resin including polysilsesquioxane blocks and polydisiloxane blocks. The polydisiloxane blocks are according to the general formula: ##STR00001##
wherein R.sub.1, R.sub.2 are each independently selected from the group consisting of: an aryl group or an alkyl group, with substituted or unsubstituted carbons.