Polymers bearing the following structural elements per molecule: (A) an average of at least two alkoxylated (poly)alkylenimine units, said alkylene being selected from C.sub.2-C.sub.10-alkylene and said alkoxylation being selected from ethoxylation, propoxylation, butoxylation and combinations of at least two of the foregoing, (B) at least one polysiloxane unit, and (C) at least one linkage connecting at least two different alkoxylated (poly)alkylenimine units (A) bearing at least one polysiloxane unit (B), each link-age (C) being selected from organic spacers bearing in the range of from 4 to 30 carbon atoms.

The subject of the present invention is the use of a porous or non-porous organosilicon material for eliminating radionuclides, mineral anions, anionic molecular entities and negatively charged dyes or active principles from an aqueous solution, characterized in that the structure of said organosilicon material is formed of repeat units, each repeat unit comprising at least one positively charged entity selected from an ammonium entity, an imidazolium entity, a guanidinium entity, a pyridinium entity and a phosphonium entity and being incorporated into a silicon network by at least two silicon-carbon bonds. The invention also relates to a specific novel organosilicon material, comprising at least one benzyl group, one 4-phenylbenzyl group or one styrene group in each repeat unit.

The subject of the present invention is the use of a porous or non-porous organosilicon material for eliminating radionuclides, mineral anions, anionic molecular entities and negatively charged dyes or active principles from an aqueous solution, characterized in that the structure of said organosilicon material is formed of repeat units, each repeat unit comprising at least one positively charged entity selected from an ammonium entity, an imidazolium entity, a guanidinium entity, a pyridinium entity and a phosphonium entity and being incorporated into a silicon network by at least two silicon-carbon bonds. The invention also relates to a specific novel organosilicon material, comprising at least one benzyl group, one 4-phenylbenzyl group or one styrene group in each repeat unit.

The present disclosure provides an adhesive composition including a silicone-based adhesive and cellulose nanocrystals dispersed in the silicone-based adhesive. The present disclosure also provides an article including a substrate and a layer of the adhesive composition adhered to the substrate. Further, the present disclosure provides a method of making an adhesive composition. The method comprises mixing cellulose nanocrystals in a silicone-based adhesive to disperse the cellulose nanocrystals. The present disclosure additionally provides a method of making an article including disposing a layer of the adhesive composition on a substrate. The presence of the cellulose nanocrystals advantageously increases the water uptake capacity of the silicone-based adhesive while maintaining acceptable adhesive performance.

The present disclosure provides an adhesive composition including a silicone-based adhesive and cellulose nanocrystals dispersed in the silicone-based adhesive. The present disclosure also provides an article including a substrate and a layer of the adhesive composition adhered to the substrate. Further, the present disclosure provides a method of making an adhesive composition. The method comprises mixing cellulose nanocrystals in a silicone-based adhesive to disperse the cellulose nanocrystals. The present disclosure additionally provides a method of making an article including disposing a layer of the adhesive composition on a substrate. The presence of the cellulose nanocrystals advantageously increases the water uptake capacity of the silicone-based adhesive while maintaining acceptable adhesive performance.

The present invention relates to a high-temperature resistant modified silicon-containing cyanate ester resin as well as a preparation method and an application thereof. The preparation method comprises the following steps: adding a mixed solution of hydroxyl silicone oil, a silane coupling agent and an organic solvent into a mixed solution of a tetramethylammonium hydroxide aqueous solution and a polar solvent, performing hydrolytic polycondensation at a temperature of 5-40 C. for 4-8 h, and performing distillation to obtain an epoxy-containing silsesquioxane; performing pre-polymerization on the epoxy-containing silsesquioxane and a cyanate ester resin at a temperature of 50-100 C. for 1-8 h to obtain a modified cyanate ester resin; and uniformly mixing the modified cyanate ester resin and a modified anhydride, thereby obtaining the high-temperature resistant modified silicon-containing cyanate ester resin.

The present invention relates to a high-temperature resistant modified silicon-containing cyanate ester resin as well as a preparation method and an application thereof. The preparation method comprises the following steps: adding a mixed solution of hydroxyl silicone oil, a silane coupling agent and an organic solvent into a mixed solution of a tetramethylammonium hydroxide aqueous solution and a polar solvent, performing hydrolytic polycondensation at a temperature of 5-40 C. for 4-8 h, and performing distillation to obtain an epoxy-containing silsesquioxane; performing pre-polymerization on the epoxy-containing silsesquioxane and a cyanate ester resin at a temperature of 50-100 C. for 1-8 h to obtain a modified cyanate ester resin; and uniformly mixing the modified cyanate ester resin and a modified anhydride, thereby obtaining the high-temperature resistant modified silicon-containing cyanate ester resin.

A polysiloxazane compound including a repeating unit of the following general formula (1), and having a number average molecular weight of 500 to 100,000 as measured by gel permeation chromatography versus polystyrene standards,

##STR00001##

wherein R.sup.1 and R.sup.2 each independently represent a substituted or unsubstituted C.sub.1-C.sub.50 monovalent hydrocarbon group optionally containing a hetero atom, Xs each independently represent a methyl group, an oxygen atom, NHSiX.sub.2, or (NH).sub.(3-r)/2SiR.sup.1R.sup.2.sub.r (R.sup.1 and R.sup.2 have the same meaning as provided above), or Xs are joined to one another to represent an oxygen atom, n is an integer of 0 to 8, when the number of NHSiX.sub.2 is denoted by p, p satisfies 0p/(2n+4)0.5, r is an integer of 0, 1, or 2, and a and b are numbers satisfying 0<a1, 0b<1, and a+b=1.

The present invention relates to a formulation suitable for the preparation of a highly refractive encapsulation material with good barrier properties towards water vapor for an LED, to an encapsulation material for an LED having a high refractive index and good barrier properties towards water vapor which is obtainable from said formulation and to a light emitting device (LED) comprising said encapsulation material. The formulation comprises a polymer comprising a first repeating unit U.sup.1 and a second repeating unit U.sup.2; and a surface-modified nanoparticle, wherein the surface-modified nanoparticle does not contain any zirconium dioxide.

The present invention relates to a formulation suitable for the preparation of a highly refractive encapsulation material with good barrier properties towards water vapor for an LED, to an encapsulation material for an LED having a high refractive index and good barrier properties towards water vapor which is obtainable from said formulation and to a light emitting device (LED) comprising said encapsulation material. The formulation comprises a polymer comprising a first repeating unit U.sup.1 and a second repeating unit U.sup.2; and a surface-modified nanoparticle, wherein the surface-modified nanoparticle does not contain any zirconium dioxide.