Patent classifications
C08G77/50
Methods and apparatus for conducting heat exchanger based reactions
Methods, apparatus and systems using heat exchanger reactors to form polymer derived ceramic materials, including methods for making polysilocarb (SiOC) precursors.
Methods and apparatus for conducting heat exchanger based reactions
Methods, apparatus and systems using heat exchanger reactors to form polymer derived ceramic materials, including methods for making polysilocarb (SiOC) precursors.
Curable composition
A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one selected from a hydroxyl and hydrolyzable group, and a group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is 5 or more, the occurrence order of the respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is 1.0 or more, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3, at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.
Curable composition
A curable composition including a perfluoro(poly)ether group-containing silane compound having two or more Si atoms each bonding to at least one selected from a hydroxyl and hydrolyzable group, and a group represented by: —(OC.sub.6F.sub.12).sub.a—(OC.sub.5F.sub.10).sub.b—(OC.sub.4F.sub.8).sub.c—(OC.sub.3X.sup.10.sub.6).sub.d—(OC.sub.2F.sub.4).sub.e—(OCF.sub.2).sub.f—, wherein a, b, c and d are each independently an integer of 0 to 30, e and f are each independently an integer of 1 to 200, the sum of a, b, c, d, e and f is 5 or more, the occurrence order of the respective repeating units with the subscript a, b, c, d, e or f is not limited, a ratio of e to f is 1.0 or more, and each X.sup.10 is independently a hydrogen, fluorine or chlorine atom; an organosilicon compound having at least two —O—R.sup.g3(s) each bonding to a Si atom, wherein each R.sup.g3, at each occurrence, is independently a hydrogen atom or a monovalent organic group; and a catalyst.
NANOSIZED DENDRIMERIC EPOXY RESIN AS A LOSS CIRCULATION MATERIAL
An epoxy resin system composition and a loss circulation material including the reaction product of the epoxy resin system are provided. The epoxy resin system includes a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group, a curing agent, and a CO.sub.2 gas-generating compound. The CO.sub.2 gas-generating compound generates CO.sub.2 during the reaction such that a volume of the lost circulation material is greater than a volume of the epoxy resin system. A method of treating a defect in a wellbore includes introducing the epoxy resin system into the wellbore such that epoxy resin system is proximate to a face of the defect, and maintaining the epoxy resin system at the face of the defect such that the epoxy resin system cures and a lost circulation material forms and fluidly seals the defect in the wellbore.
NANOSIZED DENDRIMERIC EPOXY RESIN AS A LOSS CIRCULATION MATERIAL
An epoxy resin system composition and a loss circulation material including the reaction product of the epoxy resin system are provided. The epoxy resin system includes a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group, a curing agent, and a CO.sub.2 gas-generating compound. The CO.sub.2 gas-generating compound generates CO.sub.2 during the reaction such that a volume of the lost circulation material is greater than a volume of the epoxy resin system. A method of treating a defect in a wellbore includes introducing the epoxy resin system into the wellbore such that epoxy resin system is proximate to a face of the defect, and maintaining the epoxy resin system at the face of the defect such that the epoxy resin system cures and a lost circulation material forms and fluidly seals the defect in the wellbore.
Polymeric polymerization initiator and method for producing polymeric polymerization initiator
A polymeric polymerization initiator represented by the following formula (I). M.sup.1.sub.aM.sup.2.sub.bD.sup.1.sub.cD.sup.2.sub.dT.sup.1.sub.eT.sup.2.sub.fQ.sub.g (I) M.sup.1=R.sup.1.sub.3SiO.sub.1/2 M.sup.2=R.sup.1.sub.2R.sup.2SiO.sub.1/2 D.sup.1=R.sup.1.sub.2SiO.sub.2/2 D.sup.2=R.sup.1R.sup.2SiO.sub.2/2 T.sup.1=R.sup.1SiO.sub.3/2 T.sup.2=R.sup.2SiO.sub.3/2 Q=SiO.sub.4/2 [R.sup.1 represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group. R.sup.2 represents a group having a ketene silyl acetal structure represented by the following formula (II). (A represents a single bond or a divalent organic group, R.sup.3 represents a hydrogen atom or a substituted or unsubstituted alkyl group, and R.sup.4 represents a substituted or unsubstituted alkyl group.) “a”, “b”, “c”, “d”, “e”, “f”, and “g” represent 0 or a positive integer where b+d+f≥1. An order of bonding of siloxane units is optionally determined.] ##STR00001##
Polymeric polymerization initiator and method for producing polymeric polymerization initiator
A polymeric polymerization initiator represented by the following formula (I). M.sup.1.sub.aM.sup.2.sub.bD.sup.1.sub.cD.sup.2.sub.dT.sup.1.sub.eT.sup.2.sub.fQ.sub.g (I) M.sup.1=R.sup.1.sub.3SiO.sub.1/2 M.sup.2=R.sup.1.sub.2R.sup.2SiO.sub.1/2 D.sup.1=R.sup.1.sub.2SiO.sub.2/2 D.sup.2=R.sup.1R.sup.2SiO.sub.2/2 T.sup.1=R.sup.1SiO.sub.3/2 T.sup.2=R.sup.2SiO.sub.3/2 Q=SiO.sub.4/2 [R.sup.1 represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group. R.sup.2 represents a group having a ketene silyl acetal structure represented by the following formula (II). (A represents a single bond or a divalent organic group, R.sup.3 represents a hydrogen atom or a substituted or unsubstituted alkyl group, and R.sup.4 represents a substituted or unsubstituted alkyl group.) “a”, “b”, “c”, “d”, “e”, “f”, and “g” represent 0 or a positive integer where b+d+f≥1. An order of bonding of siloxane units is optionally determined.] ##STR00001##
Process for preparing organopolysiloane gels
Storage stable organopolysiloxane gels, preparable in commercial quantities are prepared by the hydrosilylation reaction of a silicone resin containing a hydrosilyatable group, a short chain Si—H-functional silicone, and a long chain Si—H-functional silicone.
Process for preparing organopolysiloane gels
Storage stable organopolysiloxane gels, preparable in commercial quantities are prepared by the hydrosilylation reaction of a silicone resin containing a hydrosilyatable group, a short chain Si—H-functional silicone, and a long chain Si—H-functional silicone.