Patent classifications
C08G77/50
RAPID HYDROPHOBIC SURFACE MODIFICATION COMPOSITIONS AND METHODS OF USE THEREOF
Described herein are compositions and methods for use in automotive care. In particular, the present disclosure is directed to compositions that provide an improved cure time and durability and methods of use thereof.
Nanosized dendrimeric epoxy resin as a loss circulation material
An epoxy resin system composition and a loss circulation material including the reaction product of the epoxy resin system are provided. The epoxy resin system includes a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group, a curing agent, and a CO.sub.2 gas-generating compound. The CO.sub.2 gas-generating compound generates CO.sub.2 during the reaction such that a volume of the lost circulation material is greater than a volume of the epoxy resin system. A method of treating a defect in a wellbore includes introducing the epoxy resin system into the wellbore such that epoxy resin system is proximate to a face of the defect, and maintaining the epoxy resin system at the face of the defect such that the epoxy resin system cures and a lost circulation material forms and fluidly seals the defect in the wellbore.
Nanosized dendrimeric epoxy resin as a loss circulation material
An epoxy resin system composition and a loss circulation material including the reaction product of the epoxy resin system are provided. The epoxy resin system includes a polyhedral oligomeric silsesquioxane (POSS) epoxy resin with at least one reactive group, a curing agent, and a CO.sub.2 gas-generating compound. The CO.sub.2 gas-generating compound generates CO.sub.2 during the reaction such that a volume of the lost circulation material is greater than a volume of the epoxy resin system. A method of treating a defect in a wellbore includes introducing the epoxy resin system into the wellbore such that epoxy resin system is proximate to a face of the defect, and maintaining the epoxy resin system at the face of the defect such that the epoxy resin system cures and a lost circulation material forms and fluidly seals the defect in the wellbore.
TRANSPARENT FILM
The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:
(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and
(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.
TRANSPARENT FILM
The object of the present invention is to attain water repellency as well as the heat resistance and the light resistance. the transparent film of the present invention comprises: a polysiloxane backbone; and a trialkylsilyl containing molecular chain bonded to a part of silicon atoms forming the polysiloxane backbone, wherein alkyl groups in the trialkylsilyl containing molecular chain may be replaced by fluoroalkyl groups, and the transparent film satisfies at least one of the relationships of:
(B.sub.H−A.sub.0)/A.sub.0×100(%)≧−27(%); and
(B.sub.L−A.sub.0)/A.sub.0×100(%)≧−15(%), provided that A.sub.0 is an initial contact angle of a liquid droplet on the transparent film, B.sub.H is a contact angle of a liquid droplet on the transparent film incubated at 200° C. for 24 hours, and B.sub.L is a contact angle of a liquid droplet on the transparent film irradiated by a xenon lamp with an intensity of 250 W for 100 hours.
MULTICOMPONENT ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, AND MOLDED PRODUCT COMPRISING SAID CURED PRODUCT
Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)
##STR00001##
(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)
##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.
MULTICOMPONENT ROOM TEMPERATURE-CURABLE ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT OF SAID COMPOSITION, AND MOLDED PRODUCT COMPRISING SAID CURED PRODUCT
Provided is a multicomponent room temperature-curable organopolysiloxane composition capable of providing a cured product superior in fast curability, storage stability and durability. The room temperature-curable organopolysiloxane composition comprises: (A) an alkoxysilyl-ethylene group-terminated organopolysiloxane having in each molecule at least one silyl-ethylene bond represented by the following structural formula (1)
##STR00001##
(wherein R.sup.1 represents an alkyl group; R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 3; and n represents an integer of 0 to 10); (B) an organopolysiloxane represented by the following general formula (2)
##STR00002## (wherein R.sup.2 represents a hydrocarbon group having 1 to 20 carbon atoms; and m represents a number at which such organopolysiloxane exhibits a viscosity of 10 to 1,000,000 mPa.Math.s at 25° C.); and (C) a curing catalyst.
Curable composition, semiconductor device, and ester bond-containing organosilicon compound
A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##
Curable composition, semiconductor device, and ester bond-containing organosilicon compound
A curable composition including: (A) an ester bond-containing organosilicon compound having two or more addition reactive carbon-carbon double bonds in one molecule, shown by the following general formula (1); (B) a silicon compound having two or more silicon atom-bonded hydrogen atoms in one molecule; and (C) a hydrosilylation reaction catalyst. This provides a curable composition to give a cured product with low gas permeability as well as excellent crack resistance and light transmission property. ##STR00001##
CURABLE SILICONE COMPOSITION AND APPLICATIONS AND USES THEREOF
A curable composition comprising (a) an organopolysiloxane comprising a curable functional group; (b) a cross-linker comprising a silyl hydride group or a thiol group; (c) a reaction accelerator; (d) optionally an inhibitor; and (e) optionally other additives. The curable composition exhibits high refractive index and optical clarity. The curable composition can be used to prepare a cured material that exhibits high refractive index, optical clarity, crack resistance, and low moisture vapor permeability.