C08G77/54

Composition containing low-VOC, aminoalkyl-functional silicon compounds for coating colors for the treatment of paper or film

A method of coating a paper surface proceeds by applying a composition which is low in volatile organic compounds (VOC) or essentially free of VOC, wherein the composition is art least partially based on one or more partially or fully hydrolyzed and optionally condensed or co-condensed aminoalkyl- and oligosilyated-aminoalkyl-, alkoxy- or hydroxy-functional silicon compounds and the alcohol is at least partially removed from the composition

Composition containing low-VOC, aminoalkyl-functional silicon compounds for coating colors for the treatment of paper or film

A method of coating a paper surface proceeds by applying a composition which is low in volatile organic compounds (VOC) or essentially free of VOC, wherein the composition is art least partially based on one or more partially or fully hydrolyzed and optionally condensed or co-condensed aminoalkyl- and oligosilyated-aminoalkyl-, alkoxy- or hydroxy-functional silicon compounds and the alcohol is at least partially removed from the composition

SILICONE RUBBER AND PHENOLIC MODIFIED SILICONE RUBBER AND METHODS FOR PREPARING THE SAME

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows:

##STR00001## Wherein x=70-80, y=10-20.

The structural formula of the phenolic-modified silicone rubber resin is shown as follows:

##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

SILICONE RUBBER AND PHENOLIC MODIFIED SILICONE RUBBER AND METHODS FOR PREPARING THE SAME

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows:

##STR00001## Wherein x=70-80, y=10-20.

The structural formula of the phenolic-modified silicone rubber resin is shown as follows:

##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

LED FILAMENT AND LED LIGHT BULB

The present disclosure discloses an LED filament, comprising a plurality of LED chips; at least two electrodes, each of the at least two electrodes is connected to at least one of the plurality of LED chips; and a light conversion layer comprising a top layer and a base layer, coated on at least two sides of the at least two electrodes, and a portion of the at least two electrodes is exposed by the light conversion layer, where the top layer and the base layer are located at two sides of the plurality of LED chips, respectively, wherein the base layer comprising an organosilicon-modified polyimide, a thermal curing agent and fluorescent powders. The present disclosure further discloses an LED light bulb. The base layer of the present disclosure has superior transmittance, heat resistance and mechanical strength, and is suitable for producing a flexible LED filament.

SILOXANE COMPOUND AND POLYIMIDE PRECURSOR COMPOSITION COMPRISING SAME
20210188881 · 2021-06-24 · ·

The present invention provides a siloxane compound having a novel structure, the compound not being reactive with a polyamic acid which is a polyimide precursor. In addition, provided is a polyimide precursor composition having improved storage stability by adding the siloxane compound as an enhancer for adhesion between a polyimide and a substrate made of an inorganic material. According to the present invention, provided is a multifunctional polyimide film having improved adhesiveness with a substrate made of an inorganic material while having improved optically isotropic characteristics and reduced residual stress characteristics with respect to a substrate.

MANUFACTURING PROCESS FOR AN OPTOELECTRONIC DEVICE

The present invention relates to a process for manufacturing an optoelectronic device, wherein a layer of a formulation containing a silazane polymer and a wavelength converting material is applied to an optoelectronic device precursor, precured by exposure to radiation and then cured. There is further provided an optoelectronic device, preferably a light emitting device (LED) or a micro-light emitting device (micro-LED), which is prepared by said manufacturing process.

MANUFACTURING PROCESS FOR AN OPTOELECTRONIC DEVICE

The present invention relates to a process for manufacturing an optoelectronic device, wherein a layer of a formulation containing a silazane polymer and a wavelength converting material is applied to an optoelectronic device precursor, precured by exposure to radiation and then cured. There is further provided an optoelectronic device, preferably a light emitting device (LED) or a micro-light emitting device (micro-LED), which is prepared by said manufacturing process.

ORGANIC SILICON COMPOUND AND PRODUCTION METHOD THEREFOR

This organic silicon compound is characterized by being represented by structural formula (1), and has good reactivity while having a monoalkoxysilyl group.

##STR00001##

(In the formula, X represents a monovalent to trivalent organic group including a polyoxyalkylene structure, an alkylene group having 1-20 carbon atoms, O, S, N, or the like, R.sup.1 and R.sup.2 each independently represent an alkyl group or the like having 1-10 carbon atoms, Y represents a single bond, O, S, or the like, A.sup.1, A.sup.2, A.sup.3, A.sup.4, and A.sup.5 each represent a single bond, or a divalent linking group such as a divalent hydrocarbon group having 1-20 carbon atoms, and n represents a number of 1-3.)

Polysilsesquioxane polyalkylene glycol polymer having urethane bonds, solid polymer electrolyte composition comprising the same and method of preparing the same

Disclosed is a polyalkylene glycol (PAG) polymer having urethane bonds, represented by Structural Formula 1 below. ##STR00001## The present invention further relates to a solid polymer electrolyte composition, composed of a polyalkylene glycol polymer having urethane bonds, and a lithium salt. The solid polymer electrolyte of the invention can exhibit superior compatibility, stability, flexibility, mechanical properties and ionic conductivity.