A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.

The instant invention pertains to a method and a fluid composition for producing contact lenses with improved lens quality and with increased product yield. The method of the invention involves applying to a molding surface of the mold a layer of mold releasing agent selected from a group consisting of fatty amines of carbon chain length C18 or less and silicones bearing pendant substituted pyrrolidone groups solution to reduce an averaged mold separation force by at least about 50% in comparison with that without the releasing agent.

The instant invention pertains to a method and a fluid composition for producing contact lenses with improved lens quality and with increased product yield. The method of the invention involves applying to a molding surface of the mold a layer of mold releasing agent selected from a group consisting of fatty amines of carbon chain length C18 or less and silicones bearing pendant substituted pyrrolidone groups solution to reduce an averaged mold separation force by at least about 50% in comparison with that without the releasing agent.

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows: ##STR00001## Wherein x=70-80, y=10-20. The structural formula of the phenolic-modified silicone rubber resin is shown as follows: ##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

The present invention discloses a silicone rubber and a method for preparing it, and a phenolic modified silicone rubber resin and a method for preparing it. The structural formula of the silicone rubber is shown as follows: ##STR00001## Wherein x=70-80, y=10-20. The structural formula of the phenolic-modified silicone rubber resin is shown as follows: ##STR00002## wherein n, x, y are degrees of polymerization, n=10-20, x=70-80, y=10-20. A method for preparing the phenolic-modified silicone rubber resin orderly comprises: adding 90-110 parts by mass of brominated phenolic resin and 180-220 parts of organic solvent into 100 parts by mass of silicone rubber, reacting at 70-80° C. for 24-48 h until the solution is clear and transparent; adding 9-11 parts by mass of capping agent, reacting for another 4-5 h to obtain a reaction liquid containing phenolic-modified silicone rubber resin. The phenolic-modified silicone rubber resin prepared in the present invention can solve the problem of easy pulverization in the ablation process of conventional silicone rubber and meanwhile has high mechanical properties.

A cross-linked composition comprises the reaction product of a first reactant having at least one hydroxyl or amine (functional) group, a second reactant having at least one hydroxyl or amine (functional) group, and a siloxane having at least two terminal anhydride groups reactive with the functional groups of the first and second reactants. The first reactant is selected from the group of first siloxanes having at least one hydroxyl or amine group, a first organic alcohol having at least one hydroxyl group, a first organic amine having at least one amine group, or combinations thereof. The second reactant is selected from the group of second siloxanes having at least one hydroxyl or amine group, a second organic alcohol having at least one hydroxyl group, a second organic amine having at least one amine group, or combinations thereof. If utilized, the first siloxanes and/or second siloxanes are different from the siloxane.

A cross-linked composition comprises the reaction product of a first reactant having at least one hydroxyl or amine (functional) group, a second reactant having at least one hydroxyl or amine (functional) group, and a siloxane having at least two terminal anhydride groups reactive with the functional groups of the first and second reactants. The first reactant is selected from the group of first siloxanes having at least one hydroxyl or amine group, a first organic alcohol having at least one hydroxyl group, a first organic amine having at least one amine group, or combinations thereof. The second reactant is selected from the group of second siloxanes having at least one hydroxyl or amine group, a second organic alcohol having at least one hydroxyl group, a second organic amine having at least one amine group, or combinations thereof. If utilized, the first siloxanes and/or second siloxanes are different from the siloxane.

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.