In one aspect, the present invention provides undoped and doped siloxanes, germoxanes, and silagermoxanes that are substantially free from carbon and other undesired contaminants. In a second aspect, the present invention provides methods for making such undoped and doped siloxanes, germoxanes, and silagermoxanes. In still another aspect, the present invention provides compositions comprising undoped and/or doped siloxanes, germoxanes, and silagermoxanes and a solvent, and methods for forming undoped and doped dielectric films from such compositions. Undoped and/or doped siloxane compositions as described advantageously provide undoped and/or doped dielectric precursor inks that may be employed in forming substantially carbon-free undoped and/or doped dielectric films.

Disclosed in this specification is a method for forming a silicone hydrogel material that is useful for forming contact lens materials. The method includes using an effective amount of a borate additive to reduce the gel time of the silicone hydrogel reactive mixture and/or enhance the optical properties of the resulting cured material.

This application provides an adhesive composition. The adhesive composition includes an adhesive matrix and a modified polymer. A main chain of the modified polymer includes a boron-oxygen coordinate bond and/or a bridging boron-oxygen coordinate bond. A terminal group or a side chain of the modified polymer or both include at least one of a hydroxyl group, an acrylate group, and a vinyl group. This application further provides a preparation method of the adhesive composition, an optical adhesive film, a foldable screen using the optical adhesive film, and an electronic device using the optical adhesive film or the foldable screen.

Doped semiconductor ink formulations, methods of making doped semiconductor ink formulations, methods of coating or printing thin films, methods of forming electronic devices and/or structures from the thin films, and methods for modifying and controlling the threshold voltage of a thin film transistor using the films are disclosed. A desired dopant may be added to an ink formulation comprising a Group IVA compound and a solvent, and then the ink may be printed on a substrate to form thin films and conductive structures/devices, such as thin film transistors. By adding a customized amount of the dopant to the ink prior to printing, the threshold voltage of a thin film transistor made from the doped semiconductor ink may be independently controlled upon activation of the dopant.

Doped semiconductor ink formulations, methods of making doped semiconductor ink formulations, methods of coating or printing thin films, methods of forming electronic devices and/or structures from the thin films, and methods for modifying and controlling the threshold voltage of a thin film transistor using the films are disclosed. A desired dopant may be added to an ink formulation comprising a Group IVA compound and a solvent, and then the ink may be printed on a substrate to form thin films and conductive structures/devices, such as thin film transistors. By adding a customized amount of the dopant to the ink prior to printing, the threshold voltage of a thin film transistor made from the doped semiconductor ink may be independently controlled upon activation of the dopant.

Methods and formulations for modified silicone resins of Formula (II) are presented. Formula (II) comprises at least one of each of the following subunits:

##STR00001##

The R.sup.1, R.sup.2, R.sup.3, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12 and R.sup.13 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl. The X is selected from a group consisting of arylene, transition metal, inorganic oxide, and silsesquioxane. The values of t ranges from 1 to 10, y ranges from 1 to 200 and z ranges from 1 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).

Disclosed in this specification is a method for forming a silicone hydrogel material that is useful for forming contact lens materials. The method includes using an effective amount of a borate additive to reduce the gel time of the silicone hydrogel reactive mixture and/or enhance the optical properties of the resulting cured material.

Disclosed in this specification is a method for forming a silicone hydrogel material that is useful for forming contact lens materials. The method includes using an effective amount of a borate additive to reduce the gel time of the silicone hydrogel reactive mixture and/or enhance the optical properties of the resulting cured material.

Methods and formulations for modified silicone resins of Formula (II) are presented. Formula (II) comprises at least one of each of the following subunits: ##STR00001##
The R.sup.1, R.sup.2, R.sup.3, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12 and R.sup.13 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl. The X is selected from a group consisting of arylene, transition metal, inorganic oxide, and silsesquioxane. The values oft ranges from 1 to 10, y ranges from 1 to 200 and z ranges from 1 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).

Methods and formulations for modified silicone resins of Formula (II) are presented. Formula (II) comprises at least one of each of the following subunits: ##STR00001##
The R.sup.1, R.sup.2, R.sup.3, R.sup.6, R.sup.7, R.sup.8, R.sup.9, R.sup.10, R.sup.11, R.sup.12 and R.sup.13 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl. The X is selected from a group consisting of arylene, transition metal, inorganic oxide, and silsesquioxane. The values oft ranges from 1 to 10, y ranges from 1 to 200 and z ranges from 1 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).