A display device includes an organic light emitting element and a cover layer. The organic light emitting element includes a thin-film encapsulation layer comprising an aluminum-containing material. The cover layer is disposed on the thin-film encapsulation layer, and the cover layer includes a silicon containing unit, an aluminum containing unit, and a bridging unit, and the aluminum-containing unit of the covering layer is covalently bonded to the thin-film encapsulating layer. A method of manufacturing a display device includes providing a dual-curable sol-gel composition comprising a silicon-containing monomer, an aluminum-containing monomer, a solvent, and a polymerization initiator, applying the composition to a thin-film encapsulation layer of an organic light-emitting device; and curing the composition with a UV radiation and at a curing temperature to form a cover layer on the thin-film encapsulation layer, wherein the curing temperature is a temperature that does not damage the organic light-emitting element.

The present invention provides a photosensitive composition comprising a copolymer of an organometallic compound and polysiloxane that may be used in a photosensitive material for a display or semiconductor, and a method for preparing the same.

An alumina composite sol composition includes (A) an alumina sol containing an alumina hydrate, (B) an alkoxysilane compound, (C) a polyvalent organic acid, and (D) a solvent, wherein the amount of the alumina hydrate in the alumina sol (A) is 3 to 11% by mass.

A non- or low-boron putty base includes a crosslinked reaction product of at least one polydiorganosiloxane that has at least two reactive functional groups and at least one crosslinker capable of reacting with the reactive functional groups to form the crosslinked reaction product. The putty base is dilatant and comprises 0 to 0.1 weight percent of a boron-containing compound. Dilatant putties made from the putty base and fillers are also provided. A method of making a dilatant putty includes: providing at least one polydiorganosiloxane comprising at least two reactive functional groups; providing an additive; providing at least one crosslinker capable of reacting with the reactive functional groups; and combining the polydiorganosiloxane, the filler, and the crosslinker to form the dilatant putty having less than 0.1 wt % boron.

A non- or low-boron putty base includes a crosslinked reaction product of at least one polydiorganosiloxane that has at least two reactive functional groups and at least one crosslinker capable of reacting with the reactive functional groups to form the crosslinked reaction product. The putty base is dilatant and comprises 0 to 0.1 weight percent of a boron-containing compound. Dilatant putties made from the putty base and fillers are also provided. A method of making a dilatant putty includes: providing at least one polydiorganosiloxane comprising at least two reactive functional groups; providing an additive; providing at least one crosslinker capable of reacting with the reactive functional groups; and combining the polydiorganosiloxane, the filler, and the crosslinker to form the dilatant putty having less than 0.1 wt % boron.

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.m(R.sup.1R.sup.2SiO.sub.2/2).sub.n(R.sup.2.sub.2SiO.sub.2/2).sub.p(R.sup.1SiO.sub.3/2).sub.q(R.sup.2(OR.sup.3)SiO.sub.2/2).sub.r(SiO.sub.4/2).sub.s, (c) an organohydrogen polysiloxane represented by R.sup.4.sub.aH.sub.bSiO.sub.(4-a-b)/2, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an SiOCe bond, and an SiOTi bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R.sup.1R.sup.2.sub.2SiO.sub.1/2).sub.m(R.sup.1R.sup.2SiO.sub.2/2).sub.n(R.sup.2.sub.2SiO.sub.2/2).sub.p(R.sup.1SiO.sub.3/2).sub.q(R.sup.2(OR.sup.3)SiO.sub.2/2).sub.r(SiO.sub.4/2).sub.s, (c) an organohydrogen polysiloxane represented by R.sup.4.sub.aH.sub.bSiO.sub.(4-a-b)/2, (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an SiOCe bond, and an SiOTi bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

Provided are a compound, including metal atoms for forming metal nano particles through a simple process within a short time at a low production cost for commercial purposes, and a solution including the compound.

Provided are a compound, including metal atoms for forming metal nano particles through a simple process within a short time at a low production cost for commercial purposes, and a solution including the compound.

An alkoxysilane is contacted with water and an inorganic acid to form a first composition. A zirconium alkoxide is contacted with an organic acid to form a second composition. One or more alkoxysilanes and an organic acid are contacted with a mixture of the first and second compositions to form a sol-gel composition, to which a photoinitiator is added. The sol-gel composition has a ratio of a number of moles of silicon to a number of moles of zirconium (n.sub.Si/n.sub.Zr) ranging from about 2 to about 10. The sol-gel composition is applied on a substrate (e.g., an aluminum alloy substrate) multiple times to form multiple sol-gel layers, and at least one of the sol-gel layers is cured by UV radiation. The multiple sol-gel layers are then thermally cured.