Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Disclosed is a composition for a silica-based insulation layer including hydrogenated polysilazane or hydrogenated polysiloxzane, wherein a concentration of a cyclic compound having a weight average molecular weight of less than 400 is less than or equal to 1,200 ppm. The composition for a silica-based insulation layer may reduce a thickness distribution during formation of a silica-based insulation layer, and thereby film defects after chemical mechanical polishing (CMP) during a semiconductor manufacturing process may be reduced.

Provided herein is a composition comprising from 50% to 60% polysiloxane consisting essentially of polyphenylmethylsiloxane and α,ω-methoxy-terminated polydimethylsiloxane, from 40% to 50% organic solvent, from 2% to 4% polysilazane, and polysilane of a formula (R.sub.1R.sub.2Si).sub.n, wherein n is greater than 1, and wherein R.sub.1 and R.sub.2 are the same or different and are alkyl, alkenyl, cycloalkyl, alkylamino, aryl, aralkyl, or alkylsilyl. The composition, after curing, is a flame resistant binder for forming a composition-fiber composite that withstands repeated temperatures over 1800° F. The composition may further comprise from 0.1% to 2% of an enhancer selected from butyltitanate and aminoethylaminopropyltrimethoxysilane (H.sub.2NC.sub.2H.sub.4NHC.sub.3H.sub.6—Si(OCH.sub.3).sub.3). The composition may be mixed with fibers in a ratio of 35:65 to 45:55 (w/w), and the composition-fiber mixture may be cured under vacuum at a temperature of 200° F. to 450° F. for 30 minutes to 180 minutes to form a composite.

According to the present invention, a siliceous film forming composition, which is capable of filling trenches having narrow widths and high aspect ratios and forming a thick film, can be provided. A siliceous film forming composition comprising: (a) a block copolymer comprising a linear and/or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon, and (b) a solvent.

Solid or liquid N—H free, C-free, and Si-rich perhydropolysilazane compositions comprising units having the following formula [—N(SiH.sub.3).sub.x(SiH.sub.2—).sub.y], wherein x=0, 1, or 2 and y=0, 1, or 2 when x+y=2; and x=0, 1 or 2 and y=1, 2, or 3 when x+y=3 are disclosed. Also disclosed are synthesis methods and applications for the same.

Solid or liquid N—H free, C-free, and Si-rich perhydropolysilazane compositions comprising units having the following formula [—N(SiH.sub.3).sub.x(SiH.sub.2—).sub.y], wherein x=0, 1, or 2 and y=0, 1, or 2 when x+y=2; and x=0, 1 or 2 and y=1, 2, or 3 when x+y=3 are disclosed. Also disclosed are synthesis methods and applications for the same.

A bissilylamino group-containing organic polysilazane compound having an average composition represented by general formula (1) below: ##STR00001##
wherein R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is a divalent hydrocarbon group, R.sup.3 and R.sup.4 are a monovalent hydrocarbon group, R.sup.3 and R.sup.4 optionally bond each other to form a ring structure together with a silicon atom to which R.sup.3 and R.sup.4 are bonded and a nitrogen atom to which the silicon atom is directly bonded, R.sup.5 is a monovalent hydrocarbon group, p is 0 or 1, q is 0, 1, or 2, and a and b are numbers which satisfy 0<a≤1, 0≤b<1, and a+b=1, and having a number average molecular weight in terms of polystyrene measured by GPC of 500 to 100,000.

A bissilylamino group-containing organic polysilazane compound having an average composition represented by general formula (1) below: ##STR00001##
wherein R.sup.1 is a monovalent hydrocarbon group, R.sup.2 is a divalent hydrocarbon group, R.sup.3 and R.sup.4 are a monovalent hydrocarbon group, R.sup.3 and R.sup.4 optionally bond each other to form a ring structure together with a silicon atom to which R.sup.3 and R.sup.4 are bonded and a nitrogen atom to which the silicon atom is directly bonded, R.sup.5 is a monovalent hydrocarbon group, p is 0 or 1, q is 0, 1, or 2, and a and b are numbers which satisfy 0<a≤1, 0≤b<1, and a+b=1, and having a number average molecular weight in terms of polystyrene measured by GPC of 500 to 100,000.

Provided is a barrier film, comprising: a base layer; and an inorganic layer including Si, N, and O, wherein the inorganic layer has a thickness of 600 nm or less, and the film has a water vapor transmission rate of 0.5×10.sup.−3 g/m.sup.2.Math.day as measured under conditions of a temperature of 38° C. and 100% relative humidity. The barrier film has excellent barrier properties and optical properties and can be used for electronic products sensitive to moisture.

Metal oxide-polymer composite particles have a median particle size D50 of 40-75 nm or 100-150 nm and an average RTA of at least 0.06. Alternatively or in addition, metal oxide-polymer composites comprise two or more populations of metal oxide particles differing in size, particle size distribution, or shape. Alternatively or in addition, the use of a multicomponent hydrophobizing system including an alkylsilane to fabricate metal oxide-polymer composite particles increases the tribocharge of the composite particles.