Patent classifications
C08G79/04
Dual functional poly(arylene ether) compounds
A capped poly(arylene ether) copolymer having the formula ##STR00001##
wherein Y is a divalent linking group of the formula ##STR00002## each occurrence of D is independently a group of the formula ##STR00003## each occurrence of Z is independently of the formula ##STR00004##
and Q.sup.1a, Q.sup.1b, R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, z, x, y, e, R.sup.a, R.sup.b, R.sup.c, R.sup.d, R.sup.e, W.sup.a, R, R, and m are as defined herein.
STRUCTURE OF PHOSPHOROUS-CONTAINING FUNCTIONALIZED POLY(ARYLENE ETHER), COMPOSITION CONTAINING THE SAME, AND COPPER CLAD LAMINATE
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
STRUCTURE OF PHOSPHOROUS-CONTAINING FUNCTIONALIZED POLY(ARYLENE ETHER), COMPOSITION CONTAINING THE SAME, AND COPPER CLAD LAMINATE
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
Pinene-based flame retardant compounds
A pinene-based flame retardant compound, a process for forming a flame retardant polymer, and an article of manufacture comprising a material that contains a pinene-based flame retardant polymer are disclosed. The pinene-based flame retardant compound includes a pinene derivative core and at least one flame retardant substituent having a phosphorus-based moiety. The process for forming the flame retardant polymer includes obtaining pinene, forming a derivative of pinene, obtaining a phosphorus-based compound, reacting the phosphorus-based compound and the pinene derivative to form a pinene-based flame retardant compound, and incorporating the pinene-based flame retardant compound into a polymer to form the pinene-based flame retardant polymer.
Pinene-based flame retardant compounds
A pinene-based flame retardant compound, a process for forming a flame retardant polymer, and an article of manufacture comprising a material that contains a pinene-based flame retardant polymer are disclosed. The pinene-based flame retardant compound includes a pinene derivative core and at least one flame retardant substituent having a phosphorus-based moiety. The process for forming the flame retardant polymer includes obtaining pinene, forming a derivative of pinene, obtaining a phosphorus-based compound, reacting the phosphorus-based compound and the pinene derivative to form a pinene-based flame retardant compound, and incorporating the pinene-based flame retardant compound into a polymer to form the pinene-based flame retardant polymer.
Temperature-resistant silicone resins
Methods and formulations for modified silicone resins of Formula (I) are presented: ##STR00001##
The R.sup.1, R.sup.2, and R.sup.3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).
Temperature-resistant silicone resins
Methods and formulations for modified silicone resins of Formula (I) are presented: ##STR00001##
The R.sup.1, R.sup.2, and R.sup.3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).
Structure of phosphorous-containing functionalized poly(arylene ether) and compositions prepared therefrom
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
Structure of phosphorous-containing functionalized poly(arylene ether) and compositions prepared therefrom
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
Use of phosphorous-containing organic oxyimides as flame retardants and/or as stabilizers for plastics, flame-retardant and/or stabilized plastic compositions, method for the production thereof, moulded part, paint and coatings
The present invention relates to the use of phosphorous-containing organic oxyimides according to the general formula (I) as flame retardant for plastic materials, as radical generators in plastic materials and/or stabilisers for plastics. In addition, the present invention relates to a flame-retardant plastic material moulding compound in which the previously described phosphorous-containing organic oxyimides are integrated, and also to a method for the production of the previously mentioned plastic material composition. Furthermore, the present invention relates to a moulded article, a paint or a coating from the previously mentioned flame-retardant plastic material composition.