The present invention relates to a kind of organic metal-free catalysts containing both electrophilic and nucleophilic dual-functions, preparation methods of making the same, and uses thereof. The organic metal-free catalysts in the present invention have the chemical structure shown in formula (I): ##STR00001##
Compared with the metal-free organic polymerization catalytic systems that have been reported before, the organic metal-free catalysts in this invention have the combined advantages of simple preparation, high reactivity, easy operation, low cost, wide applicability, easy for industrial production.

A method and device for producing a solution of polyphosphoric acid from a feed solution P0 by the wet method is provided. An enriched phosphoric acid solution optionally mixed with a direct feed solution is pulverised in a flame of a combustion chamber in order to form the polyphosphoric acid solution. The combustion gases from the combustion chamber are placed in contact with the feed solution in a gas-acid contactor in order to increase the temperature and the P.sub.2O.sub.5 concentration thereof and thus to form an enriched phosphoric acid solution. A portion of the enriched phosphoric acid solution is conveyed with a flow rate of Qp into the combustion chamber in order to be pulverised in the flame. The rest of the enriched phosphoric acid solution is conveyed into a recirculation loop in order to be reinjected into the gas-acid contactor with a flow rate of Q2. The ratio of Qp/(Qp+Q2) is controlled with a predefined value.

Techniques regarding the synthesis of one or more polymers through one or more ring-opening polymerizations conducted within a flow reactor and facilitated by one or more anionic catalysts are provided. For example, one or more embodiments can comprise a method, which can comprise polymerizing, via a ring-opening polymerization within a flow reactor, a cyclic monomer in the presence of one or more anionic organocatalysts.

Techniques regarding the synthesis of one or more polymers through one or more ring-opening polymerizations conducted within a flow reactor and facilitated by one or more anionic catalysts are provided. For example, one or more embodiments can comprise a method, which can comprise polymerizing, via a ring-opening polymerization within a flow reactor, a cyclic monomer in the presence of one or more anionic organocatalysts.

A resist underlayer film forming composition contains a reaction product of an aromatic compound (A) having 6 to 60 carbon atoms and a compound represented by formula (B), and a solvent. (In the formula, X represent an oxygen atom or a nitrogen atom; Y represents a single bond, an oxygen atom or a nitrogen atom; X and Y may combine with each other to form a ring; and each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms or an aromatic group having 6 to 10 carbon atoms; provided that R.sub.2 is present only in cases where X is a nitrogen atom, and R.sub.4 is present only in cases where Y is a nitrogen atom.)

##STR00001##

A resist underlayer film forming composition contains a reaction product of an aromatic compound (A) having 6 to 60 carbon atoms and a compound represented by formula (B), and a solvent. (In the formula, X represent an oxygen atom or a nitrogen atom; Y represents a single bond, an oxygen atom or a nitrogen atom; X and Y may combine with each other to form a ring; and each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a cyclic alkyl group having 3 to 8 carbon atoms or an aromatic group having 6 to 10 carbon atoms; provided that R.sub.2 is present only in cases where X is a nitrogen atom, and R.sub.4 is present only in cases where Y is a nitrogen atom.)

##STR00001##

Compounds useful as biologically active compounds are disclosed. The compounds have the following structure (I):

##STR00001##

or a stereoisomer, tautomer or salt thereof, wherein R.sup.1, R.sup.2, R.sup.3, L, L.sup.1, L.sup.2, L.sup.3, M and n are as defined herein. Methods associated with preparation and use of such compounds is also provided.

The present invention relates to preparations having improved efficacy as flame retardants, to the use thereof and to polyurethanes containing the preparations according to the invention.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and a polyphenylene ether resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the polyphenylene ether resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.