C08G81/024

HIGH-TEMPERATURE RESISTANT MODIFIED SILICON-CONTAINING CYANATE ESTER RESIN AS WELL AS PREPARATION METHOD AND APPLICATION THEREOF

The present invention relates to a high-temperature resistant modified silicon-containing cyanate ester resin as well as a preparation method and an application thereof. The preparation method comprises the following steps: adding a mixed solution of hydroxyl silicone oil, a silane coupling agent and an organic solvent into a mixed solution of a tetramethylammonium hydroxide aqueous solution and a polar solvent, performing hydrolytic polycondensation at a temperature of 5-40 C. for 4-8 h, and performing distillation to obtain an epoxy-containing silsesquioxane; performing pre-polymerization on the epoxy-containing silsesquioxane and a cyanate ester resin at a temperature of 50-100 C. for 1-8 h to obtain a modified cyanate ester resin; and uniformly mixing the modified cyanate ester resin and a modified anhydride, thereby obtaining the high-temperature resistant modified silicon-containing cyanate ester resin.

WIRE SHEATHING AND INSULATION COMPOSITIONS

Halogen-free polymer composite materials, which are commonly for use in sheathing and insulation applications for wire and cable, are provided. The composite materials include a polymeric blend, which includes ethylene/-olefin copolymer and polyolefin, a hydrated metal oxide flame-retardant, such as hydrated magnesium oxide, and an antimony compound. In some instances, the polymeric blend may include an olefin/unsaturated ester copolymer.

POLYMERIZED IN-SITU HYBRID SOLID ION-CONDUCTIVE COMPOSITIONS

Provided herein are methods of forming solid-state ionically conductive composite materials that include particles of an inorganic phase in a matrix of an organic phase. The methods involve forming the composite materials from a precursor that is polymerized in-situ after being mixed with the particles. The polymerization occurs under applied pressure that causes particle-to-particle contact. In some embodiments, once polymerized, the applied pressure may be removed with the particles immobilized by the polymer matrix. In some implementations, the organic phase includes a cross-linked polymer network. Also provided are solid-state ionically conductive composite materials and batteries and other devices that incorporate them. In some embodiments, solid-state electrolytes including the ionically conductive solid-state composites are provided. In some embodiments, electrodes including the ionically conductive solid-state composites are provided.

POLYMERIZED IN-SITU HYBRID SOLID ION-CONDUCTIVE COMPOSITIONS

Provided herein are methods of forming solid-state ionically conductive composite materials that include particles of an inorganic phase in a matrix of an organic phase. The methods involve forming the composite materials from a precursor that is polymerized in-situ after being mixed with the particles. The polymerization occurs under applied pressure that causes particle-to-particle contact. In some embodiments, once polymerized, the applied pressure may be removed with the particles immobilized by the polymer matrix. In some implementations, the organic phase includes a cross-linked polymer network. Also provided are solid-state ionically conductive composite materials and batteries and other devices that incorporate them. In some embodiments, solid-state electrolytes including the ionically conductive solid-state composites are provided. In some embodiments, electrodes including the ionically conductive solid-state composites are provided.

BLOCK COPOLYMER, AND METHOD OF PRODUCING STRUCTURE CONTAINING PHASE-SEPARATED STRUCTURE

A block copolymer including a first block and a second block, the first block consisting of a polymer (P1) having a repeating structure of a structural unit (u1) containing in a side chain thereof a hyperbranched structure containing a silicon atom.

Novolac-type phenolic hydroxyl group-containing resin, production method therefor, curable composition, composition for resist, and color resist
10047185 · 2018-08-14 · ·

A novolac-type phenolic hydroxyl group-containing resin with formula (1) as a structural site repeating unit, R.sup.1 represents one of a hydrogen atom, an alkyl group, and an aryl group, and X represents a structural site () represented by formula (2), R.sup.2 and R.sup.3 each represent one of a hydrogen atom, an alkyl group, an aryl group, and an aralkyl group; n and m are each an integer of 1 to 3; when n or m is 2 or 3, a plurality of each of R.sup.2 and R.sup.3 present in a molecule may be the same or different; and Ar represents one of a phenyl group, a naphthyl group, an anthryl group, and a structural site in which one or a plurality of hydrogen atoms in an aromatic nucleus of any one of these groups is substituted by one of an alkyl group, an aryl group, and an aralkyl group). ##STR00001##

PHOTOCURABLE RESIN COMPOSITION, FUEL CELL, AND SEALING METHOD
20180226664 · 2018-08-09 · ·

The present invention has an object to provide a photocurable resin composition which can be quickly cured by irradiation with active energy rays such as ultraviolet rays and achieves excellent adhesion to an electrolyte membrane having properties difficult to bond. Specifically, provided is a photocurable resin composition containing the following (A) to (C) ingredients: (A) ingredient: a polymer having a polyisobutylene backbone containing a [CH.sub.2C(CH.sub.3).sub.2] unit, the polymer having one or more (meth)acryloyl groups; (B) ingredient: a photo-radical polymerization initiator; and (C) ingredient: one or more compounds selected from the group consisting of silicone oligomers each having one or more alkoxy groups and one or more (meth)acryloyl groups, silicone oligomers each having one or more alkoxy groups and one or more amino groups, and silane compounds each having one or more isocyanate groups.

SILICONE-MODIFIED POLYBENZOXAZOLE RESIN AND MAKING METHOD

A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R.sup.1 to R.sup.4 are a C.sub.1-C.sub.8 monovalent hydrocarbon group, m and n are integers of 0-300, R.sup.5 is C.sub.1-C.sub.8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X.sup.1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use.

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RESIN COMPOSITION, METHOD FOR MAKING RESIN COMPOSITION AND FILM FOR CIRCUIT BOARD, AND CIRCUIT BOARD

A resin composition having lower dielectric constant D.sub.k, lower dielectric loss D.sub.f, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of

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or any combination thereof.

Reversible shape memory polymers exhibiting ambient actuation triggering
10040909 · 2018-08-07 · ·

Shape memory polymers featuring reversible actuation capability under ambient stimulus for integration with apparel. One approach is to use a multiblock polymer consisting of two (or potentially more) blocks in which the one block is the crystalline switching block with relatively low melting transitions, the other block has a higher thermal transition, and the two blocks are linked together by a linker molecule. Another approach is to use a graft copolymer having high and low melting transitions where the graft copolymer has a first polymer serving as the backbone and a second polymer being grafted to or from the backbone at certain graft locations. A further approach is to use latent crosslinking of a semicrystalline polymer with reactive groups placed on the backbone.