Polyarylene oligomer compositions having improved adhesion to surfaces as compared to conventional polyarylene oligomers are useful in forming dielectric material layers in electronics applications.

Certain cyclopentadienone monomers having polar moieties are useful in forming polyarylene resins having improved solubility in certain organic solvents and are useful in forming polyarylene resin layers in electronics applications.

A method for producing a hydrogenated ring-opening metathesis polymer includes subjecting a cyclic olefin to ring-opening metathesis polymerization in the presence of a polymerization catalyst to produce a ring-opening metathesis polymer, and hydrogenating at least some of carbon-carbon double bonds of the ring-opening metathesis polymer, at least one ruthenium compound selected from a group made of a ruthenium compound represented by a formula (I), (II), (III), and (IV) being used as the polymerization catalyst; and a resin composition having a hydrogenated ring-opening metathesis polymer produced by this method. It is possible to industrially advantageously produce a hydrogenated ring-opening metathesis polymer that exhibits especially excellent light transmittance.

Disclosed are curable linear polymers that can be used as active and/or passive organic materials in various electronic, optical, and optoelectronic devices. In some embodiments, the device can include an organic semiconductor layer and a dielectric layer prepared from such curable linear polymers. In some embodiments, the device can include a passivation layer prepared from the linear polymers described herein. The present linear polymers can be solution-processed, then cured thermally (particularly, at relatively low temperatures) and/or photochemically into various thin film materials with desirable properties.

The object is to provide a resin composition for a printed circuit board capable of realizing a printed circuit board that not only has heat resistance and flame retardancy but also is excellent in heat resistance after moisture absorption. The resin composition is a resin composition for a printed circuit board containing a cyanate ester compound (A) obtained by cyanation of a naphthol-dihydroxynaphthalene aralkyl resin or a dihydroxynaphthalene aralkyl resin, and an epoxy resin (B).

Certain polyarylene oligomers having improved solubility are useful in forming dielectric material layers in electronics applications.

An oligomer, composition, and composite material employing the same are provided. The oligomer has a structure represented by Formula (I)

##STR00001##

wherein R.sup.1 and R.sup.2 are independently hydrogen, C.sub.1-20 alkyl group, C.sub.2-20 alkenyl group, C.sub.6-12 aryl group, C.sub.6-12 alkylaryl group, C.sub.5-12 cycloalkyl group, C.sub.6-20 cycloalkylalkyl group, alkoxycarbonyl group, or alkylcarbonyloxy group; R.sup.1 is not hydrogen when R.sup.2 is hydrogen; a is 0 or 1; n0; m1; n:m is from 0:100 to 99:1; the oligomer has a number average molecular weight of less than or equal to 12,000; and the repeat unit

##STR00002##

and the repeat unit

##STR00003##

are arranged in a random or block fashion.

Compositions of arylene oligomers and certain curing agents are useful to provide arylene polymer coatings having improved mechanical properties when cured in an oxygen-containing atmosphere. Methods of curing such compositions are also provided.

One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers includes an electrically conductive polymer.

Arylcyclobutene polymers having improved physical properties, such as tensile strength, are provided. Compositions and methods for coating such arylcyclobutene polymers are also provided.