Patent classifications
C08G2650/56
Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same
The present disclosure provides a resin composition for a metal substrate, and a resin varnish and a metal base copper-clad laminate comprising the same. The resin composition comprises 5-40% of a main resin and 60-95% of a thermally conductive filler when the total weight of the resin composition is calculated as 100%, wherein the main resin comprises 60-90% of a flexible epoxy resin having a structure as shown in Formula I and 10-40% of a phenoxy resin when the total weight of the main resin is calculated as 100%. The resin composition provided by the present disclosure has a low modulus, can alleviate the stress generated by thermal shocks and can withstand more than 1000 thermal cycles.
Resin composition, cured product, laminate, and electronic member
The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.
Structural adhesives
An adhesive formulation having an adduct of an epoxy resin and an elastomer, a phenoxy epoxy hybrid resin supplied as a solution formed by dissolving a phenoxy resin in a liquid epoxy resin to form a pre-formed dissolution product, a core/shell polymer, and one or more additional epoxy resins. The adhesive formulation may include a curing agent, blowing agent, filler, accelerator, or a combination.
BILAYER COMPOSITION FOR SURFACE TREATMENT OF STEEL PLATE AND SURFACE-TREATED STEEL PLATE USING SAME
Provided is a bilayer composition for surface treatment of a steel plate and a surface-treated steel plate using same. The bilayer composition for surface treatment of a steel plate, comprising an undercoat coating composition including 1 to 12 wt % of a phenoxy resin, 0.001 to 1.0 wt % of colloidal silica, 0.001 to 1.0 wt % of a silane coupling agent, 0.1 to 1.0 wt % of a corrosion inhibitor, 0.001 to 1.0 wt % of a phosphoric acid compound as a long-term corrosion resistance improving agent, and a balance of water; and a topcoat coating composition including 0.1 to 5.0 wt % of an acrylic acid resin, 30 to 50 wt % of colloidal silica, 40 to 60 wt % of alkoxy silane, 5 to 15 wt % of an acrylate-based monomer, 0.01 to 1.00 wt % of an acidity control agent, and a balance of an organic solvent.
CARBON FIBRE-CONTAINING PREPREGS
A prepreg having at least one layer of carbon fibres and a curable thermosetting resin system, the curable thermosetting resin system at least partly impregnating the at least one layer of carbon fibres, wherein the curable thermosetting resin system includes: a curable thermosetting resin including at least one epoxide group, the curable thermosetting resin having an epoxy equivalent weight of from 140 to 180 g/eq; a curing agent for curing the curable thermosetting resin, wherein the curing agent is present in the liquid phase and includes a cyanamide reactive group; and a rheology modifier for the curable thermosetting resin system, wherein the rheology modifier includes at least one of a thermoplastic resin and an inorganic particulate thickener or a mixture thereof.
AQUEOUS THERMO-THICKENING RESIN SOLUTIONS
Provided are aqueous resin solutions having unique rheologies and products incorporating the same. The water-based materials provided herein are thermo-thickening, and the materials increase dramatically in viscosity (at least 100 times) in a desired temperature range increase (20 C to <100 C) at ambient pressure. Suitable resins comprising a hydrophobic group and a hydrophilic group may be selected from an epoxy resin, a phenol-formaldehyde resin, a polyurethane resin, an acrylic resin, a polyester resin, an acrylic-urethane resin, a melamine resin, a melamine-formaldehyde resin, an amino resin, and combinations thereof. A specific epoxy functional resin/polymer suitable for the resin solutions are prepared by reacting (A) an epoxy pre-polymer of (1) one or more polyols and (2) one or more epoxy functional materials with (B) a di- or polyamine, thereby forming the aqueous thermo-thickening resin solution. The resin solutions are substantially free of cross-linking agents.
Photocurable adhesive composition
Provided is a method of manufacturing a liquid crystal panel employing a photocurable adhesive composition which causes no damage to adherends during bonding and which, when used in bonding rugged adherends, can bond the adherends without forming a gap therebetween. The photocurable adhesive composition of the inventive method comprises (A) 100 parts by mass of a urethane (meth)acrylate oligomer having a weight-average molecular weight of 20,000 to 100,000, (B) 5 parts to 70 parts by mass of a phenoxy resin, and (C) 0.1 parts to 10 parts by mass of a photopolymerization initiator. The uncured composition has a loss tangent (loss modulus/storage modulus) of less than 1 at 25° C. and the temperature at which the loss tangent of the uncured composition reaches 1 or more is 80° C. or less.
Aqueous polyglycidol synthesis with ultra-low branching
Disclosed herein are glycidol-based polymers, nanoparticles, and methods related thereto useful for a variety of applications, including, but not limited to, drug delivery. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.
IMPROVEMENTS IN OR RELATING TO STRUCTURAL ADHESIVES
The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.
POLYMER COMPRISING REPEATING UNITS CONSISTING OF A SUBSTITUTED PYRROLE RING AND PRODUCTS OBTAINED BY COMBINING SAID POLYMERS WITH CARBON ALLOTROPES
The present invention relates to a polymer comprising repeating units consisting of a substituted pyrrole ring. In particular, the repeating units consist of substituted pyrrole containing polar groups capable of interacting with carbon allotropes such as carbon nanotubes, graphene or nanographites, in order to improve the chemical-physical characteristics of the allotropes mainly by increasing their dispersibility and stability in liquid media and in polymer matrices. The invention also relates to products of addition of these polymers with carbon allotropes in order to obtain easily dispersible macromolecules.