Flame retardant coating formulation in the form of an aqueous dispersion comprising a binder, particles of a brominated polymeric flame retardant; and particles of at least one of magnesium hydroxide and aluminum trihydrate, wherein the aqueous dispersion is substantially free of antimony oxide. A process for preparing the formulation and a method of reducing the flammability of wood and wood products by coating them with the formulation are also provided.

Disclosed herein are glycidol-based polymers, nanoparticles, and methods related thereto useful for a variety of applications, including, but not limited to, drug delivery. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

The present disclosure relates to a thermosettable structural adhesive composition comprising an epoxy compound; a thermoplastic compound; an epoxy curing agent; at least one mineral filler, wherein the at least one mineral filler is capable of absorbing water. The thermosettable structural adhesive composition can exhibit an improved corrosion resistance while also providing good adhesive properties such as good t-peel strength and overlap shear strength.

An object of the present invention is to provide a resin composition having excellent heat resistance and excellent thermal adhesiveness, so as to provide an electric insulating sheet having excellent heat resistance. In order to achieve the aforementioned object, the present invention provides a resin composition which contains a polyether sulfone resin and a resin having a specific melt viscosity, and contains at least a phenoxy resin other than the polyether sulfone resin.

To provide a metal-fiber reinforced plastic composite material which exhibits favorable impregnation of a matrix resin into a reinforcing fiber substrate and favorable adhesion to metal members, and excellent mechanical properties. The metal-fiber reinforced plastic composite material is a laminate of a metal member and a fiber reinforced plastic, wherein the fiber reinforced plastic includes a reinforcing fiber substrate (A) and a thermoplastic resin composition (B), the thermoplastic resin composition (B) contains a phenoxy resin (B-1) and a polyamide resin (B-2) at a mass ratio (B-1)/(B-2) of 80/20 to 20/80, an adhesive strength of the thermoplastic resin composition (B) to a monofilament of the reinforcing fiber substrate (A) is 40 MPa or more as an interfacial shear strength at 23° C. in a microdroplet method, and an adhesive strength between the metal member and the thermoplastic resin composition (B) is 7.0 MPa or more as a tensile shear strength at 23° C.

A temporary adhesive includes: a polar resin of 5 wt % to 50 wt %, a first solvent of 30 wt % to 90 wt %, and a second solvent of 5 wt % to 60 wt %, wherein the polar resin includes at least one selected from a group consisting of a phenoxy resin, a poly(ether-ether-ketone) resin, a polycarbonate resin, a modified epoxy resin, or a polyolefin resin with a modified polar group; the first solvent is used to dissolve the polar resin; and the second solvent is used to improve a leveling property of the temporary adhesive.

Polyether diols characterized by a hydroxyl number of 56 or lower, high average functionality and high primary hydroxyl content are prepared by alkoxylating an unsaturated alcohol in multiple steps to form a polyether monol that contains 39% or more primary hydroxyl groups, and then reacting the polyether monol with a mercaptoalcohol that has a primary hydroxyl group.

A curable resin composition includes a polyether polyol resin represented by general formula (1) and having an epoxy equivalent of 7,000 to 100,000 g/eq, an epoxy resin having a functionality of 3 or more, and an epoxy resin curing agent. Provided is a curable resin composition that is excellent in heat resistance and also excellent in bending resistance in a well-balanced manner and that is applicable in various fields that require heat resistance and toughness, particularly, electrical and electronic fields.

##STR00001## n is an integer of 1 or more. A.sub.1 and A.sub.2 are each a divalent organic group having an aromatic structure and/or an alicyclic structure. B is a hydrogen atom or a glycidyl group.

An adhesive composition, containing an epoxy resin (A), an epoxy resin curing agent (B), a polymer component (C) and an inorganic filler (D), in which the inorganic filler (D) satisfies the condition (1) of (an average particle diameter (d50) is 0.1 to 3.5 μm) and condition (2) of (a ratio of a particle diameter at 90% cumulative distribution frequency (d90) to the average particle diameter (d50) is 5.0 or less), and a proportion of the inorganic filler (D) in a total content of the epoxy resin (A), the epoxy resin curing agent (B), the polymer component (C) and the inorganic filler (D) is 20 to 70% by volume; a film-like adhesive and a production method thereof; and a semiconductor package and a production method thereof.

The present disclosure provides nanostructure compositions and methods of producing nanostructure compositions. The nanostructure compositions comprise at least one population of nanostructures, at least one poly(alkylene oxide) ligand bound to the surface of the nanostructures, and optionally at least one organic resin. The present disclosure also provides nanostructure films comprising a nanostructure layer and methods of making nanostructure films.