A resin molded article includes an insert component and a synthetic resin member sealing the insert component. The insert component is provided by a primary molded product of a thermosetting resin, or a metal component, and has a functional group. The synthetic resin member is provided by a synthetic resin including a base polymer of a thermoplastic resin and a bonding component bonding with the functional group included in the insert component. The synthetic resin member has a sea structure formed of a continuous phase including the base polymer, and at least a part of the bonding component is present as a dispersed component in the sea structure. The dispersed component bonds with the functional group included in the insert component.

The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate.

A black-color polymer composite film comprising a phthalocyanine compound dispersed in a polymer selected from the group consisting of polyimide, polyamide, polyoxadiazole, polybenzoxazole, polybenzobisoxazole, polythiazole, polybenzothiazole, polybenzobisthiazole, poly(p-phenylene vinylene), polybenzimidazole, polybenzobisimidazole, and combinations thereof, wherein the phthalocyanine compound occupies a weight fraction of 0.1% to 50% based on the total polymer composite weight. Preferably, the phthalocyanine compound is selected from copper phthalocyanine, zinc phthalocyanine, tin phthalocyanine, iron phthalocyanine, lead phthalocyanine, nickel phthalocyanine, vanadyl phthalocyanine, fluorochromium phthalocyanine, magnesium phthalocyanine, manganous phthalocyanine, dilithium phthalocyanine, aluminum phthalocyanine chloride, cadmium phthalocyanine, chlorogallium phthalocyanine, cobalt phthalocyanine, silver phthalocyanine, a metal-free phthalocyanine, or a combination thereof.

Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.

A thermally insulating multilayer sheet for preventing thermal runaway includes a nonporous elastomeric barrier layer having a first and a second opposed surface; a flexible foam layer disposed on the first surface of the barrier layer; and a flame retardant component, wherein the flame retardant component is distributed within the flexible foam layer, contacts a surface of the flexible foam layer, or both.

A method of activating a surface of a plastics substrate formed from: (a) polyaryletherketone such as polyether ether ketone (PEEK) polyether ketone ketone (PEKK), polyether ketone (PEK); polyether ether ketone ketone (PEEKK); or polyether ketone ether ketone ketone (PEKEKK); (b) a polymer containing a phenyl group directly attached to a carbonyl group, for example polybutadiene terephthalate (PBT) optionally wherein the carbonyl group is part of an amide group, such as polyarylamide (PARA); (c) polyphenylene sulfide (PPS); or (d) polyetherimide (PEI); for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cm.sup.2 to about 300 J/cm.sup.2. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.

A method is provided for adhering prescribed adherend rubbers to one another using a rubber for adhesion obtained from a rubber composition for adhesion containing an ethylene--olefin copolymer (X2) and an organic peroxide (Y2) at the adhesion interface between the adherend rubbers. The ethylene--olefin copolymer (X2) contained in the rubber composition for adhesion contains an ethylene-1-butene copolymer. The ethylene-1-butene copolymer satisfies prescribed values of the number average molecular weight and the molecular weight distribution. The content of the ethylene-1-butene copolymer is from 60 to 100 mass % of the total mass of the ethylene--olefin copolymer (X2).

A curable material is disclosed for simultaneous filling of tolerances and for sealing of components to be bonded in aircraft construction.

The curable material can be made of fiber-reinforced plastic (CFRP). The curable material enables simultaneous structural adhesive bonding. The curable material can be based on two-component epoxy resin.

Expanded rubber articles and processes for making such, comprising: partially curing an expandable rubber formulation by heating it in a first mould cavity to form a moulded blank; releasing the moulded blank from the first mould cavity and allowing the moulded blank to expand to form an expanded moulded blank; and further curing and expanding the expanded moulded blank by heating it to form the expanded rubber article comprising an expanded rubber part, wherein the expanded moulded blank is heated in a second mould cavity. Optionally, the expanded moulded blank is contacted with a further rubber formulation and a substrate comprising a base material and an elastomer bonding layer in the second mould cavity to form an expanded rubber article additionally comprising a solid rubber part and a substrate.

The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a modified liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The modified liquid crystal polymer has a repeating unit represented by

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in which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4-biphenylene, Y is O or NH, and X is carboxamido, imido/imino, am idino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.