A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

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A resin composition includes 100 parts by weight of a maleimide resin; 20 parts by weight to 60 parts by weight of a benzoxazine resin; 5 parts by weight to 40 parts by weight of an epoxy resin; 120 parts by weight to 240 parts by weight of silica including spherical silica having a sediment volume of less than or equal to 0.4 mL/g and a particle size distribution D50 of less than or equal to 1.0 μm; and 0.5 part by weight to 1.6 parts by weight of an imidazole compound having a long-chain alkyl group, wherein the imidazole compound having a long-chain alkyl group includes octylimidazole, undecylimidazole, heptadecylimidazole or a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, ratio of thermal expansion, copper foil peeling strength, thermal resistance after moisture absorption, dissipation factor, amount of resin cluster and appearance of cooper-free circuit board.

The invention pertains to a layered high-void-fraction material comprising a composite surface layer comprising structural material and a polyester derived from an aliphatic polyol with 2-15 carbon atoms and an aliphatic polycarboxylic acid with 3 to 15 carbon atoms, wherein the surface layer is connected to a high-void-fraction layer of structural material. As compared to a high-void-fraction material without the composite surface layer, the material has, among others, improved surface properties, and improved bending stiffness, while insolation properties for both sound and heat are maintained. The material may be used, e.g., as insulating material, as filtration material, or in hydroponics.

An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of η′2/η′1 equal to 3 or less, wherein η′1 is an initial dynamic shear viscosity (Pa.Math.s) and η′2 is a maximum value of dynamic shear viscosity (Pa.Math.s), in a measurement of dynamic shear viscosity.

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin and 45 parts by weight to 75 parts by weight of an inorganic filler combination, wherein the inorganic filler combination at least includes chemically synthesized silica and silicon nitride, and a weight ratio of the chemically synthesized silica and the silicon nitride is between 1:2 and 5:2. The resin composition or an article made therefrom may achieve improvement in at least one of the following properties: dielectric constant, dissipation factor, peel strength, soldering resistance, T300 thermal resistance, laminate appearance, sedimentation property, water absorption rate, and ratio of thermal expansion.

A ballistic-resistant composite includes at least one layer that has a network of ballistic fibers and a resin matrix. The resin matrix includes blocked isocyanate that is composed of isocyanate bonded with a blocking agent. The resin matrix is cross-linkable by heating to a temperature that causes the isocyanate to liberate from the blocking agent and the liberated isocyanate to reactively cause cross-linking of the resin matrix.

A resin composition contains a maleimide compound (A), a phosphine oxide compound (B), and an epoxy compound (C). The maleimide compound (A) includes a maleimide compound (A1) having an alkyl group, of which a carbon number is equal to or greater than six, and/or an alkylene group, of which a carbon number is equal to or greater than six. The phosphine oxide compound (B) has a structure expressed by the following formula (b0), where X is a monovalent or divalent hydrocarbon group having at least one aromatic ring or an alkylene group and n is either 1 or 2.

A resin composition contains a curable resin. A minimum value (Min) of loss tangent (tanδ = E″/E′) of a cured product of the resin composition is equal to or greater than 0.04. The loss tangent is a ratio of a loss modulus (E″) of the cured product of the resin composition to a storage modulus (E′) thereof. The loss modulus (E″), the storage modulus (E′), and the loss tangent (tanδ = E″/E′) are obtained by dynamic mechanical analysis at a temperature equal to or higher than 100° C. and equal to or lower than 200° C.

A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), ##STR00001## (B-2) a repeating unit of formula (II), ##STR00002##
and (B-3) a repeating unit of formula (III), ##STR00003## R.sup.1 to R.sup.22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.