A thermoplastic composite comprising a thermoplastic polymer matrix comprising an amorphous polyester containing 1,4: 3,6-dianhydrohexitol units, an alicyclic diol and terephthalic acid, wherein diol component comprises 1,4:3,6-dianhydrohexitol and alicyclic diol in ratio from 0.32 to 0.75; and thermoplastic fibers comprising a semi-crystalline polyester containing 1,4: 3,6-dianhydrohexitol units, an alicyclic diol and terephthalic acid, wherein diol component comprises 1,4:3,6-dianhydrohexitol and alicyclic diol in ratio from 0.05 to 0.30 are disclosed. Methods for producing the polymer composite are also disclosed.

A sheetlike semifinished product comprising a matrix having at least one latent reactive plastics composition which is curable to afford an elastomer, in particular a thermoplastic elastomer, and fibers embedded in the matrix. A process for producing sheetlike semifinished products is further disclosed.

Presented are fiber-reinforced polymer (FRP) sandwich structures, methods for making/using such FRP sandwich structures, and motor vehicles with a vehicle component fabricated from a compression molded thermoset or thermoplastic FRP sandwich structure. A multidimensional composite sandwich structure includes first and second (skin) layers formed from a thermoset of thermoplastic polymer matrix, such as resin or nylon, filled with a fiber reinforcing material, such as chopped carbon fibers. A third (core) layer, which is encased between the first and second skin layers, is formed from a thermoset/thermoplastic polymer matrix filled with a fiber reinforcing material and a filler material, such as hollow glass microspheres. The first, second and third layers have respective rheological flow properties that are substantially similar such that all three layers flow in unison at a predetermined compression molding pressure. These layers may be formed from the same thermoset/thermoplastic polymer material, and include the same fiber reinforcing material.

A resin composition includes a core-shell rubber, a vinyl-containing benzoxazine resin and a maleimide resin, wherein the core-shell rubber has a core-shell ratio of 6.0:4.0 to 9.5:0.5. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one, more or all of the properties including dissipation factor, copper foil peeling strength (3 μm copper foil), ten-layer board T300 thermal resistance, ten-layer board glass transition temperature, ten-layer board delamination temperature, inner resin flow, and resin filling property of open area.

A Z-pin for increasing a delamination resistance of continuous fibre-reinforced polymer composites, formed of a composite material including a polymer matrix, and a plurality of fibres embedded in the polymer matrix and aligned along the length direction of Z-pin, the fibres having an elongation at break of at least 2% and a tensile strength of at least 5 GPa, the polymer matrix having an elongation at break equal to or greater than the elongation at break of the fibres, and a tensile strength of at least 120 MPa.

A composite material comprises a reinforcing material carried in a polymer matrix material which is the polymerization product of a polymerizable composition comprising a di-activated vinyl compound, with the proviso that the di-activated vinyl compound is not a cyanoacrylate. The reinforcing materials may be a wide variety of substrates including thermally sensitive materials. Exemplary composites can be molded and cured at ambient temperatures. Also disclosed are laminate materials having layered materials adhered by curing a di-activated vinyl polymerizable composition.

A resin composition includes a vinyl-containing polyphenylene ether resin and a prepolymer, wherein the prepolymer is prepared by prepolymerization of a mixture which at least includes a divinylbenzene, a triallyl compound and a diallyl isophthalate. An article made from the resin composition is also provided, which includes a prepreg, a resin film, a laminate or a printed circuit board. The article achieves improvements in at least one properties of glass transition temperature, copper foil peeling strength, dissipation factor, inner resin flow, melt viscosity, minimum dynamic viscosity, resin filling property in open area, and water resistance.

A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

A binder used for manufacturing a composite product is prepared by combining i) Maillard reactants selected from: reducing sugar reactant(s) and nitrogen-containing reactant(s); curable reaction product(s) of reducing sugar reactant(s) and nitrogen-containing reactant(s); and combinations thereof; and ii) a resin; reactants of a resin; and combinations thereof.

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.